This report analyzes the Global market for Strained Silicon in US$ Million. Annual Production forecasts are provided for the period 2006 through 2015. The report profiles 66 companies including many key and niche players such as Advanced Micro Devices, Inc., Applied Materials, Inc., ASM International NV, Atmel Corporation, AmberWave Systems Corporation, Canon, Inc., CEVA, Inc., Chartered Semiconductor Manufacturing Ltd., Honeywell International, Inc., International Business Machines Corp., Isonics Corporation, Infineon Technologies, AG, Intel Corp., International Rectifier Corp., KLA Tencor Corporation, Maxim Integrated Products, Inc., MEMC Electronic Materials, Inc., Micron Technology Inc., Mitsubishi Materials Corporation, NEC Electronics Corporation, Oki Semiconductor Company Ltd., Peregrine Semiconductor Corp., Renesas Technology Corporation, Sandia National Laboratories, Soitec S. A., STMicroelectronics N.V., Shanghai Simgui Technology Co., Ltd, Shin-Etsu Handotai Co., Ltd., Silicon Genesis Corporation, Siltronic AG, Texas Instruments Incorporated, Toshiba Corporation, Taiwan Semiconductor Manufacturing Company Limited, United Microelectronic Corporation, and Vitesse Semiconductor Corporation. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.

TABLE OF CONTENTS 

STRAINED SILICON			MCP-1892
A GLOBAL STRATEGIC BUSINESS REPORT


                                       CONTENTS



  I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

      Study Reliability and Reporting Limitations                       I-1
      Disclaimers                                                       I-2
      Data Interpretation & Reporting Level                             I-2
       Quantitative Techniques & Analytics                              I-3
      Product Definitions and Scope of Study                            I-3


 II. EXECUTIVE SUMMARY

  1. INDUSTRY OVERVIEW                                                  II-1
      Introduction                                                      II-1
      Moving Beyond Silicon                                             II-1
      Outlook                                                           II-2
       Table 1: World Recent Past, Current & Future Analysis for
       Strained Silicon - Independently Analyzed with Annual Sales
       Figures in US$ Million for Years 2006 through 2015 (includes
       corresponding Graph/Chart)                                       II-2
      Understanding Semiconductors                                      II-3
       The Heart of Any Electronic Device                               II-3
       Keeping Pace with Moore's Law                                    II-3
       And Going Beyond                                                 II-4
      Key Factors Influencing the Market                                II-4
       The Cyclical Growth Demand Within the Industry                   II-4
       Industry Keeping Pace with Gordon Moore's Predictions            II-4
       End-Market Demand Characteristics                                II-5
       Increasing Content Within the Semiconductor                      II-5
       Environmental Factors                                            II-5
      Key Market Drivers                                                II-5
       Technology Migration: A Pre-requisite to Survive Competition     II-5
       New Materials hold the Key                                       II-6
       Copper for Superior Electrical Conductivity                      II-6
      Key Market Constraints                                            II-6
       Growing Payback Periods on Invested Capital: A Prime Concern     II-6
       Lack of Standards Acts Spoilsport                                II-6
       Need for Greater Collaboration Among the Players                 II-7
      Technological Innovations                                         II-7
       The 32-nm Generation Processor is Here                           II-7
       Target '22-nm Generation Microprocessors', by 2011               II-8
       UMC Announces the Validation of High-K/Metal-Gate Technology     II-8
       FEI Unveils the New TrueCrystal Package for Error-Free Strain
        Profiling                                                       II-8
       The Revolutionary Smart Cut(TM) Layer Transfer Technology From
        SOITEC                                                          II-9
        Smart Cut(TM) in the Manufacturing of Strained Silicon on
         Insulator (sSOI)                                               II-9
       NGS (Next-Generation Strain): A Technology Revolution By SiGen   II-9
       New Process for Epitaxial Germanium Growth on Silicon Oxide      II-10
       New Technique to Evaluate the Degree of Strain                   II-10
      Technological Barriers                                            II-10
       Faster Adaptation of holistic manufacturing practices: A
        Challenge                                                       II-10
       Controlling Threading Dislocation: A Major Barrier               II-11
      Future Directions: The Shape of Things to Come                    II-11
       To Spearhead the Future Advances in Ultra High-Speed Computing   II-11
       Put a Firm Check on Investment Requirements                      II-12
       Strained Silicon Technology To Spearhead the Future in High-
        Performance Devices                                             II-12
       Project DECISIF                                                  II-12
      Consolidation Gets Underway                                       II-13
       Landmark Deals Announced or Completed by Companies Engaged in
        Strained Silicon and Semiconductor devices, During the Year
         2007 & 2008                                                    II-14
      Competition Scenario                                              II-14
       The Historical Intel-IBM Rivalry                                 II-14
       Intel and AMD Battle it out in the 45-nm Processor Servers
        Market                                                          II-15
       SiGen: The Leader in Silicon-on-Insulator (SOI) Technology       II-15

