Semiconductor Memory: Technologies and Global Markets

Category
Semiconductors and Integrated Circuits
Memory
Semiconductor Memory: Technologies and Global Markets

Semiconductor Memory: Technologies and Global Markets

Price:

USD $4,850.00

ISBN/SKU #:

GB-IFT072A

Research Group:

BCC

Date of Publication:

April 2010

Summary

Memory is an indispensable component of computing devices. This indispensability has unfortunately led to stagnation on technology and business fronts. Major reason for this stagnation is the extreme level of commoditization of memory: Memory function remains fairly consistent regardless of its usage. Memory is probably the most under-innovated component in the computing architecture, given the potential for innovations.

Advances in semiconductor processes have fed customer appetite for devices that are concurrently portable, cost effective, power efficient and feature rich. This hunger in turn is driving existing semiconductor fabrication techniques to the very limits of their physical abilities. The dilemma witnessed in the larger semiconductor manufacturing methodology is reflected in the memory domain as well.

Traditional memory evolution has been two tracked—volatile and nonvolatile. In practical terms, this distinction has led to complexities in design, slowing the pace of innovation. One positive result of the new-age memory technologies is that all of them are nonvolatile, thus ending an undesirable complication.

This report tracks the impressive, if somewhat unwilling, innovation path of the memory industry.

STUDY GOALS AND OBJECTIVES

This study has the following goals and objectives:

Forecasting the market size for overall mainstream memory technology chipsets in value and volume terms
Forecasting the market size for overall new age memory technology chipsets in value and volume terms
Breaking down the overall mainstream memory market on the basis of memory technology: NAND flash, NOR flash, dynamic random access memory (DRAM), static random access memory (SRAM) and serial electrically erasable programmable read only memory (serial EEPROM).
Breaking down the overall new age memory market on the basis of memory technology: non-volatile RAM (NRAM), magneto-resistive RAM (MRAM), phase change RAM (PCRAM), ferroelectric RAM (FeRAM) and molecular RAM
Breaking down the individual mainstream memory technology market along end-user applications and geographical regions
Breaking down the individual new age semiconductor memory technology market along end-user applications and geographical regions
Analyzing the applications, drivers and prospects for mainstream memory technology chipsets
Analyzing the benefits, technology, drivers and prospects for new age memory technology chipsets
Analyzing the stakeholder value chain for mainstream and new age memory technologies
Analyzing the patenting activity involving mainstream and new age memory technologies.

REASONS FOR DOING THE STUDY

While the present economic downturn has been bad for the overall semiconductor industry, its impact on the memory domain has been especially severe with majors such as Qimonda having to close shop altogether. The impending merger between NEC Electronics and Renesas has been also necessitated by the heavy losses incurred by each one of them. Almost all memory chipmakers have been in the red in this duration.

While it may sound logical for companies to bear losses during downturns, it is definitely ironic for memory chipmakers to be in this position. The memory market is dominated by a small number of very large chipset manufacturers. In normal cases, such a scenario should act as an insurance against downturn, and the impact of the downturn should be gentler. That is, however, not the case with the memory industry.

The reason for this exaggerated shock is that the industry has been comparatively stagnant in innovation activities, with the same set of technologies having an extended run. Innovation is often a good shock absorber against recession, as products with higher levels of innovation are likely to yield better margins and witness greater demand due to their favorable position on the learning curve.

While the last decade has seen the introduction of several radical suggestions in memory synthesis, the level of their commercialization thus far has been dismal. The stakeholder interest in these new age methodologies is out of compulsion induced by the laws of physics.

The exploration of the path of new age technologies in the memory domain and the concurrent performance of existing stalwarts was always going to present an engaging comparative analysis. This report is an effort in highlighting the similarities and differences in the paths charted by these two memory technology categories.

SCOPE OF THE REPORT

The report forecasts the size of the mainstream memory and new age semiconductor memory technologies market from 2009 through 2014.

The executive summary provides a snapshot of key findings of the report.

The chapter on the technology analysis assesses the technologies constituting the mainstream and new age memory. It covers their evolution, drivers, prospects and applications. The chapter also sets the ground by comprehensive introductions and explanations to the technologies and assumptions.

The chapter on regional analysis presents a geography specific perspective of the prospects of individual memory technology chipsets.

The chapter on stakeholders explains the criterion for classification of stakeholders—integrated device manufacturers (IDM), device original equipment manufacturers (OEM)/motherboard manufacturers, intellectual property (IP) owners, semiconductor chip manufacturers, fabless companies and foundries. It also provides the latest information on the mainstream semiconductor and new age memory-related initiatives of key companies in each category.

