Historically developed for MEMS & SOI substrates, wafer bonding technology is today becoming a key processing technology for a wide range of applications: MEMS, CMOS Image Sensors, LEDs, Power Devices, RF and Advanced Packaging.

The wafer bonding market is very complex, crossing different wafer sizes (from 2’’ to 12’’), different applications (Advanced Substrates such as SOI, MEMS, LEDs, CMOS Image Sensors, Power Devices, RF Devices & Advanced Packaging) and different bonding technologies (Adhesive, Anodic, Fusion, Direct Oxide, Eutectic, Glass Frit, Metal Diffusion).

This report provides a vision of what the wafer bonding technologies will become over the 2010-2016 time line.

MARKET TRENDS

Wafer bonding is usually defined as a process that temporarily or permanently joins two wafers or substrates using a suitable process. Historically developed for MEMS and then SOI wafers, wafer bonding technology has shifted to specific IC applications in recent years. This report aims at analyzing the market perspectives and technical trends for permanent bonding.

MEMS has been the first application where wafer bonders have been massively used (the wafer bonding step is mostly used to protect the MEMS sensitive element). And CMOS Image Sensors is also a very promising application for wafer bonders. Indeed, up to two different wafer bonding steps can be necessary for next-generation CMOS Image Sensors: one for Back-Side Illumination and the second for WLCSP.

But besides MEMS and CIS, wafer bonding can be also used for LEDs or Power Devices. Indeed, in a typical LED active region, spontaneous emission scatters photons in all directions. If the substrate material has a smaller band gap than the active region, approximately half of the light is absorbed in the substrate; significantly reducing device performance. So, one of the manufacturing solutions for photon loss involves bonding a wafer containing an array of devices to another wafer that provides both a reflective surface for maximum light extraction and a heat sink for thermal management. And of course, over the 5 past years, much attention has been given to this technology for 3D integration of memories for example.

TECHNICAL TRENDS

For MEMS, there is today a shift from Glass Frit for eutectic/metal-based bonding mainly to increase real estate by smaller bond frames. Metal direct bonding also gives good hermeticity and mechanical stability for many MEMS applications. For example, Nasiri process is using eutectic bonding of the MEMS directly on the aluminum layer of the CMOS wafer. This leads to smaller package footprints & package heights. STMicroelectronics’ latest 3-axis accelerometer (LIS3DH) also shows a different sealing technique compared to what is usually done: gold eutectic sealing allows a dramatic die size reduction.

For CMOS Image sensors, the advent of the BSI (Back Side Illumination) technology has raised a competition between Molecular Bonding and adhesive bonding. Here, cost and final application will drive the technology final choice.

Analysts foresee that the wafer bonder will have substantial growth in the forecast period. The growth will be driven small size wafer for LEDs and 12” wafer for 3D stacking and CIS.

Although EVGroup is market leader in permanent bonding, the growth of the bonding equipment market is attracting challengers.

KEY FEATURES OF THE STUDY

The report will analyze in detail the technical & economic evolution of the permanent wafer bonding process. It will give:

–    2010-2016 Market Forecasts for permanent bonding in MUS$ value and number of equipment

    •    By technology (Adhesive, Anodic, Fusion, Eutectic, Glass Frit, Direct Bonding …)
    •    By application (MEMS, CMOS Image Sensors, LEDs, RF, Power, 3D TSV, SOI)
    •    By wafer size

–    Overview of the different bonding approaches, e.g.:

    •    Thermo-Compression
    •    Direct Oxide / Molecular / Fusion
    •    Glass Frit
    •    Metal Eutectic / Solder
    •    Polymer / Adhesive
    •    Anodic
    •    Hybrid bonding Metal/polymer , micro bumping & Metal/oxide

–    Trends for permanent bonding
–    W2W vs. C2W analysis for 3D integration
–    Description of the applications for wafer bonding with main characteristics, challenges
–    Equipment players market shares and competitive information

WHO SHOULD BUY THIS REPORT ?

-    Wafer bonder manufacturers

    o    Identify and evaluate permanent bonding markets with market size, growth and key customers
    o    Analyze the threads and opportunities
    o    Monitor and benchmark your competitor’s advancements

-    Foundries & chip manufacturers

    o    Get an overview of the large panel of accessible permanent wafer bonding technologies
    o    Spot the important permanent wafer bonding technologies in the future for your application

-    Financial & Strategic investors

    o    Understand the main market dynamics and main technological trends
    o    Get the list of the key players

COMPANIES MENTIONED IN THE REPORT

Acreo, AML, APM/UMC, Avago, Ayumi, Bosch, Colibrys, Dalsa, Discera, EVGroup, FhG IMS, FLIR, IBM, Icemos, IMEC, IMT, Infineon, Invensense, KTH, Leti, Lumileds, MEMStech, Micralyne, Mitsubishi Heavy Industries, Okmetic, Omron, Osram, Qualcomm, Raytheon, RPI, Sand9, Semefab, Sensonor, Silex, SOITEC, STM, SUSS MicroTEC, Tezzaron, TI, tMt, Tohoku University, TowerJazz, Tracit, Triquint, Tronic’s, TSMC, VTI, Xcom, Ziptronix

KEY FEATURES OF THE STUDY

The report will analyze in details the technical & economical evolution of the permanent wafer bonding process.

It will give:

– 2010-2016 Market Forecasts for permanent bonding in MUS$ value and number of equipment

    Per technology (Adhesive, Anodic, Fusion, Eutectic, Glass Frit, Direct Bonding …)
    Per applications (MEMS, CMOS Image Sensors, LEDs, RF, Power, 3D TSV, SOI)
    Per wafer size

– Overview of the different bonding approaches, e.g.:

    Thermo-Compression
    Direct Oxide / Molecular / Fusion
    Glass Frit
    Metal Eutectic / Solder
    Polymer / Adhesive
    Anodic
    Hybrid bonding Metal/polymer , micro bumping & Metal/oxide

– What the trends for permanent bonding are

– W2W vs. C2W analysis for 3D integration

– Description of the applications for wafer bonding with main characteristics, challenges

– Equipment players market shares and competitive information

TABLE OF CONTENTS

    Wafer Bonding definition
    Our approach.6

    Wafer bonding overview
        Devices 7
        Function .8
        Technologies .9

    Executive Summary
        Overview . 12
        Market drivers  13
        Type of bonding by application  15
        Permanent wafer bonders forecast in $M  17
        Bonded wafers forecast by wafer size  18
        Trends in MEMS permanent bonding . 19
        Trends in CIS permanent bonding . 24
        Trends in 3D TSV permanent bonding  26
        Trends in LEDs permanent bonding  27
        Trends in SOI permanent bonding . 29

    Wafer bonding market forecasts in $M & units
        By application . 33
        In number of wafers  34
        By technology  35
        Equipment forecast by application . 39
        Equipment forecast by wafer size . 40
        Equipment forecast by technology  41

    Permanent bonders company profiles
        Market share  48
        AML . 49
        AST  50
        Ayumi . 51
        EVGroup . 53
        SUSS microTec . 55

    Permanent bonding
        Tools characteristics 58
        Technologies . 59
        Pros & cons by type of bonding . 62
        Cost analysis . 64
        Direct bonding . 65
        Hybrid bonding  70
        Indirect bonding 83
        Wafer bonding requirements . 87
        Alignment accuracy methods  88

    Description of applications
        MEMS  91
        CMOS Image Sensors . 132
        Advanced Packaging . 146
        LEDs  183
        Power devices  195
        RF devices. 199
        SOI  202

    Conclusions 

    Appendix 
        Company presentation . 211