  2. PRODUCT OVERVIEW                                                   II-16
      Strain Engineering: A Primer                                      II-16
       Uni-Axial Strain and Bi-Axial Strain                             II-16
       Straining Methods                                                II-16
      Strained Silicon Based Technologies                               II-17
       Strained Silicon-Germanium (sSiGe)                               II-17
        Hand in Hand with the Wireless Revolution                       II-18
        Simplified Manufacturing Process                                II-18
       Silicon on Insulator (SOI)/ Strained Silicon on Insulator (sSOI) II-19
        Strained Silicon-on-Insulator (sSOI): The New Industry
         Benchmark                                                      II-19
        SOI Technology Acts as a Complementary to Strained Silicon
         Technology                                                     II-19
        SOI Tests China Waters                                          II-20
      Fabricating Methods of Strained Silicon Transistors               II-20
       Strained Silicon Multi-layer Structures                          II-21
       Advantage of Strained Silicon Multi-layered structure Over
        Others                                                          II-21

  3. PRODUCT & TECHNOLOGY LAUNCHES/ DEVELOPMENTS                        II-22
      Maxim's Single-Conversion Silicon Tuner Replaces Canned Tuner
       for Hybrid Applications                                          II-22
      IQE Expands Manufacturing Processes Portfolio                     II-22
      International Rectifier Launches DirectFET(R) MOSFET Chipset        II-23
      Jazz Semiconductor Introduces SiGe BiCMOS Tech for Next-
       Generation Green Analog ICs                                      II-23
      AWR and austriamicrosystems Launch Process Design Kit for SiGe
       BiCMOS Process Technology                                        II-24
      StrataLight Develops Silicon Germanium (SiGe) Chipset for
       100GbE Transponders                                              II-24
      Tokyo Instruments Develops Basic Technology for Non-
       Destructive Strain-Measuring Instrument                          II-24
      Silicon Genesis Unveils the First 20 mm Solar Cell Foils          II-25
      Silicon Genesis Unveils the New PolyMax(TM) Process Technology       II-25
      Fujitsu Unveils New Power-Saving CMOS Technology                  II-25
      UMC Announces the Launch of 65nm Customer Silicon, Using the
       Proprietary URAM Technology                                      II-26
      Renesas Launches New Affordable Fabrication Technology            II-26
      Renesas Unveils New Technology for SRAM Implementation in 45nm
       Generation Devices                                               II-27
      Epson Commences Large-Scale Production of 0.7inch Full HD HTPS
       Panels                                                           II-27
      Intel and UC Santa Barbara Develops the First Hybrid Silicon
       Laser                                                            II-27
      Maxim Integrated Products Launches DS1091L Silicon
       EconOscillator(TM)                                                  II-28
      Oki Electric Creates Extremely Low Cost-Effective µBOSA Chips
       for FTTH Modules                                                 II-28
      Texas Instruments Launches SiGe Process Based Op-Amps             II-28
      Sony, Toshiba and NEC Electronics Releases High Performance
       System LSI                                                       II-29
      Epson and JSR Pioneers Micro-Liquid Processes                     II-29
      SiGen Presents Single Crystal Silicon Film Transfer on Substrate  II-29