The U.S. Patent Analysis chapter highlights the patenting activity underway in the area of mainstream and new age memory technologies. The chapter classifies the patents awarded according to the activities involved in the synthesis and operations of mainstream and new age memory technologies. It also provides a yearly, geographic and distribution by company of these patents.

The report is punctuated with numerical findings and projections that substantiate and drive the theoretical discussion.

INTENDED AUDIENCE

The report will be relevant to the following stakeholders:

Memory chip manufacturers, the face of the memory industry, as this report maps the prospects of their outputs in the conventional and new age spaces
IP owners, who are the growth engines of innovation, as this report forecasts the market potential for their innovation initiatives
Foundries, who bring the largest quantum of investment to the table, as this report forecasts the market size in terms of volume shipments, which can be a useful barometer for forecasting their occupancy levels
Fabless companies, as this report maps the prospects of their outputs in the conventional and new age spaces
IDMs, as the report details the average selling price (ASP) trends of mainstream and new age memory technologies.
Device OEMs and motherboard makers, as this report details the technology and business relative benefits of the mainstream and new age memory technologies.

METHODOLOGY AND INFORMATION SOURCES

The report forecasts the market size for the following:

Mainstream memory technologies: NAND flash, NOR, flash, dynamic random access memory (DRAM), static random access memory (SRAM) and serial electrically erasable programmable read only memory (EEPROM)
New age memory technologies: Non volatile/nano RAM (NRAM), magnetic RAM (MRAM), phase change RAM (PCRAM), ferroelectric RAM (FeRAM) and molecular RAM

The following metrics are forecast:

Value in millions of dollars
Volume in millions of units
Market by end-application categories such as telecommunications, computing, consumer electronics, industrial, scientific, and others
Market by geographical regions such as the Americas, Europe, the Middle East and Africa (EMEA), and Asia-Pacific (APAC)

Both primary and secondary research methodologies were used in this study. Industry experts were interviewed; secondary sources included industry consortia, individual company financial statements, published opinions, and other published sources.

TABLE OF CONTENTS

CHAPTER ONE: INTRODUCTION
    STUDY GOALS AND OBJECTIVES
    REASONS FOR DOING THE STUDY
    SCOPE OF THE REPORT
    INTENDED AUDIENCE
    METHODOLOGY AND INFORMATION SOURCES
    ABOUT THE AUTHOR
    DISCLAIMER

CHAPTER TWO: EXECUTIVE SUMMARY
SUMMARY TABLE GLOBAL VALUE SALES OF OVERALL MEMORY
TO SEMICONDUCTOR DEVICE MANUFACTURERS AND END USERS, THROUGH 2014 ($ MILLIONS)
SUMMARY FIGURE GLOBAL VALUE SALES OF OVERALL MEMORY
TO SEMICONDUCTOR DEVICE MANUFACTURERS AND END USERS, 2007-2014 ($ MILLIONS)

