The surge of new electronic products, led by small and mobile computer-based devices, has resulted in significant changes in resin selection for enclosures.  Downsizing and thin walling have necessitated a reevaluation of resins because of more demanding physical-property requirements and molding challenges.  In addition, a reevaluation is also necessary for resins used in the stationary portion of the market, which includes enclosures for desktop computers and flat-panel displays.

This study analyzes new developments, particularly the complex scenario of very small enclosures, given that mobile electronic devices have become increasingly smaller and lighter.  There have also been changes in the market for stationary electronic devices, especially because of the additional protection required for power supplies within these units.

REASON FOR DOING STUDY

Many past studies on resins used for electronic enclosures cited data that was outdated and, in our opinion, not valid.  FEW of these studies carefully defined the parameters.  It must also be realized that change is the mantra of the electronic industry.  NEW products are constantly being introduced, creating different issues for enclosures.

In many instances, past studies did not take into account important data generated from previous reports.  Also not take into consideration were critical factors such as the actual measurement and calculation of surface areas and weights for both stationary and mobile electronic enclosures.

The results of this study were generated from such measurements and subsequent calculations.  The report also includes careful estimates of units sold, and, finally, reasonable estimates of future units to be sold.

SCOPE AND FORMAT

Use of electronic enclosures, often called “housings”, is often classified as stationary or mobile. and often compete with each other.  Many mobile electronic devices have become multifunctional.  This study covers both stationary and mobile electronic devices; some of the latter are also known as handheld devices.

Some of the significant changes within the industry include the shift of desktop computers to notebooks, with the shift to smaller versions called “netbooks”, and the explosion of the cell phone market, which includes upgrades such as iPhones, smart phones, and the popular BlackBerry.  MP3 players, such as i-pods, bring music to the world.  Tablets such as the popular i-Pad, along with electronic books, or “e-books”, have been the most recently introduced products in this industry.

Another critical factor in this market is the almost complete shift in North America, Japan, and Western Europe from cathode-ray-tube (CRT) monitors to flat-panel monitors for computers and TVs.  In both cases, bulky monitors have been replaced, resulting in less volume for enclosures and shifts away from polystyrene (PS) to mostly polycarbonate/acrylonitrile-butadiene-styrene (PC/ABS) resins.

This report deals with electronic enclosures and excludes enclosures used for servers, which utilize modular enclosures.  Servers are a nondescript group of enclosures, mostly made from metals, especially sheet-metal materials, along with some reinforced plastics, many of which are thermosets.  Many of these enclosures are termed “cabinets” and are made by simply joining smaller units together.

Another factor impacting this market, and covered in detail in this report, relates to the use of flame retardants for resins used in electronic enclosures to conform to new environmental restrictions related to bromine-based variants.  In some instances, choices of enclosure resins have changed in order to meet these new standards.

Use of metals in stationary and mobile electronic devices has been considered in this report.  However, the use of metals is still very small and difficult to quantify; as such, it was not included in the basic calculations to determine enclosure weights.

The market information contained in this report is considered global.  However, a quantitative breakdown of the data by geographic region was not deemed feasible.  We have included the most recent global analysis of electronic device sales by major geographic region; this could prove to be a viable attempt to segment this market by major areas.

REPORT HIGHLIGHTS

• The global market for plastics used in electronic enclosures was 6.9 billion pounds in 2011. This market to reach 7.4 billion pounds by 2012 and to reach 9.9 billion pounds by 2017, increasing at a compound annual growth rate (CAGR) of 6.1%.
• The stationary electronic device segment was 6.7 billion pounds in 2011, which is expected to reach to 7.2 billion pounds in 2012. The segment is then forecast to grow to 9.5 billions pound by 2017, increasing at a CAGR of 5.9% for the five year period.
• The mobile electronic device segment was 179.1 million pounds in 2011 and is expected to reach 201 million pounds in 2012. This market will further grow at a CAGR of 12.6% and will reach 363.4 million pounds in 2017.

TABLE OF CONTENTS

CHAPTER ONE: INTRODUCTION 
    STUDY OBJECTIVES  1
    REASON FOR DOING STUDY   1
    SCOPE AND FORMAT  1
    METHODOLOGY   2
    ABOUT THE AUTHOR  3
    DISCLAIMER   4

CHAPTER TWO: SUMMARY 
    SUMMARY  5
   SUMMARY TABLE GLOBAL MARKET FOR RESINS FOR
     STATIONARY AND MOBILE ENCLOSURES BY TYPE OF
     ELECTRONIC ENCLOSURE, THROUGH 2017 (MILLION POUNDS)  6
   SUMMARY FIGURE GLOBAL MARKET FOR RESINS FOR
     STATIONARY AND MOBILE ENCLOSURES BY TYPE OF
     ELECTRONIC ENCLOSURE, 2011-2017 (MILLION POUNDS)   6

