Loading... Please wait...
Intelligent Path to Competitiveness!
| IPC Specification Tree |
| Acceptance |
| Assembly |
| Materials |
| Cleaning |
| Process Support |
| Solderability |
| Lead Free |
| Components |
| Optoelectronics |
| Advanced Packaging |
| Cable and Wire |
| EHS/Management |
| Circuit Board Design & Fabrication: |
| Acceptance |
| Fabrication |
| Embedded |
| Design |
| Materials |
| Laminate |
| Interface Design |
| Interfaces |
Media Training: |
| Electronics Assembly |
| Defect and Photo Albums |
| Circuit Board Fabrication |
- Category
- Industry Standards
- IPC Specification Tree
- IPC TR 465 2 The Effect of Steam Aging Time and Temperature on Solderability Test Results
- Category
- Industry Standards
- IPC Specification Tree
- Solderability
- IPC TR 465 2 The Effect of Steam Aging Time and Temperature on Solderability Test Results
Summary
IPC-TR-465-2 details the results of a two-year study to determine the effect of steam aging exposure on components. IPC-TR-465-2 concludes that 98°C for 8 hours is the optimal condition for industry specifications for both component leads and printed boards. Not available in electronic form. 51 pages. Released July 1993.
Find Similar Products by Category
Currency Converter
Choose a currency below to display product prices in the selected currency.
Add to Wish List
You Recently Viewed...
All prices are in USD. Copyright 1997-2012 Electronics.ca Publications.
|
Electronics.ca™ is a global research network serving the industry, corporations and investment banks. |
