This report investigates the technology trends, applications, and market developments of GaAs ICs. U.S., Japanese, and European applications such as telecom, computers, defense, consumers, are reviewed. This report will provide the reader with an in-depth understanding of the technological and market factors determining the evolution of GaAs ICs.

TABLE OF CONTENTS

Chapter 1 Introduction                        

Chapter 2 Executive Summary                   

2.1   Summary of Major Issues                 
2.2   Summary of Market Forecast              

Chapter 3 Technology Issues                   

3.1   GaAs Devices                             
      3.1.1 FETs                               
      3.1.2 HEMTs                              
      3.1.3 HBT                               
3.2   Comparison of Logic Structures           
      3.2.1 Buffered FET Logic                 
      3.2.2 FET Logic                          
      3.2.3 Capacitively Enhanced Logic        
      3.2.4 Direct-Coupled FET Logic           
      3.2.5 Source-Coupled FET Logic          
3.3   Material Issues                          
      3.3.1 Wafer Production                   
      3.3.2 Etch Pit Densities                
3.4   Equipment                                
      3.4.1 Implanters                         
      3.4.2 Lithography                        
      3.4.3 Etching                            
      3.4.4 Deposition                         
      3.4.5 Rapid Thermal Processing          
3.5   Packaging                                
      3.5.1 Package Types                                                       
      3.5.2 Bonding                                       
3.6   Testing                                             
3.7   Design                                              

Chapter 4 Applications for GaAs ICs                       

4.1   Introduction                                         
      4.1.1 The Trend Toward Higher Frequencies            
      4.1.2 Transition from Analog to Digital Modulation   
      4.1.3 Discrete Components and Silicon-Based ICs     
4.2   Markets                                              
      4.2.1 Telecommunications Systems                     
      4.2.2 Television Systems                             
      4.2.3 Computing                                      
      4.2.4 Data Communications                            
      4.2.5 Automotive                                     
      4.2.6 Automated Test Equipment                       
      4.2.7 Military                                      

Chapter 5 IC Supplier and End-User Issues                 

5.1   Introduction                                        
5.2   Competing Against Silicon                           
5.3   Competing Against The Japanese                      
5.4   Taiwan's Market Momentum                            
5.5   Korea's Market Momentum                             
5.6   Wafer Sizes                                         
5.7   Competing Against SiGe                               
      5.7.1 Introduction                                   
      5.7.2 Technology                                     
            5.7.2.1 Strained Silicon                       
            5.7.2.2 Device Manufacturing                   
      5.7.3 Applications                                   
            5.7.3.1 Wireless LAN                           
            5.7.3.2 WiMAX                                  
            5.7.3.3 Bluetooth                              
            5.7.3.4 Cellular                               
            5.7.3.5 GPS                                    
                                      
Chapter 6 Market Forecast                                        

6.1    Driving Forces                                            
6.2    Market Forecast Assumptions                             
6.3    GaAs IC Market Forecast                                   
6.4    SiGe IC Market Forecast                                   
6.5    End Application Market                                    

Chapter 7 Profile of GaAs IC Manufacturers                        


LIST OF TABLES

                                                                
5.1    Cost Comparison for GaAs Structures                      
5.2    A Comparison of SiGe BiCMOS, RF CMOS, and InGaP/GaAs
6.1    Worldwide Merchant GaAs IC Market Forecast By Device Type
6.2    Worldwide Merchant Market Forecast By Geographical Region
6.3    Worldwide Merchant Market Forecast By Application        
6.4    Market Shares of Merchant Participants - 2010            
6.5    A Comparison of SiGe BiCMOS, RF CMOS, and InGaP/GaAs 


LIST OF FIGURES

                                                                 
3.1    Schematic of GaAs MESFET                                  
3.2    Schematic of GaAs HEMT Device                             
3.3    Schematic of GaAs HBT Device                              
3.4    Schematic of GaAs HBT Device                              
3.5    Symbolic Representations of Various GaAs Transistor Type  
3.6    Schematic of BFL Logic Gate                               
3.7    Schematic of FETL Logic Gate                              
3.8    Schematic of CEL Logic Gate                               
3.9    Schematic of DCFL Logic Gate                              
3.10   Schematic of SCFL Logic Gate                                                                     
3.11   Full wafer EPD mapping of LEC and VGF wafers            
3.12   Mesoscopic EL2 mapping of LEC and VGF wafers            
3.13   pHEMT MMIC Process Flow Chart                           
3.14   0.15 Micron 3MI Process Cross Section                   
3.15   InGaP HBT Process                                       
5.1    Comparison of Die Costs of Si and GaAs                 
5.2    Strained Silicon Germanium Technology                   
5.3    Fourth Generation Of Strain Technology                  
5.4    Performance Versus Germanium Content                    
5.5    Bulk Versus SOI Strain Method                           
6.1    Worldwide Merchant GaAs IC Market Forecast              
6.2    Worldwide GaAs Merchant Market Forecast By Geographical Region                                     
6.3    Worldwide GaAs Merchant Market Forecast By Application  
6.4    Global Handset Market                                   
6.5    Migration Of PA's In Handset Market                     
6.6    CMOS Replacement Of Bipolar And GaAs                    
6.7    Worldwide SiGe Market Forecast