CHAPTER THREE: OVERVIEW OF ELECTRONIC ENCLOSURES
    DEFINITIONS  7
    PLANNING   7
    FUNCTIONS   8
    BACKGROUND  8
    THE EMI ISSUE  9
    HEAT-MANAGEMENT 9
    DOWNSIZING  10
    STILL A COMPETITIVE SCENARIO   10
    EFFECTS ON PERFORMANCE REQUIREMENTS AND DESIGN  11
    MATERIAL AND PROCESS SELECTION   12
    SIGNIFICANCE OF THIN-WALLING ON RESIN SELECTION   13
    ISSUE OF FLAME-RETARDANCY  14
    COSTS   14
    ORGANIZATIONS PUBLISHING STANDARDS FOR ELECTRONIC
       ENCLOSURES  15
    NEW DEVELOPMENTS  15
         LESS PLASTIC AND MORE METAL ENCLOSURES 15
         PERFORMANCE CRITERIA FOR ELECTRONIC
             ENCLOSURES 16
                   Background  16
                   Comparison of Performance Criteria  16
   TABLE 1 COMPARISON OF KEY PERFORMANCE CRITERIA FOR
     ELECTRONIC ENCLOSURES: METALS VS  PLASTICS  17
         MATERIAL OPTIONS FOR ELECTRONIC ENCLOSURES  17
                   METALS   17
                        Background  17
                        Aluminum  17
                        Magnesium  18
                                Background   18
                                Advances   19
                        Steel 19
                        Zinc   19
                   REDUCTION OF ENCLOSURE WALL-THICKNESSES   20
                        Plastics vs  Metals   20
                   DECISION VARIABLES IN CHOOSING A PLASTIC
                     ELECTRONIC ENCLOSURE  21
                   TODAY'S POLYMERS USED IN ELECTRONIC
                     ENCLOSURES 21
                   DESIGN PARAMETERS   22
   TABLE 2 DESIGN PARAMETERS   22
                   ADVANTAGES OF THERMOPLASTICS  22
                        Over Thermosets 22
                        Over Metals 23
                        On the Downside 23
                   EMERGING POLYMERS FOR ELECTRONIC ENCLOSURES  23
                        Fossil-Fuel Polymers:  23
                        Biopolymers   24
                   AN OPPOSITE OPINION 24
                   ENVIRONMENTALLY-FRIENDLY MATERIALS  24
                   A NEW DEVELOPMENT  24
                        A New Development (Continued)   25

CHAPTER FOUR: RESIN CHOICES FOR ELECTRONIC ENCLOSURES 
    BACKGROUND  26
    COSTS   27
    COST-PERFORMANCE   27
   TABLE 3 COMPARISONS OF RESINS FOR ELECTRONIC
     ENCLOSURE APPLICATIONS BASED ON COST-PERFORMANCE  28
   TABLE 4 THE BEST- AND WORST-PERFORMING RESINS AND
     RESIN BLENDS FOR ELECTRONIC ENCLOSURES   28
         TYPES OF PLASTIC ENCLOSURE MATERIALS  28
             TYPES OF PLASTIC ENCLOSURE MATERIALS
                (CONTINUED) 29