CHAPTER THREE: OVERVIEW
    TECHNOLOGY ANALYSIS
    THE ANATOMY OF MAINSTREAM SEMICONDUCTOR
      FABRICATION PROCESSES
         SEMICONDUCTORS AND THE PERIODIC TABLE
         THE CARBON FAMILY
         SILICON--THE DOMINANT SEMICONDUCTOR
         SILICON, COMPLEMENTARY METAL OXIDE
            SEMICONDUCTOR CMOS AND FABRICATION
    MEMORY PACKAGING TECHNIQUES
         DUAL IN LINE PACKAGE (DIL)
         SINGLE IN LINE PIN PACKAGE (SIPP)
         SINGLE IN LINE MEMORY MODULE (SIMM)
         DUAL IN LINE MEMORY MODULE (DIMM)
         SMALL OUTLINE DIMM (SO-DIMM)
         ADVANCES IN MEMORY PACKAGING TECHNIQUES
              Package Footprint Reduction: Chip Scale Package
                 (CSP)/Wafer Level Packaging (WLP)
                    Size and Weight Efficiency
                    Ease of Implementation
                    Compatibility
                    Mismatch and Revision Elimination
                    Time to Market Reduction
              Package-to-PCB Bonding: PGA
                   Lower Thermal Resistance and High Thermal Heat
                      Dissipation
                   Better Signal Quality
                   High Reliability
            Package-to-PCB Attachment/Bonding: BGA
                   High Density
                   Heat Conduction Efficiency
                   Low Inductance Leads
            Die-to-Package Substrate Attachment/Bonding: FC 0
                   Size Efficiency
                   Speedy Interconnect
                   I/O Efficiency
                   Cost Benefits
                   Assembly Process Efficiency
            Multi-Functional Integration on the Package: MCM
                   Better Performance
                   Improved Signal Quality
                   Size Reduction
                   Economic Advantages
            Multi-Functional Integration on the Package: SiP
                   Size Efficiency
                   Performance Enhancement
                   Design and Review Flexibility
                   Cost Advantage
                   Reduced Time-to-Market
            Multi-Functional Integration on the Package: PoP
                   Saving in Board Surface Area
                   Ease in System Design
                   Reduction in PCB Complexity
                   Enhanced Performance
                   Reduced Time-to-Market
   INTRODUCTION TO THE MEMORY MARKET
TABLE 1 GLOBAL VOLUME SALES OF OVERALL MEMORY TO SEMICONDUCTOR DEVICE MANUFACTURERS AND END USERS,
THROUGH 2014 (MILLIONS)
   VOLATILE MEMORY
   NONVOLATILE (NV) MEMORY
   MAINSTREAM MEMORY TECHNOLOGIES
TABLE 2 GLOBAL VALUE SALES OF MAINSTREAM MEMORY TO
SEMICONDUCTOR DEVICE MANUFACTURERS AND END USERS,
THROUGH 2014 ($ MILLIONS)
TABLE 3 GLOBAL VOLUME SALES OF MAINSTREAM MEMORY TO
SEMICONDUCTOR DEVICE MANUFACTURERS AND END USERS,
THROUGH 2014 (MILLIONS)
TABLE 4 ASP OF MAINSTREAM MEMORY TO SEMICONDUCTOR
DEVICE MANUFACTURERS AND END USERS, 2007-2014 ($)
TABLE 5 GLOBAL VALUE SALES OF MAINSTREAM MEMORY
CATEGORIZED BY END APPLICATIONS, THROUGH 2014 ($
MILLIONS)
TABLE 6 GLOBAL VOLUME SALES OF MAINSTREAM MEMORY
CATEGORIZED BY END APPLICATIONS, THROUGH 2014
(MILLIONS)
TABLE 7 ASP OF MAINSTREAM MEMORY CATEGORIZED BY END
APPLICATIONS, 2007-2014 ($)
   FLASH MEMORY
   NAND FLASH
        MARKET ANALYSIS
