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| Media Training: |
| Electronics Assembly |
| Defect and Photo Albums |
| Circuit Board Fabrication |
| IPC Specification Tree |
| Acceptance |
| Assembly |
| Materials |
| Cleaning |
| Process Support |
| Solderability |
| Lead Free |
| Components |
| Optoelectronics |
| Advanced Packaging |
| Cable and Wire |
| EHS/Management |
| Circuit Board Design & Fabrication: |
| Acceptance |
| Fabrication |
| Embedded |
| Design |
| Materials |
| Laminate |
| Interface Design |
| Interfaces |
DVD-84C Part four of the Innerlayer Handling series analyzes the theory of the print & etch innerlayer imaging operation and provides an overview of each of the processing steps in typical multilayer fabrication. Explains diazo and silver halide phototools, various tooling arrangements, light collimation and deflection, image enlargement, integrator theory, and the step tablet calibration process. Also covers standard operating procedures, the importance of cleanliness and air filtration, the effects of dust and other airborne contaminants, protective clothing, fingerprint contamination, resist particles, preventive cleaning techniques, static problems and ionization theory, wear and tear on phototools and tooling holes, scratches in exposure surfaces, and the function of the cover sheet. Time: 41 minutes.
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