CHAPTER FIVE: RESINS 
    OVERVIEW   30
    PC/ABS  30
         OVERVIEW  30
         BACKGROUND   31
           TRADE-NAMED PRODUCTS   32
           GRADES   32
           APPLICATIONS  33
           WHY/WHEN PC/ABS IS USED  34
           ELECTRONIC ENCLSURE PRODUCTS  34
           PRODUCERS   34
           FLAME RETARDANCY ASPECTS  35
           ELECTRONIC-ENCLOSURE ASPECTS   35
   ABS  36
           BACKGROUND   36
           PROPERTIES   36
           PROCESSING  36
           GENERAL GRADES  37
           FLAME RETARDANT GRADES  38
                      Background  38
                      Advantages of flame retardant ABS include:   38
                      Disadvantages 38
           OTHER ABS APPLICATIONS  39
           PRODUCERS   40
           ELECTRONIC-ENCLOSURE ASPECTS   41
           NEW DEVELOPMENTS   41
                      OKW Enclosures  41
                      Camden Electronics Ltd    41
   PS  42
           GENERAL-PURPOSE PS 42
           HIPS 42
                      Background and Properties   42
                      Advantages and Disadvantages  43
                      HIPS Characteristics Related to Electronic Enclosures  43
                      Applications, Advantages and Disadvantages   43
           IGNITION-RESISTANT PS (IR-HIPS)   44
           THE RECENT PS STORY   44
           PROCESSING OF PS  45
TABLE 5 FABRICATION METHODS AND USES FOR PS   45
          THERMOFORMING OF STYRENE POLYMERS   45
          FURTHER DETAILS ON USE OF PS IN ELECTRONIC
               ENCLOSURES 46
          OTHER ASPECTS OF HIPS-BASED ELECTRONIC
               ENCLOSURES 46
          THE EVER-CHANGING SCENARIO FOR STYRENE
               PRODUCERS  47
   PCS  48
          BACKGROUND   48
          GENERAL GRADES  48
           ALLOYS/BLENDS   49
           PROPERTIES   49
           PROPERTY ADVANTAGES AND DISADVANTAGES   49
           BRIEF REVIEW OF APPLICATIONS 50
           ENCLOSURE-RELATED APPLICATIONS   50
           CHLORINE- AND BROMINE-FREE PC   51
           A MORE REALISTIC PICTURE OF PC-BASED ELECTRONIC
                ENCLOSURES 51
           SOME NEW DEVELOPMENTS   51
           OTHER RELATED APPLICATIONS   52
           PRODUCERS AND CAPACITIES  52
           NEW DEVELOPMENTS   53
    PPO/HIPS  53
           OVERVIEW  53
           GRADES   54
           PROCESSING  55
           NON-ELECTRONIC-ENCLOSURE APPLICATIONS  55
           PROPERTIES AND ADVANTAGES  55
           ELECTRONIC-ENCLOSURE APPLICATIONS  56
                      Background  56
                      Disadvantages 56
                      Current Scenario with Regard to Electronic Enclosures   57
           PPO/NYLON  57
                      Background and Properties   57
                      Grades and Applications   58
           PC/PBT   58
                      Background  58
                      Properties   58
                      Applications   59
           PC/PET   59
           ABS/PVC   60
           ABS/PBT   60
    PVC  61
           OVERVIEW  61
           BACKGROUND   61
           PROPERTIES   61
           ADVANTAGES/DISADVANTAGES   61
TABLE 6 ADVANTAGES AND DISADVANTAGES OF PVC IN
  ELECTRONIC ENCLOSURES   62
              APPLICATIONS  62
TABLE 7 RIGID PVC APPLICATIONS 63
              ENVIRONMENTAL ISSUES  63
                  Positive   63
                  Negative   63
             PRODUCERS   64
TABLE 8 GLOBAL PVC PRODUCERS (%) 64
        NEW PRODUCTS AND DEVELOPMENTS  64
    BIODEGRADABLE POLYMERS  65
        OVERVIEW  65
        KEY MATERIAL--PLA   65
        RECENT DEVELOPMENTS  66
             Telecom's Phone   66
             Panasonic Products   66
    THERMOSET RESINS  66
        OVERVIEW  66
        UNSATURATED POLYESTERS  67
             Background  67
             Types of Unsaturated Polyesters  67
             Applications   68
                    Construction/Infrastructure   68
                    Bathroom Products   68
                    Corrosion-Resistant Products  68
                    Marine Products 68
                    Electronic Enclosures   69
        EPOXY RESINS   69
             Background  69
             Chemical Epoxy Types  70
             Applications   70
             Role in Electronic Enclosures 70
        PHENOLICS  71
             Background  71
             Grades  71
             Enclosure Applications  71
        POLYURETHANES (PURS)   71
             Background  71
             RIM Products   72
             Enclosure-Related Uses  72
        REINFORCED PLASTICS  72
             Background  72
             General Properties  73
TABLE 9 FIBER-REINFORCED THERMOSET PROPERTIES AND
  MANUFACTURING PROCESSES   73
                      Fiber-Reinforced Grades   73
                      Examples of Companies Producing Fiberglass Electronic
                         Enclosures  74
                            Signature Enclosures  74
                            Vynckier Enclosure Systems  74
                            Bud Industries  74
                     The Case against Fiberglass Electronic Enclosures  74
                     Thermoplastics  75
               COMPOSITES  76
                     Overview  76
                     Advanced Composites  76
                     Processing  76
                     There are Efforts to Promote Composites for Electronic
                          Enclosures  77
                     New Developments  77
               SMC  77
                     Background  77
                     SMC Process Choices   78
                     SMC Formulations  78
TABLE 10 TYPICAL SMC FORMULATION   78
                         Source: Trade literature  78
                         Technology   79
                         Composite Materials Engineering (CME) Electronic
                            Enclosures  79
                         SMC Producers  79
TABLE 11 SELECTED KEY SMC PRODUCERS   80
              Markets  80
              Other Process Challenges   80
              Use of Nano-Particles  80
         BMCS  81
              Background  81
              Technology   81
              Advantages  81
              Applications   82
              BMC Compounders  82
              Other Key SMC and BMC Benefits  82
              Electronic-Enclosure Usage  82
     CONDUCTIVE PLASTICS  83
         OVERVIEW  83
         TYPES OF CONDUCTIVE MATERIALS   83
         DIELECTRIC PROPERTIES OF PLASTICS   84
TABLE 12 DIELECTRIC CONSTANTS FOR SELECTED MATERIALS  85
               TECHNIQUES FOR MAKING PLASTICS CONDUCTIVE  85
TABLE 13 HOW TO MAKE PLASTICS CONDUCTIVE   86
               COMPOUNDING CONDUCTIVE PLASTICS   86
               CONDUCTIVITY TESTS  87
               EXAMPLES OF COMPANIES PRODUCING CONDUCTIVE
                 PLASTICS   87
TABLE 14 SELECTED KEY COMPANIES PRODUCING CONDUCTIVE
  PLASTICS  87
       TECHNICAL ISSUES 88
       RECENT DEVELOPMENTS IN CONDUCTIVE PLASTICS   88
                  Colored Conductive Polyacetals  88
                  New Conductive Grades Meet ECC's Strict Regulations  89
                  Conductive, Polymer Blends Used in Powder Coatings  89
       CONDUCTIVE TPES  89
       KEY SUPPLIERS AND EXAMPLES OF THEIR CONDUCTIVE
            PLASTIC PRODUCTS  89
                  Boedeker Plastics  89
                  Cabot  90
                  Ciba Specialty Chemicals  90
                  LNP Engineering   90
                  Lubrizol Advanced Materials  91
                  PolyOne  91
                  RTP  91
       CONDUCTIVE PLASTIC ADDITIVES  92
                  Overview  92
                  ESD/EMI Compounds 93
                            Antistatic Additives  93
                  Metal Fibers   93
                            Overview 93
                            Stainless-Steel Fibers   94
                            Other Metal Fibers   94
                  Carbon Fibers  94
                  Carbon-Blacks 94
                  Technical Aspects  94
                  Costs   95
                  Resins Used 95
       OTHER CONDUCTIVE PLASTIC SYSTEMS   95
                  Conductive Paints and Coatings   95
                            Background   95
                            Overview 96
                            Performance of Alternate Conductive Coatings  96
                                       Background   96
                                       Copper  96
                                       Silver  96
                                       Nickel   97
                                       Comparisons  97
                                       Other Aspects  97
                  Conductive-Coating Cost Comparisons  97
                  Coated Plastics for ESD Control   98
                  Conductive Elastomers  98
       COMPOUNDING CONDUCTIVE PLASTICS   99
ESD  99
                   TECHNOLOGY BACKGROUND  99
                   USE OF METAL ENCLOSURES  100
                   DEVICE FAILURES DUE TO ESD DAMAGE  100
                   HOW MUCH STATIC-PROTECTION IS NEEDED?  100
                   SUMMING UP THE ESD SCENARIO   101
                   ESD IN THE ELECTRONICS INDUSTRY  101
                   ESD CONTROLS   102
                        Background  102
                        Materials and Methods 102
                        Use of Chemical Additives  103
                               Background   103
                               Technology  103
                               Use of Conductive Fillers 104
                               Use of Coated Sheets  104
                        Role of Plastics in ESD Control  104
                        Static-Dissipative Polymers  105
                   ESD PRODUCTS OF REPRESENTATIVE COMPANIES  106
   TABLE 15 SELECTED KEY ESD PLASTIC PRODUCTS   106
                   RECENT ESD ACTIVITIES WITHIN THE ELECTRONIC
                     INDUSTRY 106
                       Polypropylene-Static-Dissipative Alloy for ESD Protection  106
                       IonPhasE Develops Dissipative Polymers  106