TABLE 8 GLOBAL VALUE AND VOLUME SALES OF NAND FLASH
CHIPSETS TO SEMICONDUCTOR DEVICE MANUFACTURERS,
THROUGH 2014 (MILLIONS)
TABLE 9 GLOBAL VALUE SALES OF NAND FLASH CHIPSETS
CATEGORIZED BY END APPLICATIONS, THROUGH 2014 ($
MILLIONS)
TABLE 10 GLOBAL VOLUME SALES OF NAND FLASH CHIPSETS
CATEGORIZED BY END APPLICATIONS, THROUGH 2014
(MILLIONS)
TABLE 11 GLOBAL ASP OF NAND FLASH CHIPSETS CATEGORIZED
BY END APPLICATIONS, 2007-2014 ($)
        INTRODUCTION
        TECHNOLOGY
        APPLICATIONS AND PROSPECTS
              Case Study--SanDisk
   NOR FLASH
        MARKET ANALYSIS
TABLE 12 GLOBAL VALUE AND VOLUME SALES OF NOR FLASH
CHIPSETS TO SEMICONDUCTOR DEVICE MANUFACTURERS,
THROUGH 2014 (MILLIONS)
TABLE 13 GLOBAL VALUE SALES OF NOR FLASH CHIPSETS
CATEGORIZED BY END APPLICATIONS, THROUGH 2014 ($
MILLIONS)
TABLE 14 GLOBAL VOLUME SALES OF NOR FLASH CHIPSETS
CATEGORIZED BY END APPLICATIONS, THROUGH 2014
(MILLIONS)
TABLE 15 GLOBAL ASP OF NOR FLASH CHIPSETS CATEGORIZED
BY END APPLICATIONS, 2007-2014 ($)
        INTRODUCTION
        TECHNOLOGY
        APPLICATIONS AND PROSPECTS
                  Case Study--Spansion
   COMPARISON OF NAND AND NOR FLASH MEMORY
        SHADOWING TECHNIQUES
        EXECUTE IN PLACE (XIP)
   DRAM
        MARKET ANALYSIS
TABLE 16 GLOBAL VALUE AND VOLUME SALES OF DRAM
CHIPSETS TO SEMICONDUCTOR DEVICE MANUFACTURERS,
THROUGH 2014 (MILLIONS)
TABLE 17 GLOBAL VALUE SALES OF DRAM CHIPSETS
CATEGORIZED BY END APPLICATIONS, THROUGH 2014 ($
MILLIONS)
TABLE 18 GLOBAL VOLUME SALES OF DRAM CHIPSETS
CATEGORIZED BY END APPLICATIONS, THROUGH 2014
(MILLIONS)
TABLE 19 GLOBAL ASP OF DRAM CHIPSETS CATEGORIZED BY
END APPLICATIONS, 2007-2014 ($)
        INTRODUCTION
        TECHNOLOGY
                  SDRAM
                  Embedded DRAMs (eDRAM)
        APPLICATIONS AND PROSPECTS
                  Case Study IBM POWER
                  Case Study--Hynix
                  Case Study--Elpida
   STATIC RAM (SRAM)
        MARKET ANALYSIS
TABLE 20 GLOBAL VALUE AND VOLUME SALES OF SRAM
CHIPSETS TO SEMICONDUCTOR DEVICE MANUFACTURERS,
THROUGH 2014 (MILLIONS)
TABLE 21 GLOBAL VALUE SALES OF SRAM CHIPSETS
CATEGORIZED BY END APPLICATIONS, THROUGH 2014 ($
MILLIONS)
TABLE 22 GLOBAL VOLUME SALES OF SRAM CHIPSETS
CATEGORIZED BY END APPLICATIONS, THROUGH 2014 ($
MILLIONS)
TABLE 23 GLOBAL ASP OF SRAM CHIPSETS CATEGORIZED BY
END APPLICATIONS, 2007-2014 ($)
        INTRODUCTION
        TECHNOLOGY
        APPLICATIONS AND PROSPECTS
                  Case Study--MoSys
                  Case Study--NEC
   SERIAL EEPROM
        MARKET ANALYSIS
TABLE 24 GLOBAL VALUE AND VOLUME SALES OF SERIAL
EEPROM CHIPSETS TO SEMICONDUCTOR DEVICE
MANUFACTURERS (MILLIONS)
TABLE 25 GLOBAL VALUE SALES OF SERIAL EEPROM CHIPSETS
CATEGORIZED BY END APPLICATIONS, THROUGH 2014 ($
MILLIONS)
TABLE 26 GLOBAL VOLUME SALES OF SERIAL EEPROM CHIPSETS
CATEGORIZED BY END APPLICATIONS, THROUGH 2014
(MILLIONS)
TABLE 27 GLOBAL ASP OF SERIAL EEPROM CHIPSETS
CATEGORIZED BY END APPLICATIONS, 2007-2014 ($)
        INTRODUCTION
        TECHNOLOGY
        APPLICATIONS AND PROSPECTS
                  Case Study--ST
   NEW AGE MEMORY
TABLE 28 GLOBAL VALUE SALES OF NEW AGE MEMORY TO
SEMICONDUCTOR DEVICE MANUFACTURERS, THROUGH 2014
($ MILLIONS)
TABLE 29 GLOBAL VOLUME SALES OF NEW AGE MEMORY TO
SEMICONDUCTOR DEVICE MANUFACTURERS, THROUGH 2014
