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| Media Training: |
| Electronics Assembly |
| Defect and Photo Albums |
| Circuit Board Fabrication |
| IPC Specification Tree |
| Acceptance |
| Assembly |
| Materials |
| Cleaning |
| Process Support |
| Solderability |
| Lead Free |
| Components |
| Optoelectronics |
| Advanced Packaging |
| Cable and Wire |
| EHS/Management |
| Circuit Board Design & Fabrication: |
| Acceptance |
| Fabrication |
| Embedded |
| Design |
| Materials |
| Laminate |
| Interface Design |
| Interfaces |
DVD-87C Seventh and final video in the Innerlayer Handling Series details pin registration lay-up and lamination processes, and explains the step-by-step sequence of laying up a typical multilayer panel. Proper handling of caul plates, separator plates, copper foil, prepreg sheets and innerlayers is described. The lamination section examines three different types of vacuum press systems: vacuum enclosed presses, vacuum frames and turkey bag systems. Also contains a description of the process for mass lamination and a brief discussion of automatic optical inspection (AOI) and surface treatment operations. Time: 28 minutes.
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