  4. STRATEGIC CORPORATE DEVELOPMENTS                                   II-30
      Silicon Genesis Enters into Agreement with REC                    II-30
      Silicon Genesis and NorSun Enter into Agreement                   II-30
      Soitec Inaugurates New Fab Facility in Singapore                  II-31
      AMCC Enters into Strategic Alliance with Silicon Image            II-31
      CopperGate Communication Acquires the HomePlug AV Business
       from Conexant                                                    II-32
      AMG Invest Acquires Stakes in Graphit Kropfmühl                   II-32
      Globe Specialty Metals Acquires Stakes in Solsil                  II-32
      Intrinsiq Materials Takes Over pSiNutria from pSiVida             II-32
      Permatex Acquires Anaerobicos                                     II-32
      AmberWave Acquires Aonex Technologies                             II-33
      IBM Adopts the QuickCap NX Parasitic Extraction Software from
       Magma                                                            II-33
      IMEC Selects SOI MEMS Technology From Tronics Microsytems         II-33
      Silex System to Acquire Minority Stake in Translucent Photonics   II-34
      LSI Corp Takes Over Tarari                                        II-34
      E-Ton Solar Tech Takes Over ADEMA Technologies                    II-34
      Gintech and MEMC Completes Agreement for Solar Wafer Supply       II-35
      MEMC, Suntech Signs Letter of Intent for Solar Wafer Supply       II-35
      AmberWave Signs License Agreement with LG Siltron on Strained
       Silicon IP                                                       II-35
      ARM Acquires Soisic                                               II-35
      Sumco to Takeover KEM                                             II-36
      Samsung and Siltronic to Construct New Fab Facility               II-36
      ARM Collaborates with Soitec (France)                             II-36

  5. FOCUS ON SELECT GLOBAL PLAYERS                                     II-37
      Advanced Micro Devices, Inc. (USA)                                II-37
      Applied Materials, Inc. (USA)                                     II-37
      ASM International NV (Netherlands)                                II-37
      Atmel Corporation (USA)                                           II-38
      AmberWave Systems Corporation (USA)                               II-38
      Canon, Inc. (Japan)                                               II-39
      CEVA, Inc. (USA)                                                  II-39
      Chartered Semiconductor Manufacturing Ltd (Singapore)             II-39
      Honeywell International, Inc. (USA)                               II-40
      International Business Machines Corp. (USA)                       II-40
      Isonics Corporation (USA)                                         II-40
      Infineon Technologies, AG (Germany)                               II-41
      Intel Corp. (USA)                                                 II-41
      International Rectifier Corp. (USA)                               II-42
      KLA Tencor Corporation (USA)                                      II-42
      Maxim Integrated Products, Inc. (USA)                             II-43
      MEMC Electronic Materials, Inc. (USA)                             II-43
      Micron Technology Inc. (USA)                                      II-43
      Mitsubishi Materials Corporation. (Japan)                         II-44
      NEC Electronics Corporation (Japan)                               II-44
      Oki Semiconductor Company Co. Ltd. (Japan)                        II-45
      Peregrine Semiconductor Corp. (USA)                               II-45
      Renesas Technology Corporation (Japan)                            II-46
      Sandia National Laboratories (USA)                                II-46
      Soitec S. A. (France)                                             II-46
      STMicroelectronics N.V. (Switzerland)                             II-46
      Shanghai Simgui Technology Co., Ltd (China)                       II-47
      Shin-Etsu Handotai Co., Ltd (Japan)                               II-47
      Silicon Genesis Corporation (USA)                                 II-47
      Siltronic AG (Germany)                                            II-48
      Texas Instruments Incorporated (USA)                              II-48
      Toshiba Corporation (Japan)                                       II-48
      Taiwan Semiconductor Manufacturing Company Limited (Taiwan)       II-49
      United Microelectronic Corporation (Taiwan)                       II-49
      Vitesse Semiconductor Corporation (USA)                           II-49


 III. COMPETITIVE LANDSCAPE

     Total Companies Profiled: 66 (including Divisions/Subsidiaries - 70)

     ------------------------------------------
     Region/Country                     Players
     ------------------------------------------
     The United States                     33
     Japan                                 14
     Europe                                12
        France                              2
        Germany                             2
        The United Kingdom                  3
        Rest of Europe                      5
     Asia-Pacific (Excluding Japan)        11
     ------------------------------------------