CHAPTER SIX: GENERAL TECHNOLOGY OF ELECTRONIC ENCLSURE RESINS  
    COMPARISON OF KEY PROPERTIES  107
    PROCESSING   107
           MELT-FLOW  107
   TABLE 16 RESIN COMPARISON: MELT-FLOW RATES (GRAMS/10
     MINUTES)   108
                   MOLD SHRINKAGE   108
   TABLE 17 RESIN COMPARISON: MOLD SHRINKAGE
     (INCHES/INCH)  108
                   MECHANICAL ASPECTS   109
                       Tensile Strength  109
   TABLE 18 RESIN COMPARISON: TENSILE STRENGTH (PSI)   109
                             Flexural Strength  109
   TABLE 19 RESIN COMPARISON: FLEXURAL STRENGTH (PSI)  110
                             Flexural Modulus  110
   TABLE 20 RESIN COMPARISON: FLEXURAL MODULUS (105 PSI
     @73°F)   110
                             Impact strength   110
   TABLE 21 RESIN COMPARISON: NOTCHED IZOD IMPACT (FOOT-
     POUND/INCH, 1/8-INCH SPECIMEN)   111
         THERMAL CONSIDERATIONS   111
                   CLTE   111
   TABLE 22 RESIN COMPARISON: CLTE (106 INCHES/INCH/°C)   111
                   HDT  112
   TABLE 23 RESIN COMPARISON: HDT (°F @ 264 PSI)  112
         PHYSICAL PARAMETERS   112
             WATER ABSORPTION   112
   TABLE 24 RESIN COMPARISON: WATER ABSORPTION
     (PERCENT/24 HOURS)  113
                   DIELECTRIC STRENGTH   113
   TABLE 25 RESIN COMPARISON: DIELECTRIC STRENGTH
     (VOLTS/MIL)   113
         PROPERTY SUMMARY   113
             PROPERTY SUMMARY (CONTINUED)   114

CHAPTER SEVEN: PROCESS TECHNOLOGY FOR ELECTRONIC ENCLOSURES  
    BACKGROUND  115
    INJECTION-MOLDING   115
    STRUCTURAL FOAM MOLDING  116
    THERMOFORMING  117
    DIFFERENCES IN MOLDING ENCLOSURES FOR MOBILE VS
      STATIONARY DEVICES  117
         BACKGROUND   117
         DISTINCTIONS BETWEEN MOBIL AND STATIONARY
           ENCLOSURES 118
         OTHER FACTORS   119

