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| Media Training: |
| Electronics Assembly |
| Defect and Photo Albums |
| Circuit Board Fabrication |
| IPC Specification Tree |
| Acceptance |
| Assembly |
| Materials |
| Cleaning |
| Process Support |
| Solderability |
| Lead Free |
| Components |
| Optoelectronics |
| Advanced Packaging |
| Cable and Wire |
| EHS/Management |
| Circuit Board Design & Fabrication: |
| Acceptance |
| Fabrication |
| Embedded |
| Design |
| Materials |
| Laminate |
| Interface Design |
| Interfaces |
This is the first in a series of interactive CD-ROMs developed by Soldertec Global to assist engineers with the practical introduction of lead-free materials and processes. Introduced by Kay Nimmo, Technical Director, Tin Technology, the CD provides a step-by-step guide to materials, soldering steps, inspection and common defects which may be seen in manufacture. The CD also features an interactive quiz on hand, reflow and wave soldering to help assess staff’s knowledge on the use of lead-free materials.


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