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The Global MEMS Device, Equipment, and Materials Markets: Forecasts and Strategies for Vendors and Foundries

Price:
USD $2,495.00
ISBN/SKU #:
TIN8800
Research Group:
Information Network
Date of Publication:
April 2012

Summary

A significant portion of MEMS manufacturing technology has come from the IC industry. MEMS devices can be made using silicon wafers and the manufacturing process can incorporates semiconductor manufacturing processes such as sputtering, deposition, etching and lithography. This report analyzes the market for MEMS devices and the equipment and materials to make them.

TABLE OF CONTENTS

Chapter 1    The MEMS Market Infrastructure                 

Chapter 2    Forecast Of The Key Applications And Markets   

2.1 MEMS Device Market Forecast                             
2.1.1 Ink Jet Head                                          
2.1.2 Pressure Sensor                                       
2.1.3 Silicon Microphone                                    
2.1.4 Accelerometer                                         
2.1.5 Gyroscope                                             
2.1.6 MOEMS                                                 
2.1.7 Micro Display                                         
2.1.8 Microfluidics                                         
2.1.9 RF MEMS                                               
2.1.10 Micro Fuel Cells                                     
2.1.11 Emerging Applications                                
2.2 MEMS System Market Forecast                             

Chapter 3    Markets for Equipment and Materials Suppliers  

3.1     Introduction                                        
3.2     MEMS Equipment Markets                              
3.2.1   Assembly                                            
3.2.2   Bonding                                             
3.2.3   Cleaning                                            
3.2.4   Deposition                                          
3.2.5   Dicing                                              
3.2.6   Etching                                             
3.2.7   Laser Micromachining                                
3.2.8   Lithography                                                                           
3.2.9 Metrology/Inspection                      
3.2.10 Testing                                  
3.2.11 Thermal Treatment                        
3.2.12 Wafer Thinning                           
3.3 MEMS Material Markets                       
3.3.1 Chemicals                                 
3.3.2 Photomasks                               
3.3.3 Substrates                                

Chapter 4   MEMS Foundries                      

4.1 Foundry Profiles and Strategies             
4.1.1 Advanced Microsensors                     
4.1.2 Agiltron                                  
4.1.3 Asia Pacific Microsystems                 
4.1.4 Beijing First MEMS                        
4.1.5 Bosch                                     
4.1.6 China Resources Semiconductor             
4.1.7 Colibrys                                  
4.1.8 C2V                                       
4.1.9 Dai-Nippon Printing                       
4.1.10 Dalso                                    
4.1.11 ELMOS                                    
4.1.12 Freescale.                               
4.1.13 Honeywell MEMSplus                       
4.1.14 Infineon Technologies SensoNor As        
4.1.15 Institute of Microelectronics            
4.1.16 Innovative Micro Tech                    
4.1.17 Integrated Sensing Systems Inc. (ISSYS)  
4.1.18 LioniX                                   
4.1.19 MEMS Engineering and Material            
4.1.20 MEMSCAP                                  
4.1.21 MEMS Optical                             
4.1.22 Micralayne                                                                    
4.1.23 Midwest MicroDevices, LLC                              
4.1.24 Nanostructures Inc                                     
4.1.25 Norcada Inc.                                           
4.1.26 Olympus                                                
4.1.27 Omron                                                  
4.1.28 Proton Mikrotechnik                                    
4.1.29 Renasas Eastern Japan Semiconductor                    
4.1.30 Semiconductor Manufacturing International Corporation  
4.1.31 SEMEFAB                                                
4.1.32 Sanyo                                                  
4.1.33 Silex Microsystems                                     
4.1.34 Sony                                                   
4.1.35 ST Microelectronics                                    
4.1.36 SVTC Technologies                                      
4.1.37 Taiwan Semiconductor Manufacturing Co Ltd (TSMC)       
4.1.38 Texas Instruments                                      
4.1.39 Touch Microsystems                                     
4.1.40 Tronics Microsystems                                   
4.1.41 X-Fab                                                  
4.2 Small-Mid-Sized Companies                                 