(MILLIONS)
TABLE 30 ASP OF NEW AGE MEMORY TO SEMICONDUCTOR
DEVICE MANUFACTURERS, 2007-2014 ($)
TABLE 31 GLOBAL VALUE SALES OF NEW AGE MEMORY
CATEGORIZED BY END APPLICATIONS ($ MILLIONS)
TABLE 32 GLOBAL VOLUME SALES OF NEW AGE MEMORY
CATEGORIZED BY END APPLICATIONS, THROUGH 2014
(MILLIONS)
TABLE 33 ASP OF NEW AGE MEMORY CATEGORIZED BY END
APPLICATIONS, 2007-2014 ($)
   NRAM
        MARKET ANALYSIS
TABLE 34 GLOBAL VALUE AND VOLUME SALES OF NRAM
CHIPSETS TO SEMICONDUCTOR DEVICE MANUFACTURERS,
THROUGH 2014
TABLE 35 GLOBAL VALUE SALES OF NRAM CHIPSETS
CATEGORIZED BY END APPLICATIONS, THROUGH 2014 ($
MILLIONS)
TABLE 36 GLOBAL VOLUME SALES OF NRAM CHIPSETS
CATEGORIZED BY END APPLICATIONS, THROUGH 2014
(MILLIONS)
TABLE 37 GLOBAL ASP OF NRAM CHIPSETS CATEGORIZED BY
END APPLICATIONS, 2007-2014 ($)
        INTRODUCTION
        TECHNOLOGY
        APPLICATIONS AND PROSPECTS
   MAGNETO-RESISTIVE RAM (MRAM)
        MARKET ANALYSIS
TABLE 38 GLOBAL VALUE AND VOLUME SALES OF MRAM
CHIPSETS TO SEMICONDUCTOR DEVICE MANUFACTURERS,
2007-2014 (MILLIONS)
TABLE 39 GLOBAL VALUE SALES OF MRAM CHIPSETS
CATEGORIZED BY END APPLICATIONS, THROUGH 2014 ($
MILLIONS)
TABLE 40 GLOBAL VOLUME SALES OF MRAM CHIPSETS
CATEGORIZED BY END APPLICATIONS, THROUGH 2014
(MILLIONS)
TABLE 41 GLOBAL ASP OF MRAM CHIPSETS CATEGORIZED BY
END APPLICATIONS, 2007-2014 ($)
        INTRODUCTION
        TECHNOLOGY
        APPLICATIONS AND PROSPECTS
              Case Study--Everspin
   PHASE CHANGE RAM (PCRAM)
        MARKET ANALYSIS
TABLE 42 GLOBAL VALUE AND VOLUME SALES OF PCRAM
CHIPSETS TO SEMICONDUCTOR DEVICE MANUFACTURERS,
THROUGH 2014 (MILLIONS)
TABLE 43 GLOBAL VALUE SALES OF PCRAM CHIPSETS
CATEGORIZED BY END APPLICATIONS, THROUGH 2014 ($
MILLIONS)
TABLE 44 GLOBAL VOLUME SALES OF PCRAM CHIPSETS
CATEGORIZED BY END APPLICATIONS, THROUGH 2014
(MILLIONS)
TABLE 45 GLOBAL ASP OF PCRAM CHIPSETS CATEGORIZED BY
END APPLICATIONS, 2007-2014 ($)
        INTRODUCTION
        TECHNOLOGY
        APPLICATIONS AND PROSPECTS
   MOLECULAR RAM
        MARKET ANALYSIS
   TABLE 46 GLOBAL VALUE AND VOLUME SALES OF MOLECULAR
     RAM CHIPSETS TO SEMICONDUCTOR DEVICE
     MANUFACTURERS, THROUGH 2014 (MILLIONS)
   TABLE 47 GLOBAL VALUE SALES OF MOLECULAR RAM CHIPSETS
     CATEGORIZED BY END APPLICATIONS, THROUGH 2014 ($
     MILLIONS)
   TABLE 48 GLOBAL VOLUME SALES OF MOLECULAR RAM
     CHIPSETS CATEGORIZED BY END APPLICATIONS, THROUGH
     2014 (MILLIONS)
   TABLE 49 GLOBAL ASP OF MOLECULAR RAM CHIPSETS
     CATEGORIZED BY END APPLICATIONS, 2007-2014 ($)
           INTRODUCTION
           TECHNOLOGY
           APPLICATIONS AND PROSPECTS
                 Case Study--ZettaCore
      FERROELECTRIC RAM (FERAM)
           MARKET ANALYSIS
   TABLE 50 GLOBAL VALUE AND VOLUME SALES OF FERAM
     CHIPSETS TO SEMICONDUCTOR DEVICE MANUFACTURERS,
     THROUGH 2014 (MILLIONS)
   TABLE 51 GLOBAL VALUE SALES OF FERAM CHIPSETS
     CATEGORIZED BY END APPLICATIONS, THROUGH 2014 ($
     MILLIONS)
   TABLE 52 GLOBAL VOLUME SALES OF FERAM CHIPSETS
     CATEGORIZED BY END APPLICATIONS, THROUGH 2014
     (MILLIONS)
   TABLE 53 GLOBAL ASP OF FERAM CHIPSETS CATEGORIZED BY
     END APPLICATIONS, 2007-2014 ($)
           INTRODUCTION
           TECHNOLOGY
           APPLICATIONS AND PROSPECTS
                 Case Study--Toshiba

