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IPC SM 784 Guidelines for Chip on Board Technology Implementation

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Price:
USD $62.00
ISBN/SKU #:
IPC-SM-784
Research Group:
IPC
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Summary

IPC-SM-784 discusses chip types, board selection, design issues and thermal transfer methods for Chip on Board (COB) applications. Details wire bonding, TAB and flip chip designs and provides information on mounting materials, including adhesives, wires and various mechanical bonding techniques. 37 pages. Released November 1990.

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