CHAPTER EIGHT: TESTING AGENCIES AND REQUIREMENTS RELATED TO ELECTRONIC ENCLOSURES  
    OVERVIEW   120
    FIRE-PROTECTION STANDARDS FOR ELECTRONIC
       ENCLOSURES  120
    UL  120
            BACKGROUND   120
            FLAMMABILITY STANDARDS   121
                       Definitions 121
                       Flammability Tests 122
                                 Overview 122
                                 UL 94 VB Tests   122
   TABLE 26 CRITERIA FOR UL 94 V CLASSIFICATIONS
     (INCHES/MINUTE)   123
                                       UL HB Test (UL 94 HB)   123
                                       Summary of UL 94 Material Ratings  123
   TABLE 27 BURN SPECIFICATIONS FOR UL 94 MATERIAL RATINGS 124
                                       UL 1950   124
        NEMA  124
   TABLE 28 SELECTED KEY NEMA, UL, AND CSA STANDARDS   125
        OTHER STANDARDS FOR ELECTRONIC ENCLOSURES   126
            OVERVIEW  126
            EFFORTS TO REACH COMMON STANDARDS  126
            INTERNATIONAL ELECTROTECHNICAL COMMISSION
               (IEC)  126
            SUMMARY   126
            U S  MILITARY STANDARDS  127

CHAPTER NINE: FLAME RETARDANCY
    BACKGROUND  128
   TABLE 29 TYPICAL FLAME RETARDANCY LEVELS FOR
     POLYSTYRENE (PARTS/MILLION)  128
        OVERVIEW   129
        THE BROMINE ISSUE  129
             BACKGROUND   129
             ROHS EXEMPTION ENDED IN 2008   130
             OTHER WEEE IMPACTS ON TYPE OF FR USAGE   131
             USE OF HALOGEN-FREE MATERIALS WITH PC/ABS   131
             POTENTIAL FOR PRODUCT REDESIGN AND POTENTIAL
               CHANGES IN PLASTIC-ENCLOSURE RESINS IN LIGHT
               OF THE BROMINATED-FR ISSUE 131
   TABLE 30 PHOSPHATE FLAME-RETARDANTS USED IN
     ELECTRONIC ENCLOSURE APPLICATIONS  132
                 CURRENT SCENARIO FOR BROMINE FLAME-
                   RETARDANTS  132
   TABLE 31 CURRENT SCENARIO FOR POLYNUCLEAR,
     BROMINATED FLAME-RETARDANTS IN REGARD TO
     ELECTRONIC ENCLOSURES   133
                 ACTION BY ALBERMARLE CHEMICAL   133
                 OTHER DEVELOPMENTS   133

CHAPTER TEN: EMI ASPECTS  
    BACKGROUND  134
    OVERVIEW OF EMI-SHIELDING   134
    MECHANISMS OF SHIELDING  135
    ELECTROMAGNETIC CONTROL (EMC) 135
    THE IMPORTANCE OF SHIELDING  135
    CONTROLLING EMI   136
    SHIELDING-EFFECTIVENESS   137
   TABLE 32 GENERAL RATINGS OF SHIELDING-EFFECTIVENESS  137
        COST AND PERFORMANCE OF SHIELDING OPTIONS   138
        USE OF THERMOPLASTICS  138
        EMI-SHIELDING COMPOUNDS VERSUS COATINGS   138
        ELECTRONIC INDUSTRY/EMI-SHIELDING INTERFACE 139
            BACKGROUND   139
            ENCLOSURES   139
                 Overview  139
                 Background  140
                 Aesthetics   140
                 EMI Leakage 141
                 Cost Considerations   142
                 Computers and EMI  143
                 Cellular Phones   143
            SUMMING UP THE ISSUES OF EMI AND SHIELDED
              ENCLOSURES 143
            SUPPLIERS OF SHIELDED ENCLOSURES  144
            REGULATIONS AND STANDARDS  144
                 Overview  144
                 United States   145
                       Background   145
                       Part 15   145
                 Canada   145
                 Europe  145
                 Japan  146
            DRIVING FORCES THAT IMPACT DEMAND FOR EMI
              SHIELDING  146
            IMPACT OF MINIATURIZATION ON SHIELDING  147

CHAPTER ELEVEN: THIN WALLING 
    INTRODUCTION   148
    THIN WALLING IS NOT A NOVEL CONCEPT  148
    UNIQUE CHARACTERISTICS RELATED TO THIN WALLING
      ELECTRONIC ENCLOSURES  148
    EFFECTS ON PERFORMANCE REQUIREMENTS AND DESIGN  149
    MOBILE VS STATIONARY ENCLOSURES  149
    APPLICATION REQUIREMENTS 149
    MATERIAL AND PROCESS SELECTION   150
         MATERIAL AND PROCESS SELECTION (CONTINUED) 151

