Loading... Please wait...Intelligent Path to Competitiveness!
| Media Training: |
| Electronics Assembly |
| Defect and Photo Albums |
| Circuit Board Fabrication |
| IPC Specification Tree |
| Acceptance |
| Assembly |
| Materials |
| Cleaning |
| Process Support |
| Solderability |
| Lead Free |
| Components |
| Optoelectronics |
| Advanced Packaging |
| Cable and Wire |
| EHS/Management |
| Circuit Board Design & Fabrication: |
| Acceptance |
| Fabrication |
| Embedded |
| Design |
| Materials |
| Laminate |
| Interface Design |
| Interfaces |
Third in a series of seven videos, DVD-83 covers setup for speed, pressure, heat, registration, then explores typical factors that create exposure or resist adhesion problems, such as improper cleaning, contamination, fingerprints, oxidation, and foreign particles. Also explains the effects of bubbles, wrinkles, scratches, gouges, dents, resist chips, and roller imperfections. Discusses the role of protective clothing, trimming, and visual inspection. Time: 32 minutes.
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