Chapter 5   Factors for Foundry Success                       

5.1.1 Achieving Economies Of Scale                            
5.1.2 Competitive Advantages                                  
5.1.3 Core Strengths                                          
5.1.4 Employee Commitment                                     
5.1.5 Expansion Plans                                         
5.1.6 Financial Objectives:                                   
5.1.7 Groundbreaking MEMS Solutions                           
5.1.8 In- House Expertise in MEMS Testing And Reliability     
5.1.9 Leadership in Technology                                
5.1.10 Manufacturing Excellence                               
5.1.11 Manufacturing Process                                                                       
5.1.12 Mastering Process and Production Technology  
5.1.13 Patent Protection                            
5.1.14 Partnerships                                 
5.1.15 Products                                     
5.1.16 Proprietary Development Processes            
5.1.17 Sales Organization                           
5.1.18 Sales Process and Customer Base              
5.1.19 Strong Customer Relations                    
5.1.20 Vision and Goal                              

Chapter 6   Critical MEMS Issues                    

6.1   3-D Interconnects and Packaging               
6.2   Wafer Size                                    
6.3   MEMS Testing                                  
6.4   Opportunities For Fabless MEMS Companies       

                                    
LIST OF TABLES
                                                       
4.1    Top MEMS Foundries by Revenues                   

LIST OF FIGURES
                                                     
2.1    MEMS Markets (2006-2013)                        
2.2    Ink Jet Head Sales Forecast 2006-2013           
2.3    Pressure Sensor Sales Forecast 2006-2013        
2.4    Silicon Microphone Sales Forecast 2006-2013     
2.5    Accelerometer Sales Forecast 2006-2013          
2.6    Gyroscope Sales Forecast 2006-2013              
2.7    MOEMS Sales Forecast 2006-2013                  
2.8    Micro Display Sales Forecast 2006-2013          
2.9    Microfluidics Sales Forecast 2006-2013          
2.10   RF MEMS Sales Forecast 2006-2013                
2.11   Micro Fuel Cells Sales Forecast 2006-2013       
2.12   Emerging Applications Sales Forecast 2006-2013  
2.13   Automotive System Sales Forecast 2006-2013      
2.14   Aeronautics System Sales Forecast 2006-2013     
2.15   Consumer System Sales Forecast 2006-2013        
2.16   Defense System Sales Forecast 2006-2013         
2.17   Industrial System Sales Forecast 2006-2013      
2.18   Medical System Sales Forecast 2006-2013         
2.19   Telecom System Sales Forecast 2006-2013         
3.1    Discrete Assembly of MEMS                       
3.2    Assembly Equipment Sales Forecast 2006-2013     
3.3    Bonding Equipment Sales Forecast 2006-2013      
3.4    Cleaning Equipment Sales Forecast 2006-2013     
3.5    Deposition Equipment Sales Forecast 2006-2013                                      
3.6    Dicing Equipment Sales Forecast 2006-2013                         
3.7    Schematic Of DRIE                                                 
3.8    Etching Equipment Sales Forecast 2006-2013                        
3.9    Laser Micromachining Equipment Sales Forecast 2006-2013           
3.10   Driving Principle Of The MOR (a) Parallel State (B) Tilted State  
3.11   Lithography Equipment Sales Forecast 2006-2013                    
3.12   Metrology/Inspection Equipment Sales Forecast 2006-2013           
3.13   Testing Equipment Sales Forecast 2006-2013                        
3.14   Thermal Treatment Equipment Sales Forecast 2006-2013              
3.15   Wafer Thinning Equipment Sales Forecast 2006-2013                 
3.16   Chemicals Sales Forecast 2006-2013                                
3.17   Photomasks Sales Forecast 2006-2013                               
3.18   Substrates Sales Forecast 2006-2013                               
6-1    Process For Capping MEMS                                          
6-2    Examples Of Thermoplastic Cavity Packages                         
6.3    Fluidic Packaging System                                          
6.4    Forecast of Wafer Size                                            
6-5    Fluidic Packaging System                                          

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