The semiconductor industry is entering an operationally driven era that represents a new set of challenges both technical and economic. Both the device and capital equipment manufacturers must change the way they approach these challenges to remain competitive. It is no longer sufficient to modify strategy and products from the previous technology-driven era. There needs to be some fundamental changes to the approach. The companies that successfully accomplish this will be the new emerging market leaders. This report offers a complete analysis of the Process Control market, segmented as: Lithography Metrology; Wafer Inspection/Defect Review; Thin Film Metrology; and Other Process Control Systems. Each of these sectors is further segmented. Market shares of competitors for all segment is presented.

TABLE OF CONTENTS

Chapter 1   Introduction                                  

Chapter 2   Executive Summary                             

Chapter 3   Metrology/Inspection Technologies             

3.1   Introduction                                        
3.2   Imaging Techniques                                   
      3.2.1 Scanning Electron Microscope (SEM)             
      3.2.2 Transmission Electron Microscope (TEM)        
3.3   Scanning Probe Microscopes                           
      3.3.1 Atomic Force Microscopy (AFM)                  
      3.3.2 Scanning Tunneling Microscopy (STM)            
      3.3.3 Scanning Probe Microscopy (SPM)                
      3.3.4 AFM Types                                      
            3.3.4.1 Contact AFM                            
            3.3.4.2 Dynamic Force Mode AFM Techniques      
      3.3.5 Scanning Surface Potential Microscopy (SSPM)  
3.4   Optical Techniques                                   
      3.4.1 Scatterometry                                  
            3.4.1.1 Ellipsometry                           
            3.4.1.2 Reflectometry                          
            3.4.1.3 Scatterometry Developments             
      3.4.2 Total Reflection X-Ray Fluorescence (TXRF)     
      3.4.3 Energy Dispersive X-Ray Analysis (EDX)         
      3.4.4 Secondary Ion Mass Spectrometry (SIMS)         
            3.4.4.1 Surface Imaging Using SIMS             
            3.4.4.2 SIMS Depth Profiling                   
      3.4.5 Auger Electron Spectroscopy                    
      3.4.6 Focused Ion Beam (FIB)                                                      
      3.4.7 X-Ray Reflectometry (XRR)                         
      3.4.8 X-Ray Photoelectron Spectroscopy (XPS)            
      3.4.9 Rutherford Backscattering (RBS)                   
      3.4.10 Optical Acoustics Metrology                      
      3.4.11 Fourier Transform Infrared Spectroscopy (FTIR)   
      3.4.12 Thermally-Induced Voltage Alteration (TIVA)     
3.5   Film Thickness And Roughness                            
      3.5.1 Surface Inspection Technology                     
      3.5.2 Dimensional Technology                            
      3.5.3 Stylus Profilometer                              

Chapter 4   Defect Review/Wafer Inspection                   

4.1   Introduction                                           
4.2   Defect Review                                           
      4.2.1 SEM Defect Review                                 
      4.2.2 Optical Defect Review                             
      4.2.3 Other Defect Review                              
4.3   Patterned Wafer Inspection                              
      4.3.1 E-Beam Patterned Wafer Inspection                 
      4.3.2 Optical Patterned Wafer Inspection               
4.4   Unpatterned Wafer Inspection                           
4.5   Macro-Defect Inspection                                

Chapter 5   Thin Film Metrology

5.1   Introduction                                            
      5.1.1 Front End Applications                            
      5.1.2 Back End Applications                            
5.2   Metal Thin-Film Metrology                              
5.3   Non-Metal Thin-Film Metrology                          
5.4   Substrate Metrology                                     
                                    
Chapter 6   Lithography Metrology                                  

6.1   Overlay                                                      
6.2   CD                                                           
6.3   Mask (Reticle) Metrology/Inspection                          

Chapter 7   Market Forecast                                        

7.1   Introduction                                                 
7.2   Market Forecast Assumptions                                  
7.3   Market Forecast                                               
      7.3.1 Total Process Control Market Forecast                   
      7.3.2 Lithography Metrology Market Forecast                   
            7.3.2.1 Overlay Market Forecast                         
            7.3.2.2 CD Measurement Market Forecast                  
            7.3.2.3 Mask Inspection Market Forecast                 
            7.3.2.4 Mask Metrology Market Forecast                  
      7.3.3 Wafer Inspection / Defect Review Market                 
            7.3.3.1 Patterned Wafer Inspection Market Forecast      
                   o E-Beam Patterned Wafer Inspection Market Forecast                                       
                   o Optical Patterned Wafer Inspection Market Forecast                                      
            7.3.3.2 Defect Review Market Forecast                   
                   o SEM Defect Review Market Forecast              
                   o Optical Defect Review Market Forecast          
                   o Other Defect Review Market Forecast            
            7.3.3.3 Unpatterned Wafer Inspection Market Forecast   
            7.3.3.4 Macro Defect Detection Market Forecast          
      7.3.4 Thin Film Metrology Market Forecast                    
            7.3.4.1 Non-Metal Thin Film Metrology Market Forecast   
                   o Non-Metal Standalone Thin Film Metrology Market Forecast                                
                   o Non-Metal Integrated Thin Film Metrology Market Forecast                               
            7.3.4.2 Substrate / Other Thin Film Metrology Market Forecast                                       
      7.3.5 Other Process Control Systems Market Forecast         

