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Integrated Circuit (IC) Economics Report

Price:
USD $1,500.00
ISBN/SKU #:
ICK2IE
Research Group:
IC Knowledge
Date of Publication:
August 2011
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Summary

The 2011 IC Economics report is a comprehensive overview of the economics of Integrated Circuit manufacturing and the IC industry in general. The product is designed to provide a broad understanding of Integrated Circuit manufacturing costs and presents a great deal of benchmarking data. A high level discussion of the economics of the IC industry with market and cost trends is also included. This product is not a cookbook for cost calculations. If you want to calculate product costs we recommend the IC Cost and Price Model.

This product is designed to serve the needs of anyone who is interested in understanding the manufacturing costs of integrated circuits.

Do you:

  • Purchase or market ICs, market IC processing equipment, follow IC companies stocks, develop new processes or work at a Fabless IC company and want to understand IC manufacturing economics?
  • Manage an IC manufacturing operation and want to benchmark your company against others?

If you answered yes to any of the questions above, then this product is for you.

TABLE OF CONTENTS

1 Introduction                                                                         

2 IC Market Status and Trends   
                              

    2.1    Worldwide semiconductor revenue trend                 
    2.2    Detailed 2011 IC forecast                             
    2.3    The status of the recovery                            
    2.4    Semiconductor revenue by region                       
    2.5    Semiconductor revenue by end use                      
    2.6    Semiconductor revenue by product                      
    2.7    Top 10 semiconductor companies                        
    2.8    Further reading                                       
    2.9    References                                            


3 Capital and Materials Spending   
  
                       
    3.1    Capital spending analysis                             
    3.2    Semiconductor materials market                        
    3.3    References                                            

4 Economics Trends   
                                       
    4.1    Introduction                                          
    4.2    Product pricing trends                                
    4.3    Product cost trend                                    
    4.4    Fabrication facility cost trends                      
    4.5    Effect of utilization on profitability                
    4.6    Profit and loss trends                                
    4.7    Leasing trends                                        
    4.8    R&D spending                                          
    4.9    Fabs - build or buy and where to build                
    4.10   Memory trends                                         
    4.11   References                                            

5 300mm and 450mm 
        
                                  
    5.1    Introduction                                          
    5.2    300mm status                                          
    5.3    300mm fab costs                                       
    5.4    300mm ramp versus 200mm ramp                          
    5.5    Revenue required to support a 300mm fab               
    5.6    300mm cost savings                                    
    5.7    300mm strategies and impact for leading semiconductor companies  
    5.8    300mm analog fabs                                                 
    5.9    450mm                                                             
    5.10   Further information                                               
    5.11   References                                                        

6 Foundries                           
                                  
    6.1    Introduction                                                      
    6.2    The genesis of the pure play foundry                              
    6.3    The growth years                                                  
    6.4    The foundry model                                                 
    6.5    Utilization effects on the foundry model                          
    6.6     Foundry yields                                                   
    6.7     Technology transitions                                           
    6.8    Average Selling Prices                                            
    6.9    Shake-up in the foundry landscape                                 
    6.10   What do these trends mean for the future of foundries?            
    6.11   References                                                        

7 Design                   
                                             
    7.1    Introduction                                                      
    7.2    Design productivity                                               
    7.3    Factors influencing design productivity                           
    7.4    Design costs                                                      
    7.5    Mask costs                                                        
    7.6    Design issues at 90nm and 65nm                                    
    7.7    Design issues at 32nm and 28nm                                    
    7.8    Conclusion                                                        
    7.9    References                                                        

8 Integrated Circuit Manufacturing Overview              
               
    8.1    Silicon wafer manufacturing                                       
    8.2    Wafer fabrication                                                 
    8.3    Cleanroom technology                                              
    8.4    Electrical tests                                                  
    8.5    Packaging                                                         
    8.6    References                                                        

9 Wafer Fabrication Costs            
                
                   
    9.1    Accounting categories and cost map                                
    9.2    Material costs                                                    
    9.3    Direct labor costs                                                
    9.4    Capital costs                                                     
    9.5    Indirect labor costs                                              
    9.6    Toolset repair costs                                              
    9.7    Monitor wafer costs                                               
    9.8    Facilities costs                                     
    9.9    Consumable items costs                               
    9.10   Unyielded wafer cost trends                          
    9.11   Wafer yields                                         
    9.12   Yielded Wafer costs                                  
    9.13   Additional resources                                 
    9.14   References                                           

10 Test and Packaging Costs                 
                
    10.1   Test costs                                           
    10.2   Packaging                                            
    10.3   Additional resources                                 
    10.4   References                                           

11 Die Yield and Product Costs           
                   
    11.1   Gross die per wafer                                  
    11.2   Defect density concept                               
    11.3   Yield models                                         
    11.4   Defect density trends                                
    11.5   Recommended defect densities                         
    11.6   Yield Trends                                         
    11.7   Product cost examples                                
    11.8   Additional resources                                 
    11.9   References                                           

12 Cycle Time and Utilization      
                       
    12.1   Definitions                                          
    12.2   OEE is wrong                                         
    12.3   Economic value of cycle time                         
    12.4   Managing cycle time                                  
    12.5   Cost of ownership                                    
    12.6   Equipment uptime                                     
    12.7   How the factory effects cost                         
    12.8   Throughput benchmarks                                
    12.9   References                                           

13 Technology Trends                  
                   
    13.1   Transistors per IC                                   
    13.2   Die size                                             
    13.3   Photolithography trends                              
    13.4   MOSFET scaling                                       
    13.5   Strain engineering                                   
    13.6   Gate oxide scaling and high-k gate oxides            
    13.7   SOI                                                  
    13.8   Interconnect                                         
    13.9   DRAM technology                                      
    13.10   Flash Technology                                     
    13.11   Conclusion                                           
    13.12   References                                           

14 Glossary                                                         


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Additional Information

Number of pages: 206









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