CHAPTER TWELVE: PRICING 
   TABLE 33 LIST PRICES FOR ENCLOSURE RESINS
     (DOLLARS/POUND) 152

CHAPTER THIRTEEN: RESIN MARKET ESTIMATES AND FORECASTS FOR ELECTRONIC ENCLOSURES
    INTRODUCTION   153
    RESIN CONSUMPTION IN ELECTRONIC ENCLOSURES  154
         OVERVIEW  154
TABLE 34 GLOBAL ELECTRONIC ENCLOSURE MARKET BY KEY
  RESINS, THROUGH 2017 (MILLION POUNDS)  154
               CHARACTERIZING THIS MARKET GEOGRAPHICALLY   154
TABLE 35 GLOBAL SALES OF ELECTRONIC DEVICES BY MAJOR
  GEOGRAPHICAL AREA, 2012 AND 2017 (AS A PERCENT OF
  TOTAL)   155
               PC/ABS RESINS  155
TABLE 36 GLOBAL MARKET FOR PC/ABS ENCLOSURES,
  THROUGH 2017 (MILLION POUNDS)  155
TABLE 37 GLOBAL MARKET FOR PC/ABS FOR STATIONARY
  DEVICES, THROUGH 2017 (MILLION POUNDS)   156
TABLE 38 GLOBAL MARKET FOR PC/ABS ENCLOSURES FOR
  MOBILE DEVICES THROUGH 2017 (MILLION POUNDS)   156
               ABS RESINS  157
TABLE 39 GLOBAL MARKET FOR ABS ENCLOSURES, THROUGH
  2017 (MILLION POUNDS)   157
TABLE 40 GLOBAL MARKET FOR ABS ENCLOSURES FOR
  STATIONARY DEVICES, THROUGH 2017 (MILLION POUNDS)   157
TABLE 41 GLOBAL MARKET FOR ABS ENCLOSURES FOR MOBILE
  DEVICES, THROUGH 2017 (MILLION POUNDS)  158
               HIPS 158
TABLE 42 GLOBAL ENCLOSURE MARKET FOR HIPS BY
  APPLICATION, THROUGH 2017 (MILLION POUNDS)  159
               PC   159
TABLE 43 GLOBAL MARKET FOR PC ENCLOSURES, THROUGH 2017
  (MILLION POUNDS)  159
TABLE 44 GLOBAL MARKET FOR PC ENCLOSURES FOR
  STATIONARY DEVICES, THROUGH 2017 (MILLION POUNDS)  160
TABLE 45 GLOBAL MARKET FOR PC ENCLOSURES FOR MOBILE
  DEVICES, THROUGH 2017 (MILLION POUNDS)  160
               PPO/HIPS   160
TABLE 46 GLOBAL MARKET FOR PPO/HIPS ENCLOSURES IN
  STATIONARY, DEVICES THROUGH 2017 (MILLION POUNDS)   161
               OTHER RESINS  161
TABLE 47 GLOBAL MARKET FOR OTHER RESINS IN ENCLOSURES,
  THROUGH 2017 (MILLION POUNDS)  162
TABLE 48 GLOBAL MARKET FOR OTHER RESINS IN ENCLOSURES
  FOR MOBILE DEVICES, THROUGH 2017 (MILLION POUNDS)   162
TABLE 49 GLOBAL MARKET FOR OTHER RESINS FOR
  ENCLOSURES IN STATIONARY DEVICES, THROUGH 2017
  (MILLION POUNDS)  163
     OTHER OBSERVATIONS RELATED TO RESIN USAGE IN
       ELECTRONIC ENCLOSURES  163
                 OTHER OBSERVATIONS RELATED TO RESIN
                   (CONTINUED) 164

CHAPTER FOURTEEN: APPLICATIONS  
    DEFINITIONS  165
    FACTORS AFFECTING ELECTRONIC ENCLOSURES  165
         OVERVIEW  165
         THINNER ENCLOSURES ARE HERE  165
         SNAPSHOT OF THE MARKET FOR ELECTRONIC DEVICES   166
    EXAMPLES OF STATIONARY ELECTRONIC DEVICES 167
         COMPUTERS   167
             Overview  167
             Desktops   168
                      Background   168
                      Current Developments 168
         ELECTRONIC DISPLAYS  168
             Background  168
             Flat panel Displays 169
             Comparisons of Electronic Displays   169
   TABLE 50 ELECTRONIC DISPLAY COMPARISONS   170
                          The Future of CRT Technology   170
                          Forecasts  170
   TABLE 51 TOTAL GLOBAL DISPLAY AREA BY FLAT-PANEL
     TECHNOLOGY  171
                      Review of LCD Enclosures  171
                 PRINTERS 171
                      Overview  171
                      Ink-Jet printers   171
                      Monochrome Laser Printers  172
                      Color Laser Printers  172
                      Manufacturers   172
                      Printer Market Matures  172
                 ALL-IN-ONE MACHINES  173
                 PHONES   173
                      Corded Phones   173
                      Cordless Phones   173
                 KEYBOARDS   173
                      Overview  173
                      Background  174
                      Ergonomic Keyboards  175
                      Cordless Keyboards   175
                      Manufacturers   175
                 FACSIMILE MACHINES (FAX MACHINES)   176
                      Overview  176
                      Background  176
                        Fax Machine Manufacturers  176
            SCANNERS  177
                 Background  177
        EXAMPLES OF MOBILE ELECTRONIC DEVICES   177
            CELLULAR PHONES   177
                 History 177
                 Overview  177
                 Producers   178
                 Current Market Update  178
                 Details on Enclosures for Cellular Phones   178
                 Other Aspects of Enclosures for Cellular Phone  179
                 A New Development  180
            NOTEBOOKS/NETBOOKS   180
                 Overview  180
                 Netbooks  181
                 Plastic Notebook/Netbook Resin Enclosures  182
                 Magnesium Enclosures   182
                 Notebook/Netbook Application Requirements   182
   TABLE 52 TYPICAL REQUIREMENTS FOR NOTEBOOK/NETBOOK
     PLASTIC ENCLOSURES  183
                  New Developments  183
             TABLETS/I-PADS  183
             E-READERS   184
             I-PODS/MP3 PLAYERS   184
             COMBINATION-TYPE MOBILE ELECTRONIC
                ENCLOSURES 184
        SPECIFICS IN CHOOSING AN ENCLOSURE FOR A HANDHELD
          DEVICE   185

