The Merchant Embedded Computing Market - 2011 Edition report analyzes the performance of the industry through 2015. Although, there are several hundred companies, most are fairly small in revenue and highly specialized, focusing on specific application segments with unique product requirements. The report tracks and analyzes four application markets, nine bus architectures and four form factors. Specific trends and issues of the forecast by application, bus architecture and form function are covered in detail in the report.

Whereas the overall MEC market is slowly recovering from the trauma of 2009's economic meltdown, the performance of various market segments, bus architectures, and companies will recover at different rates. Total revenue was just under $5 billion in 2010, a 4 percent increase from 2009 revenue which had a 12-14 percent decrease over 2008. If the economies worldwide hold together, the MEC industry will likely recover at about 6 percent in 2011 to ~$5.2 billion.

The MEC report targets five specific application markets: Communications, Industrial, Medical, Military/aerospace and an Other category that includes transportation, security, surveillance, pointof-sale/kiosk applications, etc. The Communication wireless segment is being driven by smart phone traffic. 3g 4g services are where the money is for carriers going forward and the wireline and optical networks are gearing up for upgrades to support the ever increasing traffic. Industrial got hammered down with the financial crisis that also took its toll aerospace, and automotive that use MEC systems to automate productions testing and process control.

The Medical segment was hit hard by the financial crisis which made purchasing MEC-based, large equipment much more difficult. This coupled with the USA changing political climate on health care also stalled out demand. The ever healthy Mil/Aero segment also caught the financial virus and is facing a rapidly declining defense department budget in the USA that is likely to cause a restructuring not seen since the end of the cold war.

Each architecture has a different rate of adoption depending on the needs of individual application segments. Overall key trends are 'Power is up and down; Green is the new color; and small is big'.

New 40 and 32-nm silicon for microprocessors, graphics, DSPs and high integration I/O chips pack a lot of processing power while greatly reducing power consumption. High integration silicon and serial buses enable more small form factors (SFF) than in the past and are making many older, parallel bus structures, such as PCI, look like the bus architecture equivalent of a 'clunker'. Bus structures continue to proliferate around the major and long established busses but the number of variances is past 100.

The MEC industry can be sep arated into uses four form functions defined as: single board computers (SBC), digital signal processors (DSP) boards, I/O boards and an All Other category that incorporate a huge number of diverse and specific functions. In some applications I/O boards are proliferating and are customized to the wide spectrum of I/O functions that different applications use. In other applications, single board computers are becoming the trend as they incorporate more and more functionality with advanced silicon and draw in DSP, graphics and many advanced I/O functions

Technical Trends
- PCI Slot
- CompactPCI
- AdvancedTCA
- CompactTCA
- AdvancedMC
- MicroTCA
- COM
- SFF
- VMEbus
- PMC
- PC/104
- Intel & VIA Motherboards

Industry Structure
- Total Available Market
- Competitive Strategies
- Corporate Relations

Industry Analysis and Forecast, 2002-2015
- Market Analysis
- Architectures
- Board Functions
- Processors

 
TABLE OF CONTENTS

Chapter 1: Introduction

Chapter 2: Executive Summary

Chapter 3: Technical Trends
- VMEbus (PMC, 2eSST, PCI-X, etc.)
- PCI, Compact PCI
- Advanced TCA, Compact TCA, MicroTCA
- Advanced MC, PC/104
- Intel and VIA Motherboards
- (ATX, MicroATX, FlexATX, BTX, Mini-ITX,
- Nano-ITX, Pico-ITX)
- COM (ETX, COM Express, XTX, Rugged
- COM, Qseven, Other COM)

Chapter 4: Industry Structure
- Global Economic Factors
- Total Available Market
- Communications
- Industrial
- Medical
- Military/Aerospace
- Transportation
- Other
- Competitive Strategies
- Corporate Relations
- Standards
- Multi-Core Effect
- Proliferation

