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- IPC TP 1115 Selection and Implementation Strategy for A Low Residue No Clean Process
- Category
- Industry Standards
- IPC Specification Tree
- Process Support
- IPC TP 1115 Selection and Implementation Strategy for A Low Residue No Clean Process
Summary
IPC-TP-1115 provides direction to electronics manufacturers interested in adopting low residue (LR) no-clean assembly technology. It addresses the concerns of transitioning from operations with post solder cleaning and no-clean using standard residue-level (SR) materials. Includes 13 technical papers and presentation materials from the IPC No-Clean Conference. 120 pages.
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