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Mechanical Outline Standard for Flip Chip and Chip Size Configurations

Image 1
Price:
USD $52.00
ISBN/SKU #:
IPC-J-STD-027
Research Group:
IPC
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Summary

IPC-J-STD-027 standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface, die terminals, and interconnection balls-bumps-lands to the next level. 13 Pages. Released February 2003. Preview the table of contents .pdf file. Included in the E-500 Collection

Additional Information

Number of Pages: 13

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