CHAPTER FOUR: GEOGRAPHICAL ANALYSIS
     REGIONAL PROFILE
     MAINSTREAM MEMORY
TABLE 54 GLOBAL VALUE SALES OF MAINSTREAM MEMORY
    CATEGORIZED BY GEOGRAPHICAL REGIONS, THROUGH 2014
    ($ MILLIONS)
TABLE 55 GLOBAL VOLUME SALES OF MAINSTREAM MEMORY
    CATEGORIZED BY GEOGRAPHICAL REGIONS, THROUGH 2014
    (MILLIONS)
TABLE 56 ASP OF MAINSTREAM MEMORY CATEGORIZED BY
    GEOGRAPHICAL REGIONS, 2007-2014 ($)
   NAND FLASH
TABLE 57 GLOBAL VALUE SALES OF NAND FLASH CHIPSETS
CATEGORIZED BY GEOGRAPHICAL REGIONS, THROUGH 2014
($ MILLIONS)
TABLE 58 GLOBAL VOLUME SALES OF NAND FLASH CHIPSETS
CATEGORIZED BY GEOGRAPHICAL REGIONS, THROUGH 2014
(MILLIONS)
TABLE 59 GLOBAL ASP OF NAND FLASH CHIPSETS CATEGORIZED
BY GEOGRAPHICAL REGIONS, 2007-2014 ($)
   NOR FLASH
TABLE 60 GLOBAL VALUE SALES OF NOR FLASH CHIPSETS
CATEGORIZED BY GEOGRAPHICAL REGIONS, THROUGH 2014 ($
MILLIONS)
TABLE 61 GLOBAL VOLUME SALES OF NOR FLASH CHIPSETS
CATEGORIZED BY GEOGRAPHICAL REGIONS, THROUGH 2014
(MILLIONS)
TABLE 62 GLOBAL ASP OF NOR FLASH CHIPSETS CATEGORIZED
BY GEOGRAPHICAL REGIONS, 2007-2014 ($)
   DRAM
TABLE 63 GLOBAL VALUE SALES OF DRAM CHIPSETS
CATEGORIZED BY GEOGRAPHICAL REGIONS, THROUGH 2014
($ MILLIONS)
TABLE 64 GLOBAL VOLUME SALES OF DRAM CHIPSETS
CATEGORIZED BY GEOGRAPHICAL REGIONS, THROUGH 2014
(MILLIONS)
TABLE 65 GLOBAL ASP OF DRAM CHIPSETS CATEGORIZED BY
GEOGRAPHICAL REGIONS, 2007-2014 ($)
   SRAM
TABLE 66 GLOBAL VALUE SALES OF SRAM CHIPSETS
CATEGORIZED BY GEOGRAPHICAL REGIONS, THROUGH 2014
($ MILLIONS)
TABLE 67 GLOBAL VOLUME SALES OF SRAM CHIPSETS
CATEGORIZED BY GEOGRAPHICAL REGIONS, THROUGH 2014
(MILLIONS)
TABLE 68 GLOBAL ASP OF SRAM CHIPSETS CATEGORIZED BY
GEOGRAPHICAL REGIONS, 2007-2014 ($)
   SERIAL EEPROM
TABLE 69 GLOBAL VALUE SALES OF SERIAL EEPROM CHIPSETS
CATEGORIZED BY GEOGRAPHICAL REGIONS, THROUGH 2014 ($
MILLIONS)
TABLE 70 GLOBAL VOLUME SALES OF SERIAL EEPROM CHIPSETS
CATEGORIZED BY GEOGRAPHICAL REGIONS, THROUGH 2014
(MILLIONS)
TABLE 71 GLOBAL ASP OF SERIAL EEPROM CHIPSETS
CATEGORIZED BY GEOGRAPHICAL REGIONS, 2007-2014 ($)
TABLE 72 GLOBAL VALUE SALES OF NEW AGE MEMORY
CATEGORIZED BY GEOGRAPHICAL REGIONS, THROUGH 2014
($ MILLIONS)
   NEW AGE MEMORY
TABLE 73 GLOBAL VOLUME SALES OF NEW AGE MEMORY
SHIPMENTS CATEGORIZED BY GEOGRAPHICAL REGIONS,
THROUGH 2014 (MILLIONS)
TABLE 74 ASP OF NEW AGE MEMORY CATEGORIZED BY
GEOGRAPHICAL REGIONS, 2007-2014 ($)
   NRAM
TABLE 75 GLOBAL VALUE SALES OF NRAM CHIPSETS
CATEGORIZED BY GEOGRAPHICAL REGIONS, THROUGH 2014
($ MILLIONS)
TABLE 76 GLOBAL VOLUME SALES OF NRAM CHIPSETS
CATEGORIZED BY GEOGRAPHICAL REGIONS, THROUGH 2014
($ MILLIONS)
TABLE 77 GLOBAL ASP OF NRAM CHIPSETS CATEGORIZED BY
GEOGRAPHICAL REGIONS, 2007-2014 ($)
   MRAM
TABLE 78 GLOBAL VALUE SALES OF MRAM CHIPSETS
CATEGORIZED BY GEOGRAPHICAL REGIONS, THROUGH 2014
($ MILLIONS)
TABLE 79 GLOBAL VOLUME SALES OF MRAM CHIPSETS
CATEGORIZED BY GEOGRAPHICAL REGIONS, THROUGH 2014
(MILLIONS)
TABLE 80 GLOBAL ASP OF MRAM CHIPSETS CATEGORIZED BY
GEOGRAPHICAL REGIONS, 2007-2014 ($)
   PCRAM
TABLE 81 GLOBAL VALUE SALES OF PCRAM CHIPSETS
CATEGORIZED BY GEOGRAPHICAL REGIONS, THROUGH 2014
($ MILLIONS)
TABLE 82 GLOBAL VOLUME SALES OF PCRAM CHIPSETS
CATEGORIZED BY GEOGRAPHICAL REGIONS, THROUGH 2014
(MILLIONS)
TABLE 83 GLOBAL ASP OF PCRAM CHIPSETS CATEGORIZED BY
GEOGRAPHICAL REGIONS, 2007-2014 ($)
   MOLECULAR RAM
TABLE 84 GLOBAL VALUE SALES OF MOLECULAR RAM CHIPSETS
CATEGORIZED BY GEOGRAPHICAL REGIONS, THROUGH 2014 ($
MILLIONS)
   TABLE 85 GLOBAL VOLUME SALES OF MOLECULAR RAM
     CHIPSETS CATEGORIZED BY GEOGRAPHICAL REGIONS,
     THROUGH 2014 (MILLIONS)
   TABLE 86 GLOBAL ASP OF MOLECULAR RAM CHIPSETS
     CATEGORIZED BY GEOGRAPHICAL REGIONS, 2007-2014 ($)
      FERAM
   TABLE 87 GLOBAL VALUE SALES OF FERAM CHIPSETS
     CATEGORIZED BY GEOGRAPHICAL REGIONS, THROUGH 2014
     ($ MILLIONS)
   TABLE 88 GLOBAL VOLUME SALES OF FERAM CHIPSETS
     CATEGORIZED BY GEOGRAPHICAL REGIONS, THROUGH 2014
     (MILLIONS)
   TABLE 89 GLOBAL ASP OF FERAM CHIPSETS CATEGORIZED BY
     GEOGRAPHICAL REGIONS, 2007-2014 ($)

