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| IPC Specification Tree |
| Acceptance |
| Assembly |
| Materials |
| Cleaning |
| Process Support |
| Solderability |
| Lead Free |
| Components |
| Optoelectronics |
| Advanced Packaging |
| Cable and Wire |
| EHS/Management |
| Circuit Board Design & Fabrication: |
| Acceptance |
| Fabrication |
| Embedded |
| Design |
| Materials |
| Laminate |
| Interface Design |
| Interfaces |
Media Training: |
| Electronics Assembly |
| Defect and Photo Albums |
| Circuit Board Fabrication |
IPC-TR-551 test report is a compendium of technical methods and techniques used for evaluating the quality aspects of present and future interconnection products and electronic assemblies. The handbook addresses base materials, conductor physical requirements, internal planes, construction, registration, plated through-holes, component mounting areas, cleaning evaluation, solder mask, and printed board electrical requirements. 104 pages. Released July 1993.
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