CHAPTER FIFTEEN: RESIN ENCLOSURE MARKET ESTIMATES AND FORECASTS BY APPLICATION
    BACKGROUND  186
    ESTIMATED GLOBAL SALES OF KEY ELECTRONIC DEVICES   186
   TABLE 53 GLOBAL SALES AND FORECAST FOR ELECTRONIC
     DEVICES, THROUGH 2017 (MILLIONS OF UNITS SOLD)  186
   TABLE 54 GLOBAL SALES AND FORECAST FOR MOBILE
     ELECTRONIC DEVICES, THROUGH 2017 (MILLIONS OF UNITS
     SOLD)   187
   TABLE 55 GLOBAL SALES AND FORECAST FOR STATIONARY
     ELECTRONIC, DEVICES THROUGH 2017 (MILLIONS OF UNITS
     SOLD)   187
   TABLE 55 (CONTINUED)   188
        DETERMINING AVERAGE SIZES OF RESIN-BASED
          ENCLOSURES FOR THE MAJOR TYPES OF ELECTRONIC
          DEVICES   188
               BACKGROUND   188
               CALCULATIONS   188
TABLE 56 ESTIMATES OF DIMENSIONS OF ELECTRONIC
  ENCLOSURES FOR MOBILE DEVICES (INCHES)   189
TABLE 57 ESTIMATES OF DIMENSIONS OF ELECTRONIC
  ENCLOSURES FOR STATIONARY DEVICES (INCHES)  189
               RESULTS   190
TABLE 58 AVERAGE WEIGHTS OF MOBILE-DEVICE ENCLOSURES
  (POUNDS)  190
TABLE 59 AVERAGE WEIGHTS OF STATIONARY DEVICE
  ENCLOSURES (POUNDS)   190
TABLE 60 ENCLOSURE WEIGHTS FOR MOBILE ELECTRONIC
  DEVICES, THROUGH 2017 (MILLION POUNDS)   191
TABLE 61 ENCLOSURE WEIGHTS FOR STATIONARY ELECTRONIC
  DEVICES, THROUGH 2017 (MILLION POUNDS)  191
     MARKETS FOR MOBILE AND STATIONARY ELECTRONIC
       DEVICE ENCLOSURES BY TYPE OF RESIN  192
         DIFFICULTIES IN DEVELOPING MARKET ESTIMATES  192
         FURTHER DYNAMICS IN THE RESIN MARKET  193
     ENCLOSURE RESINS FOR MOBILE ELECTRONIC DEVICES  193
TABLE 62 GLOBAL CONSUMPTION OF RESINS IN MOBILE
  ELECTRONIC-DEVICE ENCLOSURES, THROUGH 2017 (MILLION
  POUNDS)   194
TABLE 63 GLOBAL CONSUMPTION OF RESINS IN CELLULAR
  PHONES, THROUGH 2017 (MILLION POUNDS)   194
TABLE 64 GLOBAL CONSUMPTION OF RESINS IN SMART PHONES,
  THROUGH 2017 (MILLION POUNDS)   195
TABLE 65 GLOBAL CONSUMPTION OF RESINS IN
  NOTEBOOKS/NETBOOKS, THROUGH 2017 (MILLION POUNDS)   195
TABLE 66 GLOBAL CONSUMPTION OF RESINS FOR TABLETS/I-
  PADS, THROUGH 2017 (MILLION POUNDS)  196
TABLE 67 GLOBAL CONSUMPTION OF RESINS IN COMBINATION
  DEVICES, THROUGH 2017 (MILLION POUNDS)  196
TABLE 68 GLOBAL CONSUMPTION OF RESINS FOR E-READERS,
  THROUGH 2017 (MILLION POUNDS)   197
TABLE 69 GLOBAL CONSUMPTION OF RESINS FOR I-PODS/MP3
  PLAYERS, THROUGH 2017 (MILLION POUNDS)   197
TABLE 70 GLOBAL CONSUMPTION OF RESINS IN OTHER MOBILE
  DEVICES, THROUGH 2017 (MILLION POUNDS)   198
     RESINS FOR STATIONARY ELECTRONIC DEVICE ENCLOSURES   198
TABLE 71 GLOBAL CONSUMPTION OF RESINS IN STATIONARY
  ELECTRONIC ENCLOSURES, THROUGH 2017 (MILLION
  POUNDS)   198
   TABLE 72 GLOBAL CONSUMPTION OF RESINS IN ELECTRONIC-
     DISPLAY ENCLOSURES, THROUGH 2017 (MILLION POUNDS)  199
   TABLE 73 GLOBAL CONSUMPTION OF RESINS IN DESKTOP-
     COMPUTER ENCLOSURES, THROUGH 2017 (MILLION POUNDS)   200
   TABLE 74 GLOBAL CONSUMPTION OF RESINS IN PRINTER
     ENCLOSURES, THROUGH 2017 (MILLION POUNDS)  200
   TABLE 75 GLOBAL CONSUMPTION OF RESINS IN FAX-MACHINE
     ENCLOSURES, THROUGH 2017 (MILLION POUNDS)   201
   TABLE 76 CONSUMPTION OF RESINS IN SCANNER ENCLOSURES,
     THROUGH 2017 (MILLION POUNDS)   201
   TABLE 77 GLOBAL CONSUMPTION OF RESINS FOR ALL-IN-ONE
     ENCLOSURES, THROUGH 2017 (MILLION POUNDS)   202
   TABLE 78 GLOBAL CONSUMPTION OF RESINS IN KEYBOARD
     ENCLOSURES, THROUGH 2017 (MILLION POUNDS)   203
   TABLE 79 GLOBAL CONSUMPTION OF RESINS IN PHONE
     ENCLOSURES, THROUGH 2017 (MILLION POUNDS)  203
   TABLE 80 GLOBAL CONSUMPTION OF RESINS IN OTHER
     STATIONERY ENCLOSURES, THROUGH 2017 (MILLION
     POUNDS)   204