CHAPTER FIVE: STAKEHOLDERS
    MEMORY MARKET PROFILE
         QIMONDA AND THE INFLEXIBILITY OF THE MEMORY
            MARKET
    STAKEHOLDER CLASSIFICATION
         INTEGRATED DEVICE MANUFACTURERS (IDM)
         ORIGINAL EQUIPMENT MANUFACTURERS (OEM)/
            MOTHERBOARD VENDORS
         IP OWNERS
         CHIPSET MANUFACTURERS
         FABLESS COMPANIES
         FOUNDRY OWNERS
    STAKEHOLDER PROFILES
         ATMEL CORPORATION
              General Background
              Initiatives Related to Mainstream Semiconductor and
                 New Age Memory Technologies
              Outlook and Analysis
         CROCUS TECHNOLOGY
              General Background
              Initiatives Related to Mainstream Semiconductor and
                 New Age Memory Technologies
              Outlook and Analysis
         CYPRESS SEMICONDUCTOR
              General Background
              Initiatives Related to Mainstream Semiconductor and
                 New Age Memory Technologies
              Outlook and Analysis
         ELPIDA
       General Background
       Initiatives Related to Mainstream Semiconductor and
            New Age Memory Technologies
       Outlook and Analysis
EVERSPIN TECHNOLOGY
       General Background
       Initiatives Related to Mainstream Semiconductor and
            New Age Memory Technologies
       Outlook and Analysis
FUJITSU
       General Background
       Initiatives Related to Mainstream Semiconductor and
            New Age Memory Technologies
       Outlook and Analysis
HYNIX 137
       General Background
       Initiatives Related to Mainstream Semiconductor and
            New Age Memory Technologies
       Outlook and Analysis
IBM
       General Background
       Initiatives Related to Mainstream Semiconductor and
            New Age Memory Technologies
       Outlook and Analysis
INTEGRATED DEVICE TECHNOLOGY (IDT)
       General Background
       Initiatives Related to Mainstream Semiconductor and
            New Age Memory Technologies
       Outlook and Analysis
INTEL
       General Background
       Initiatives Related to Mainstream Semiconductor and
            New Age Memory Technologies
       Outlook and Analysis
MICRON TECHNOLOGY INC
       General Background
       Initiatives Related to Mainstream Semiconductor and
            New Age Memory Technologies
       Outlook and Analysis
MOSYS INC 144
       General Background
       Initiatives Related to Mainstream Semiconductor and
            New Age Memory Technologies
       Outlook and Analysis
NANTERO INC.
     General Background
     Initiatives Related to Mainstream Semiconductor and
        New Age Memory Technologies
     Outlook and Analysis
NANYA
     General Background
     Initiatives Related to Mainstream Semiconductor and
        New Age Memory Technologies
     Outlook and Analysis
NEC ELECTRONICS
     General Background
     Initiatives Related to Mainstream Semiconductor and
        New Age Memory Technologies
     Outlook and Analysis
OVONYX. 148
     General Background
     Initiatives Related to Mainstream Semiconductor and
        New Age Memory Technologies
     Outlook and Analysis
RAMBUS
     General background
     Initiatives Related to Mainstream Semiconductor and
        New Age Memory Technologies
     Outlook and Analysis
RAMTRON
     General Background
     Initiatives Related to Mainstream Semiconductor and
        New Age Memory Technologies
     Outlook and Analysis
RENESAS
     General Background
     Initiatives Related to Mainstream Semiconductor and
        New Age Memory Technologies
     Outlook and Analysis
SAMSUNG SEMICONDUCTOR
     General Background
     Initiatives Related to Mainstream Semiconductor and
        New Age Memory Technologies
     Outlook and Analysis
SANDISK CORPORATION
     General Background
     Initiatives Related to Mainstream Semiconductor and
        New Age Memory Technologies
                       Outlook and Analysis
                  SPANSION
                       General Background
                       Initiatives Related to Mainstream Semiconductor and
                          New Age Memory Technologies
                       Outlook and Analysis
                  ST MICROELECTRONICS
                       General Background
                       Initiatives Related to Mainstream Semiconductor and
                          New Age Memory Technologies
                       Outlook and Analysis
                  TAIWAN SEMICONDUCTOR MANUFACTURING
                     CORPORATION (TSMC)
                       General Background
                       Initiatives Related to Mainstream Semiconductor and
                          New Age Memory Technologies
                       Outlook and Analysis
                  TOSHIBA
                       General Background
                       Initiatives Related to Mainstream Semiconductor and
                          New Age Memory Technologies
                       Outlook and Analysis
                  ZETTACORE
                       General Background
                       Initiatives Related to Mainstream Semiconductor and
                          New Age Memory Technologies
                       Outlook and Analysis

