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The Worldwide IC Packaging Market

Price:
USD $3,495.00
ISBN/SKU #:
NVR1740
Research Group:
NVR
Date of Publication:
May 2012
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Summary

Following a year of unprecedented growth in 2010 (IC revenue grew 40.6% while units expanded 35.5%), 2011 experienced a slight downturn in the second half of the year. Semiconductor industry growth is expected to expand by only 4% in 2012 but take an upward path thereafter. Overall the IC market is being driven by demand for handheld consumer devices and the adjoining infrastructure. The automobile industry has recovered, which are laden with semiconductor devices, yet supply has been dampen with the tsunami flooding of Japan and Thailand. The economic uncertainty of Europe and developments in the Arab Spring are other affecting factors. This report analyzes the semiconductor industry and uses this analysis to forecast the future of the global IC packaging market. The report begins with an economic and industry overview, historic and future unit and revenue graphs, and a SATS company overview.

Following this high-level review, the report presents forecasts for each semiconductor product type, and segments these products by package family and I/O count range. Packaging revenue figures are displayed for each segment, based on prices charged in the contract assembly market. The package families are then rolled up by I/O count and semiconductor product. In doing so, the report generates the total value of the IC packaging industry. Next, the report presents extensive coverage of the packaging contractor market. Packaging contractors will continue to assume a larger share of the world's IC packaging business. The report breaks the contractor market down by package families and major product categories providing units and revenue for each category. To help you further assess this group of companies, the report profiles the activities of the world’s largest contractors and the packages they offer.  This report will provide you with an effective and economical tool for assessing the future of this market. The report sells for $3495 and is delivered by email as a single-user PDF file. With the purchase of the report, an Excel spreadsheet of all tables may be obtained for an additional $750.


TABLE OF CONTENTS

Chapter 1: Introduction

Chapter 2: Executive Summary

Chapter 3: The State of the Industry

Economic Overview
Industry Overview
SATs Company Overview

Chapter 4: IC Package Forecast by Product
MPU
MCU
DSP
DRAM
Flash
SRAM
ROM and EPROM
EEPROM/Other Memory
Digital Bipolar
Standard Logic
Gate Arrays
Cell-Based and PLD
Display Drivers
Custom Logic
Amplifiers
Interfaces
Voltage Regulators
Data Converters
Custom Analog

Chapter 5: IC Package Forecast by Package Family
DIP
SOT
SO
TSOP
DFN
CC
QFP
QFN
PGA
BGA
FBGA
WLP
DCA

Chapter 6: Packaging Contractor Market
Market Overview
Forecasts by Package Family
DIP
SOT
SO
TSOP
DFN
CC
QFP
QFN
PGA
BGA
FBGA
WLP

Unit, Revenue, and Pricing Forecasts
Forecast by Product
Contractor Rankings

Chapter 7: Company Profiles
Amkor
Anst China
ASE
Azimuth
Carsem
ChipMOS
Cirtek
CORWIL Technology
FlipChip Int’l
Hana
Hana Micron
I2A
IDS Electronics
Jiangsu Changjiang
Lingsen Precision
Millennium Microtech
Naito Densei Kogyo
NANIUM
Nantong Fujitsu
OSE
Powertech
Shinko Electric
Signetics
Sigurd
Siliconware
SPEL
STATS ChipPAC
Tianshui Huatian Tech
Unisem
UTAC
Vigilant Technology
XinTec

Appendix A: Contractor Packages
Appendix B: Contractor Website Guide
Appendix C: Glossary

 

Partial List of Figures and Tables
IC Unit Forecast
IC Revenue Forecast
IC Packaging Revenue Forecast
Price per I/O by Package Family
Package Price Forecasts
IC Product Forecasts
MPU
MCU
DSP
DRAM
Flash
SRAM
ROM and EPROM
EEPROM/Other Memory
Digital Bipolar
Standard Logic
Gate Arrays
Cell-Based and PLD
Display Drivers
Custom Logic
Amplifiers
Interfaces
Voltage Regulators
Data Converters
Custom Analog

DIP Forecasts—3 I/O Ranges
SOT Forecasts
SO Forecasts—3 I/O Ranges
TSOP Forecasts—3 I/O Ranges
DFN Forecasts—2 I/O Ranges
CC Forecasts—2 I/O Ranges
QFP Forecasts—2 I/O Ranges
QFN Forecasts—4 I/O Ranges
PGA Forecasts—2 I/O Ranges
BGA Forecasts—3 I/O Ranges
FBGA Forecasts—5 I/O Ranges
WLP Forecasts—4 I/O Ranges
DCA Forecasts—5 I/O Ranges
Total IC Packaging Revenue
Contractor Total Forecast
Contractor DIP Forecast
Contractor SOT Forecast
Contractor SO Forecast
Contractor TSOP Forecast
Contractor DFN Forecast
Contractor CC Forecast
Contractor QFP Forecast
Contractor QFN Forecast
Contractor PGA Forecast
Contractor BGA Forecast
Contractor FBGA Forecast
Contractor WLP Forecast
Packaging Contractor Rankings


Additional Information

PDF File via E-mail.
Number of Pages: 425

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