This report examines and projects the technologies involved, their likely developments, what problems and choices are facing users, and where the opportunities and pitfalls are. The worldwide markets are analyzed and projected.

TABLE OF CONTENTS

Chapter 1 Introduction                                            

1.1   The Need For This Report                                    

Chapter 2 Executive Summary                                       

2.1   Summary of Major Issues                                     
2.2   Summary of Market Opportunities                             

Chapter 3 Lithography Issues And Trends                           

3.1   Optical Systems                                              
      3.1.1 Step-and-Repeat Aligners                               
      3.1.2 248nm DUV Resist                                       
      3.1.3 193nm DUV Resist                                       
      3.1.4 Mix-and-Match                                         
3.1.5 Immersion Lithography                                       
3.1.6 EUV                                                         
3.2 X-Ray Systems                                                  
      3.2.1 X-Ray Sources                                          
      3.2.2 X-Ray Masks                                            
      3.2.3 X-Ray Steppers                                         
      3.2.4 X-Ray Resists                                         
3.3 Electron Beam Systems                                         
3.4 Ion Beam Systems                                               
      3.4.1 Direct Write                                           
      3.4.2 Ion Channel Masking                                    
      3.4.3 Ion Projection                                        
3.5 Nano-Imprint Lithography                                      
3.6 New Technologies                                               
      3.6.1 Mulith Reference Distribution Aerial Image Formation                                     
      3.6.2 Holograms                                     
      3.6.3 X-Ray Laser                                   
      3.6.4 Atom Lithography                              
      3.6.5 Microlenses                                   
      3.6.7 EWL Lithography                              
3.7   Evaluation of Lithography Cost of Ownership         
      3.7.1 Introduction                                 
      3.6.2 Cost of Ownership Model                       
      3.6.3 Results of Cost of Ownership Calculation      
      3.6.4 Individual Cost Estimation                    
            o Lithography System Cost                     
            o Process Costs                               
            o Mask Costs                                 
3.7   Conclusion                                         

Chapter 4 User - Supplier Strategies                     

4.1   Determining Lithography Needs                      
4.2   Benchmarking a Vendor                               
      4.2.1 Pricing                                       
      4.2.2 Vendor Commitment and Attitudes               
      4.2.3 Vendor Capabilities                           
      4.2.4 System Capabilities                           
      4.2.5 Vendor Feedback During Equipment Evaluation   
      4.2.6 Vendor Feedback During Device Production     
4.3   Competitive Environment                            
4.4   Equipment For Class 1 Cleanrooms                   
4.5   Equipment For the Factory of the Future            
4.6   Opportunities                                       
                                       
Chapter 5 Market Forecast                            

5.1   Driving Forces                                  
      5.1.1 Technical Trends                          
      5.1.2 Economic Trends                           
      5.1.3 Optical Limitations                      
5.2   Market Forecast Assumptions                    
5.3   Market Forecast                                 

LIST OF TABLES
                                                     
3.1   Lithography Requirements for IC Production     
3.2   Characteristics of X-Ray Systems               
3.3   Basic Conditions of CoO Model                  
3.4   Calculation List of Lithography System Cost  
3.5   Throughput Estimation of X-Ray Lithography     
3.6   Cost of Reticle/X-Ray Mask                     
3.7   Phase Shift Mask and X-Ray Mask Manufacturing  
5.1   Worldwide Capital Spending 2005 ­ 2011         
5.2   DRAM Lithographic Requirements                 
5.3   Worldwide Optical Stepper Market               
5.4   Worldwide Stepper Market Shares - 1992-2010     
                                     
LIST OF FIGURES
                                                            
1.1    Lithographic Equipment Requirements for DRAMs         
3.1    Lithography Roadmap                                   
3.2    Lens Arrangement For Submicron Features               
3.3    Advanced Optical Lithography Scenarios                
3.4    Mix-and-Match Approaches                              
3.5    High Index Refractive Materials                       
3.6    EUV Lithography                                       
3.7    Illustration of X-Ray Lithography                     
3.8    Schematic Of Scalpel Electron Beam System             
3.9    Multi-Source E-Beam Lithography                       
3.10   Principles of LEEPL                                   
3.11   Ion Projection Lithography System                     
3.12   Hermoplastic Nanoimprint Lithography Process          
3.13   Step And Flash Nanoimprint Lithography Process        
3.14   Mulith Reference Distribution Aerial Image Formation  
3.15   Schematic of Microlens                                
3.16   Mapper Mask-Based Lithography                         
3.17   Mapper Maskless Lithography                           
3.18   CoO Value in DRAM Mass Production                     
3.19   Lithography Costs for 40,000 Wafers/Mask              
3.20   Lithography Costs for 1,000 Wafers/Mask               
4.1    Manufacturing Costs Per Exposure Station              
5.1    Lithography Market Vs Equipment Market                
5.2    Lithography Double Exposure Technique                 
5.3    Lithography Requirements                              
5.4    Lithography Extensions                                
5.5    Lithography Cost of Ownership                         
5.6    Segmentation of Stepper/Scan Shipments                
5.7    Market Shares of Vendors (Units) - 2010               
5.8    Unit Market Shares of Vendors - 1992-2010             
5.9    Worldwide I-Line Market Shares ­ 2010                 
5.10   Worldwide 248nm Market Shares ­ 2010                  
5.11   Worldwide 193nm Dry Market Shares ­ 2010              
5.12   Worldwide 193nm Wet Market Shares ­ 2010              
5.13   Market Shares of Vendors (Revenues) - 2010