Major changes are now taking place in the IC manufacturing base! The worst recession in 63 years in 2009 led to a record amount of wafer fab capacity being taken off-line in 2009 and 2010 as companies did what they could to survive by closing older fabs, adopting the fabless or fab-lite business model, and consolidating.

The number of companies able to afford the cost of a new advanced fab continues to dwindle, causing greater reliance on foundries for producation capacity. While the foundries have served the industry very well, such high reliance on few manufacturers has caused some uneasiness in the industry. This situation will become even more precarious when the 300mm-450mm wafer transition takes place in the next few years.

The newly updated Global Wafer Capacity Report is an ideal tool for understanding the "new realities" of the market. This study will greatly assist IC material and equipment suppliers in creating long-term strategic marketing plans, especially when it comes to determining which IC manufacturers stand the best chance to remain in the business of fabricating ICs.

The Global Wafer Capacity report is based on a propietary database that lists 400 individaul IC fabrication facilities representing 112 companies.

This study offers a detailed breakdown of the IC industry's wafer fab capacity as it stood at the mid-point of 2011 and then forecasts capacity for each year through 2016. The data were compiled, summarized, and extended into the future using both bottom-up and top-down research methodologies. Surveys of hundreds of fabs from around the world formed the basis for analyzing the IC industry's current capacity status. Future projections were based on both survey results and overall economic forecast for the IC industry.

Samples of the More Than 50 Charts and Tables

    112 IC Manufacturers Included in the Data Compilation
    Top 25 Worldwide Semiconductor Capital Spending Leaders
    Annual Capacity, Wafer Start, and Utilization History and Forecast
    49 IC Fabs Closed During 2009-2011
    Worldwide Installed Capacity Trends
    Worldwide Installed Capacity Yr/Yr Changes in Volume
    Quarterly IC Capacity Utilization
    Wafer Capacity Leaders as of Mid-2011
    Capacity Leaders' Shares of Total WW Capacity
    Capacity Leaders per Geographic Region
    Existing WW Installed Capacity by Geographic Region
    Regional Installed Capacity by Wafer Size
    Installed Capacity for Each Wafer Size by Region
    Seismically Risky IC Idustry Capacity
    Seismically Active Pure-Play Foundry Capacity
    Installed Capacity by Region Forecast
    Existing WW Installed Capacity by Wafer Size
    Capacity Leaders per Wafer Size
    300mm Wafer Fab Count
    300mm Wafer Fabs Dedicated to Processing "Non-IC" Devices
    300mm Wafer Capacity Leaders as of Mid-2011
    "Power" Ranking of the 300mm Wafer Capacity Leaders in 2011
    300mm Wafer Capacity Leaders Forecast
    Number of Companies with 200mm vs. 300mm Fabs
    Latest 450mm Wafer Developments
    Potential 450mm Wafer Owners
    Installed Capacity by Wafer Size Forecast
    Existing WW Installed Capacity by Process Technology
    Regional Installed Capacity by Process Technology
    Existing WW Installed Capacity by Minimum Geometry
    Regional Installed Capacity by Minimum Geometry
    Installed Capacity Leaders per Minimum Geometry
    Installed Capacity by Geometry Forecast
    SICAS' Historical Wafer Capacity by Dimensions
    Existing WW Installed Capacity by Product Type
    IC Devices Contained Within Each Product Category
    Foundry Capacity by IC Device Type
    Regional Installed Capacity by Product Type
    Installed Capacity by Product Forecas
    Capital Spending as a Percent of Sales

Addendum I: 300mm Wafer Manufacturer Profiles

Profiles of the world's IC manufacturers using 300mm wafers, with extra emphasis placed on each company's strategy with regard to existing 300mm fabs and the potential for additional 300mm fabs in the future.

Addendum II: Detailed Fab Specifications Provided

For each of the nearly 400 fab facilities surveyed for this study, detailed specifications are provided in this addendum.

The specifications include:

• Company Name Fab Name
• Fab Location (city, state, province, prefecture, county, etc).
• Date Opened
• Wafer Size (mm)
• Wafer Capacity (wafers/month) as of Jul-2011 and Planned Maximum Capacity
• Process(es) Ran
• Minimum Geometry of Processes
• Product(s) Fabricated

TABLE OF CONTENTS

Introduction

Overall Capacity Trends
Semiconductor Capital Spending Leaders
History and Forecast for Wafer Capacity, Starts, and Utilization
Installed Capacity Leaders in Mid-­‐2011

Capacity by Geographic Region
Existing Capacity by Geographic Region and by Wafer Size
The Great East Japan Earthquake Exposed Capacity Risks
Future Capacity by Geographic Region

Capacity by Wafer Size
Future Capacity by Wafer Size
300mm Wafer Fab Capacity Details
300mm Wafer Capacity Leaders
300mm “Power” Ranking
2016 300mm Capacity Leaders Forecast
300mm Wafer Capacity Leader Profiles
450mm Wafer Progress

Capacity by Process Technology

Capacity by Minimum Geometry
Regional Distribution of Existing Capacity by Minimum Geometry
Future Capacity by Minimum Geometry

Capacity by Product Type
Regional Distribution of Existing Capacity by Product Type
Future Capacity by Product Type

Conclusion
Spending as a Percent of Sales
Capital Spending Summary
Major Changes to the Manufacturing Base

Addendum I (300mm Wafer Manufacturer Profiles)
Samsung
A3
Intel
Hynix
Toshiba/SanDisk
Micron
TSMC
Elpida
Nanya
Powerchip
GlobalFoundries
UMC
ProMOS
SMIC
Texas Instruments
IBM
Other Companies of Interest

Addendum II (Fab Facility Specifications)