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| IPC Specification Tree |
| Acceptance |
| Assembly |
| Materials |
| Cleaning |
| Process Support |
| Solderability |
| Lead Free |
| Components |
| Optoelectronics |
| Advanced Packaging |
| Cable and Wire |
| EHS/Management |
| Circuit Board Design & Fabrication: |
| Acceptance |
| Fabrication |
| Embedded |
| Design |
| Materials |
| Laminate |
| Interface Design |
| Interfaces |
Media Training: |
| Electronics Assembly |
| Defect and Photo Albums |
| Circuit Board Fabrication |
IPC-MI-660 contains background information, applicable specification references and industry-approved test methods for inspection and evaluation of incoming raw materials. Material categories include laminates, multilayer board materials, various interconnection substrates, resists and other coatings, processing chemicals, artwork, registration tools, accessories, soldering materials, tooling accessories, and other materials. Not available in electronic format. Released February 1984.
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