The global Smartphone industry has entered into a fast growth phase. In 2010, the shipment volume of the global Smartphone industry topped 290.0 million units, one third of which were made by Taiwanese manufacturers. It is anticipated that global Smartphone shipment volume will hit approximately 450 million units in 2011, up around 55% compared to 2010. Global Smartphone shipment value is expected to break US$100 billion mark. Apple and HTC Smartphones are both manufactured by Taiwanese makers, which normally shoulder around 90% of the total Taiwanese Smartphone industry shipment. This report profiles the current status of high value-added components used for Smartphones and provides insight into the Taiwanese Smartphone high value-added components industry.

List of Topics 

Profiling the Smartphone high value-added components industry, comprising of components that are already supplied by Taiwanese manufacturers in the areas of small- and medium-sized panels, foundry service, and passive components and of components in the areas of application processor, baseband IC, integrated application processor/baseband IC solution, Bluetooth/Wi-Fi/GPS, NAND flash memory and Mobile DRAM where Taiwanese manufacturers' contribution still remains insignificant.
    
Companies and organizations analyzed or mentioned in the report include:

Broadcom, Chimei Innolux, Elpida, Fujitsu, GlobalFoundries, Hitachi, HTC, Hynix, Icera, Inotera Technology, Intel, Kyocera Display, Lenovo, LG, LGD, Macronix, Mediatek, Micron, Motorola, Murata Manufacturing Co., Nanya Technology, NEC, NTT DoCoMo, Nvidia, Panasonic, Powerchip, ProMOS, Qualcomm, Renesas, Rexchip, Samsung, SEMCO, Sharp, SMD, Sony, Taiyo Yuden, Texas Instruments, TMD, Toshiba, TSMC, UMC, VIA Telecom, Winbond Electronics, Yageo

TABLE OF CONTENTS

1. Smartphone High Value-added Components and Their Shipment Share
 
2. Smartphone High Value-added Component Industry Profiles
 2.1 Components Yet to be Supplied by Taiwanese Manufacturers
 2.1.1 Application Processor
 2.1.2 Baseband IC
 2.1.3 Integrated Application Processor and Baseband IC Solution
 2.1.4 Bluetooth/Wi-Fi/GPS
 2.1.5 NAND Flash Memory
 2.1.6 Mobile DRAM
 2.2 Components Currently Supplied by Taiwanese Manufacturers
 2.2.1 Small- and Medium-sized Panels
 2.2.2 Foundry Service
 2.2.2.1 Competing over Apple A6 Processor Order
 2.2.2.2 TSMC's Challenges in Placement of A6 Processor Orders
 2.2.3 Passive Components

 3. Conclusion
 Appendix
 
 List of Figures  
 Figure 1 Taiwanese Smartphone High Value-added Component Industry Ecosystem