Loading... Please wait...Intelligent Path to Competitiveness!
| Media Training: |
| Electronics Assembly |
| Defect and Photo Albums |
| Circuit Board Fabrication |
| IPC Specification Tree |
| Acceptance |
| Assembly |
| Materials |
| Cleaning |
| Process Support |
| Solderability |
| Lead Free |
| Components |
| Optoelectronics |
| Advanced Packaging |
| Cable and Wire |
| EHS/Management |
| Circuit Board Design & Fabrication: |
| Acceptance |
| Fabrication |
| Embedded |
| Design |
| Materials |
| Laminate |
| Interface Design |
| Interfaces |
DVD-28 examines the procedure for preparing microsections using manual techniques for the critical grinding and polishing steps and provides a thorough examination of the microsection process steps, including coupon removal, thermal stressing, mounting, grinding, polishing, and etching the specimen. Time: 27 minutes.
Choose a currency below to display product prices in the selected currency.