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| IPC Specification Tree |
| Acceptance |
| Assembly |
| Materials |
| Cleaning |
| Process Support |
| Solderability |
| Lead Free |
| Components |
| Optoelectronics |
| Advanced Packaging |
| Cable and Wire |
| EHS/Management |
| Circuit Board Design & Fabrication: |
| Acceptance |
| Fabrication |
| Embedded |
| Design |
| Materials |
| Laminate |
| Interface Design |
| Interfaces |
Media Training: |
| Electronics Assembly |
| Defect and Photo Albums |
| Circuit Board Fabrication |
This "best of" collection contains 71 of the best articles on all aspects of surface mount technology selected by a panel of industry experts. This handbook contains articles from a variety of sources on the following topics: general SMT overflow; packaging concepts; design considerations; packaging components; process materials; process considerations; quality assessments and reliability. It also contains bibliographic information on dozens of related articles. Not available in electronic format. 450 pages. Released 1991.
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