Loading... Please wait...Intelligent Path to Competitiveness!
| Media Training: |
| Electronics Assembly |
| Defect and Photo Albums |
| Circuit Board Fabrication |
| IPC Specification Tree |
| Acceptance |
| Assembly |
| Materials |
| Cleaning |
| Process Support |
| Solderability |
| Lead Free |
| Components |
| Optoelectronics |
| Advanced Packaging |
| Cable and Wire |
| EHS/Management |
| Circuit Board Design & Fabrication: |
| Acceptance |
| Fabrication |
| Embedded |
| Design |
| Materials |
| Laminate |
| Interface Design |
| Interfaces |
Innerlayer handling is the primary cause of multilayer defects. This series of programs explain the theory of each process and identifies all of the common handling errors that can affect the quality of the final product.
DVD-81: Innerlayer Handling Series, Part 1: Incoming Inspection
DVD-82: Innerlayer Handling Series, Part 2: Pre-Image Cleaning
DVD-83: Innerlayer Handling Series, Part 3: Resist Lamination
DVD-84: Innerlayer Handling Series, Part 4: Imaging
DVD-85: Innerlayer Handling Series, Part 5: Developing
DVD-86: Innerlayer Handling Series, Part 6: Etch/Strip
DVD-87: Innerlayer Handling Series, Part 7: Lamination
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