Chapter 5: Industry Analysis and Forecast
- Revenue by Application
- Communications Industrial
- Medical Military/Aerospace
- Transportation All Other
- Revenue by Bus Architecture
- PCI, Compact PCI, AdvancedTCA,
- VMEbus, PMC, AdvancedMC, MicroTCA,
- PC/104, COM, Other
- Revenue by Function
- SBC, DSP, I/O Boards/Modules and Other
- Revenue by Processor
- APUs, MPUs, DSPs, GPUs, FPGAs, OS, Other
- ASPs and Units

Chapter 6: Company Profiles
- AAEON
- AcQ Inducom
- Acromag
- Acrosser
- ADLINK
- AdvancedIO Systems
- Advantech
- Aitech
- AMD
- ARBOR Technology
- AudioCodes
- Avalue Technology
- AXIOMTEK
- BittWare
- Concurrent Tech
- congatec AG
- Connect Tech
- Continuous Computing
- Cornet Technology
- Critical I/O
- Curtiss-Wright CEC
- Cyclone Microsystems
- Data Device
- Dialogic
- Diamond Systems
- DIGITAL-LOGIC
- Diversified Technology
- DSM Computer
- Dynatem
- E.E.P.D.
- ELTEC
- Embedded Planet
- Emerson
- Eurotech
- EVOC Intelligent Tech
- Extreme Engineering
- Fastwel
- GE Fanuc
- General Micro Systems
- I-Bus
- IBASE Technology
- IEI Tech
- Interface Concept
- Interphase
- ITOX
- Kontron
- Lanner
- LiPPERT
- Lyrtech
- Magma
- MEN Mikro
- Mercury Computer
- Micro/Sys
- MPL
- N.A.T.
- Nallatech
- National Instruments
- NEXCOM
- Octagon Systems
- One Stop Systems
- Pentek Performance
- Tech
- PFU Systems
- Portwell
- RadiSys
- RTD Embedded Tech
- SECO
- SKY Computers
- Sun Microsystems
- Technobox
- TEK Microsystems
- TEWS
- Themis Computer
- Trenton Technology
- VadaTech
- VersaLogic
- VIA Technologies
- WinSystems
- Xembedded

Partial List of Tables and Figures
- Communications OEM Markets
- Industrial OEM Markets
- Medical OEM Markets
- Military/Aerospace OEM Markets
- Communications Forecast by Subsegment
- Communications Forecast by Bus Architecture
- Communications Forecast by Board Function
- Industrial Forecast by Subsegment
- Industrial Forecast by Bus Architecture
- Industrial Forecast by Board Function
- Medical Forecast by Bus Architecture
- Medical Forecast by Board Function
- Military/Aerospace Forecast by Bus
- Architecture Military/Aerospace Forecast by
- Board Function Application Market Summary
- Forecast
- PCI Forecast by Application Market
- PCI Forecast by Board Function
- CompactPCI Forecast by Specification
- CompactPCI Forecast by Application Market
- CompactPCI Forecast by Board Function
- AdvancedTCA Forecast by Specification
- AdvancedTCA Forecast by Application Market
- AdvancedTCA Forecast by Board Function
- VMEbus Forecast by Specification
- VMEbus Forecast by Application Market
- VMEbus Forecast by Board Function
- PMC Forecast by Application Market
- PMC Forecast by Board Function
- AdvancedMC and MicroTCA Forecast
- by Specification
- AdvancedMC and MicroTCA Forecast
- by Application Market
- AdvancedMC and MicroTCA Forecast
- by Board Function
- PC/104 and Motherboard Forecast
- by Application Market
- PC/104 and Motherboard Forecast
- by Board Function
- COM Forecast by Application Market
- COM Forecast by Board Function
- Bus Architecture Summary Forecast
- SBC Forecast by Application Market
- SBC Forecast by Bus Architecture
- DSP Forecast by Application Market
- DSP Forecast by Bus Architecture
- I/O Forecast by Application Market
- I/O Forecast by Bus Architecture Board
- Function Summary Forecast
- SBC Revenue by CPU Vendor
- DSP Board Revenue by DSP Vendor