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| Media Training: |
| Electronics Assembly |
| Defect and Photo Albums |
| Circuit Board Fabrication |
| IPC Specification Tree |
| Acceptance |
| Assembly |
| Materials |
| Cleaning |
| Process Support |
| Solderability |
| Lead Free |
| Components |
| Optoelectronics |
| Advanced Packaging |
| Cable and Wire |
| EHS/Management |
| Circuit Board Design & Fabrication: |
| Acceptance |
| Fabrication |
| Embedded |
| Design |
| Materials |
| Laminate |
| Interface Design |
| Interfaces |
This CD ROM is fully interactive and covers the use of single sided and double sided reflow assembly. It includes animations and video clips showing the set-up of a reflow process and how to conduct a temperature profile. Two sections show how to attached thermocouples with a full written instructions. Interactive sections explain the temperature profile and what each stage must achieve and why.
The video clips feature process equipment from Electrovert, Seho, ECD and others. Examples of satisfactory solder standards are provided with a complete guide to possible process defects. The defect section may be viewed with small photographic examples to make searching easy and then each sample may be viewed at full screen. A description of each of the defect photographs is included with the possible causes. The CD also contains video clips of soldering BGA, Pin In Hole Reflow, Solder Beading and lots lots more.
A full animation of the surface mount assembly process is included on each of the CD-ROM which includes the BGA, double sided assembly and through hole/Intrusive reflow assembly. The CD is ideal for shop floor reference or training new engineers in the use of reflow soldering processes. Also included on the ROM is the latest issues of profiling software and user manuals.
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