CHAPTER SIX: U.S. PATENT ANALYSIS
     INTRODUCTION
     TRENDS BY FUNCTIONAL CATEGORIES
TABLE 90 U.S. PATENTS IN ADOPTION OF NANOTECHNOLOGY
    PRINCIPLES IN MAINSTREAM MEMORY BY PATENT CATEGORY,
    1976FEBRUARY 2010 (NUMBER OF PATENTS AWARDED)
     TRENDS BY YEAR.
TABLE 91 U.S. PATENT TRENDS IN ADOPTION OF
    NANOTECHNOLOGY PRINCIPLES IN MAINSTREAM MEMORY BY
    YEAR OF GRANT, 1976FEBRUARY 2010 (NUMBER OF PATENTS
    AWARDED)
     TRENDS BY COUNTRY
TABLE 92 SHARES OF U.S. PATENTS ON ADOPTION OF
NANOTECHNOLOGY PRINCIPLES IN MAINSTREAM MEMORY--
BY COUNTRY, 1976FEBRUARY 2010
   TRENDS BY ASSIGNEE
TABLE 93 LIST OF ASSIGNEES FOR U.S. PATENTS ON ADOPTION
OF NANOTECHNOLOGY PRINCIPLES IN MAINSTREAM
MEMORY, 1976FEBRUARY 2010
TABLE 94 ASSIGNEES OF 10 OR MORE U.S. PATENTS ON
ADOPTION OF NANOTECHNOLOGY PRINCIPLES IN
MAINSTREAM MEMORY, 1976FEBRUARY 2010

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