This standard addresses semiconductor flip chip design requirements. Provides information for using standard semiconductor substrates, materials, assembly and test methods with established fabrication, bumping, test and handling practices. Electrical, thermal and mechanical chip design parameters and methodologies are covered in the standard, as well as the reliability aspects associated with these conditions and processes. The information applies to all new designs as well as modifications of non-flip chip designs. Developed by IPC and EIA. Preview the table of contents .pdf file.43 Pages. Released August 1999.Included in theIPC-C-106 and the IPC-C-1000 Collections.