Loading... Please wait...Intelligent Path to Competitiveness!
| Media Training: |
| Electronics Assembly |
| Defect and Photo Albums |
| Circuit Board Fabrication |
| IPC Specification Tree |
| Acceptance |
| Assembly |
| Materials |
| Cleaning |
| Process Support |
| Solderability |
| Lead Free |
| Components |
| Optoelectronics |
| Advanced Packaging |
| Cable and Wire |
| EHS/Management |
| Circuit Board Design & Fabrication: |
| Acceptance |
| Fabrication |
| Embedded |
| Design |
| Materials |
| Laminate |
| Interface Design |
| Interfaces |
1. The first screen introduces the user to the CD-ROM and the key topics covered in each section including conventional and surface mount desoldering operations. 
2 Each section of the CD can be selected by clicking on the interactive buttons next to the subject. The main screen also features an exit button to end the program. 
3 The CD features a complete introduction to surface mount and through hole assembly which may be followed with on screen text or by use of the audio tracks. This screen shot shows the screen printing process for solder paste application. 
4 The component removal section covers surface mount chip, SOIC, PLCC, BGA and conventional through hole component removal. Each section provides a video section illustrating the component removal and text sections which gives a step by step procedure for component removal. 
5 The component replacement section again covers chip, SOIC, PLCC, BGA and through hole parts and additional sections like screen printing for BGA, solder short removal using braid and BGA reballing of reworked parts. 
6 The European inspection standards section cover all the surface mount placement and soldering standards and can be accessed from this page. A more detailed text based standard is also available for reference. The text document is also provided on the CD for companies to use or adapt into an in-house document. 
7 The criteria for "J" lead terminations is provided visually and via a text box. Criteria for acceptable and unacceptable examples can be seen via the arrow keys at the bottom of the screen. 
8 The rework defect gallery provides photographs of defects seen during rework. Each photograph may be clicked to reveal a larger view of the defect. 
9 In the larger view of the defect section a text screen provides a description of the defect, possible causes and corrective actions. 
10 There are a wide range of suppliers of surface mount and conventional through hole rework equipment. A selection of suppliers are provided on the CD-ROM for possible reference. 
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