Chapter 8   Integrated/In-Situ Metrology/Inspection Trends        

8.1   Introduction                                                
8.2   In-Situ Metrology                                           
8.3   Integrated Metrology                                         
      8.3.1 Benefits                                               
      8.3.2 Limitations                                           

Chapter 9   Key Drivers                                           

9.1   300mm/450mm Wafers                                          
9.2   Copper Metrology                                            
9.3   Low-K Dielectrics                                           
9.4   Chemical Mechanical Planarization (CMP)                     
9.5   Ion Implant                                                  
                                    
LIST OF TABLES
                                                                 
3.1    Comparison Of Derivative AFM Techniques                   
5.1    Comparison Of White-Light With Multiple-Angle Laser
       Ellipsometry                                              
7.1    Total Process Control Market Forecast                     
7.2    Lithography Metrology Market Forecast                     
7.3    Overlay Market Forecast                                   
7.4    CD Measurement Market Forecast                            
7.5    Mask Inspection Market Forecast                           
7.6    Mask Metrology Market Forecast                            
7.7    Wafer Inspection / Defect Review Market Forecast          
7.8    Patterned Wafer Inspection Market Forecast                
7.9    E-Beam Patterned Wafer Inspection Market Forecast         
7.10   Optical Patterned Wafer Inspection Market Forecast        
7.11   Defect Review Market Forecast                             
7.12   SEM Defect Review Market Forecast                         
7.13   Optical Defect Review Market Forecast                     
7.14   Other Defect Review Market Forecast                       
7.15   Unpatterned Wafer Inspection Market Forecast              
7.16   Macro Defect Detection Market Forecast                    
7.17   Thin Film Metrology Market Forecast                       
7.18   Non-Metal Thin Film Metrology Market Forecast             
7.19   Non-Metal Standalone Thin Film Metrology Market Forecast  
7.20   Non-Metal Integrated Thin Film Metrology Market Forecast  
7.21   Substrate / Other Thin Film Metrology Market Forecast     
7.22   Other Process Control Systems Market Forecast             
9.1    Dielectric Film Challenges                                 
                                   
LIST OF FIGURES
                                                          
3.1    Schematic Of Scanning Electron Microscope           
3.2    Schematic Of Transmission Electron Microscope       
3.3    Schematic Of Atomic Force Microscopy                
3.4    Schematic Of Scanning Tunneling Microscopy          
3.5    Interaction Between Two Atoms In AFM                
3.6    Schematic Of Lateral Force Microscopy               
3.7    Schematic Of Dynamic Force Mode AFM                 
3.8    Schematic Of Scanning Surface Potential Microscopy  
3.9    Principle Of Scatterometry                          
3.10   Schematic Of Ellipsometer                           
3.11   Principles Of CD Scatterometry                      
3.12   Conventional TXRF Analysis Geometry                 
3.13   Schematic Of Secondary Ion Mass Spectrometry        
3.14   Principle Of Auger Electron Emission                
3.15   Schematic Of Auger Electron Spectroscopy            
3.16   Schematic Of Focused Ion Beam Technology            
3.17   Schematic Of X-Ray Reflectometry                    
3.18   Schematic Of X-Ray Photoelectron Spectroscopy       
3.19   Schematic Of Rutherford Backscattering              
3.20   Schematic Of Optical Acoustics Metrology            
3.21   Spatial Wavelength Of Nanotopography                
3.22   Schematic Of Non-Contact Capacitive Gauging         
3.23   Schematic Of Stylus Profilometer                    
5.1    Thin Film Metrology Challenges                      
5.2    Spectroscopic Ellipsometry Diagram                  
6.1    ITRS Overlay Technology Roadmap                     
6.2    NIST Line Edge Roughness Model                      
6.3    ITRS Metrology Roadmap                              
6.4    Schematic Of OCD Optics                             
6.5    Microlithography Process And Measurements                                              
7.1    Total Process Control Market Forecast                          
7.2    Total Process Control Market By Geographic Region              
7.3    Total Process Control Market Vs. Overall Equipment
       Market 1995-2012                                               
7.4    Lithography Metrology Market Shares - 2010                     
7.5    Overlay Market Shares - 2010                                   
7.6    CD Measurement Market Shares - 2010                            
7.7    Mask Inspection Market Shares - 2010                           
7.8    Mask Metrology Market Shares - 2010                            
7.9    Wafer Inspection / Defect Review Market Shares ­ 2010          
7.10   Patterned Wafer Inspection Market Shares - 2010                
7.11   E-Beam Patterned Wafer Inspection Market Shares - 2010         
7.12   Optical Patterned Wafer Inspection Market Shares - 2010        
7.13   Defect Review Market Shares - 2010                             
7.14   SEM Defect Review Market Shares - 2010                         
7.15   Optical Defect Review Market Shares - 2010                     
7.16   Other Defect Review Market Shares - 2010                       
7.17   Unpatterned Wafer Inspection Market Shares - 2010              
7.18   Macro Defect Detection Market Shares - 2010                    
7.19   Thin Film Metrology Market Shares - 2010                       
7.20   Non-Metal Thin Film Metrology Market Shares - 2010             
7.21   Non-Metal Standalone Thin Film Metrology
       Market Shares - 2010                                           
7.22   Non-Metal Integrated Thin Film Metrology Market Shares - 2010  
7.23   Substrate / Other Thin Film Metrology Market Shares - 2010     
7.24   Other Process Control Systems Market Shares - 2010             
7.25   Other Process Software Market Shares - 2010                    
8.1    Integrated Control In A Fab                                    
9.1    Polish Endpoint Control