CHAPTER SIXTEEN: THE ENVIRONMENTAL SCENARIO 
    OVERVIEW   205
    RECYCLING   205
    ELECTRONIC-INDUSTRY INTERFACE  205
         OVERVIEW  205
         REASONS FOR INCREASED ENVIRONMENTAL
            REGULATIONS FOR ELECTRONIC EQUIPMENT   206
         ENVIRONMENTAL RATINGS   207
   TABLE 81 APPLYING PLASTICS SCORECARD TO ELECTRONIC
     ENCLOSURES  207
             THE EU'S ROHS DIRECTIVE  207
                  The EU's RoHS Directive (Continued)   208
             THE WEEE DIRECTIVE  209
         STYRENE-EMISSION PROBLEM  209
             OVERVIEW  209
             CHANGES IN MACT DIRECT FINAL RULE   210
             METHODS TO LOWER STYRENE EMISSIONS   211
             SUMMARY OF OPTIONS TO REDUCE STYRENE
               EMISSIONS AND MAINTAIN PRODUCT QUALITY   211
             RECENT DEVELOPMENTS  212
                  European Patent for Fully-Recyclable Computer Housing   212
                  Molder Uses Ecoskins for i-Phones   212

CHAPTER SEVENTEEN: SELECTED KEY GLOBAL PRODUCERS OF ELECTRONIC ENCLOSURE RESINS 
   TABLE 82 KEY GLOBAL PRODUCERS OF ELECTRONIC
     ENCLOSURE RESINS  213

CHAPTER EIGHTEEN: SELECTED COMMENTS FROM ELECTRONIC ENCLOSURE COMPANIES
    SELECTED COMMENTS FROM ELECTRONIC   214
         SELECTED COMMENTS FROM  (CONTINUED)   215

CHAPTER NINTEEN: PROFILES OF SELECTED ELECTRONIC ENCLOSURE MANUFACTURERS
    ALLIED MOULDED PRODUCTS   216
    BAFBOX, LTD  216
    BISON PROFAB   216
    BOSS ENCLOSURES   217
    BOX ENCLOSURES   217
    BUCKEYE SHAPEFORM  217
    BUD INDUSTRIES  218
    COMFORT SAFETY PRODUCTS   218
    COOL POLYMERS, INC    219
    DUSTSHIELD ENCLOSURES  219
    EAI ENCLOSURES  219
    FIBOX ENCLOSURES   220
    FREETECH PLASTICS   220
    HAMMOND MANUFACTURING   221
    HUBBELL/WIEGMANN  221
    INCLOSIA SOLUTIONS  221
    INTEGRA ENCLOSURES, INC    222
    LCD ENCLOSURES   222
    LCR ENCLOSURES, INC    223
    OKW ENCLOSURES 223
    ITS ENCLOSURES  223
    PEERLESS INDUSTRIES   224
    POLYCASE, INC    224
    QUBE, INC 225
    ROSE+BOPLA ENCLOSURES 225
    SELECTRONIX, LTD   225
    SERPAC ELECTRONIC ENCLOSURES  226
    SIGNATURE ENCLOSURES  226
    SOLUTIONS DIRECT  226
    TAKACHI ELECTRONIC ENCLOSURE COMPANY 227
    TRITON SYSTEMS, INC   227
    UNIBOX ENCLOSURES   228
    VYNCKIER ENCLOSURE SYSTEMS  228

SELECTED ACRONYMS 
    SELECTED ACRONYMS   229-231