This report analyzes the worldwide markets for Thermal Management Technologies (Heat Sinks) in Millions of US$. The report on ‘Thermal Management Technologies (Heat Sinks)’ analyzes the Heat Sinks market by the following product segments: Metal Extruded Heat Sinks, Stamped Heat Sinks, Bonded or Fabricated Fin Heat Sinks, and Folded Fin Heat Sinks. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual forecasts are provided for each region for the period of 2006 through 2015. The report profiles 180 companies including many key and niche players worldwide such as Aavid Thermalloy, LLC, Aerocool Advanced Technologies Corp., ADDA Corp., Advanced Thermal Solutions, Inc., Ajigo Corp., Akasa Group, Alpha Company Ltd., Asia Vital Components Co. Ltd., ASUSTeK Computer Inc., Chaun Choung Technology Corp., Cooler Master Co. Ltd., Dynatron Corp., Enertron Inc., GlacialTech, Inc.. JMC Products, Inc., Melcor Corp., Neng Tyi Co. Ltd., Polo Tech Co. Ltd., R-Theta Thermal Solutions, Inc., Radian Heat Sinks, Sumitomo Electric Industries, Ltd., Swiftech, Taisol Electronics Co. Ltd., TennMax United, Thermal Integration Technology, Inc., Thermacore, Thermalright, Inc., Thermaltake Technology Co., Ltd., Titan Computer Co. Ltd., Verax Ventilatoren GmbH, Vette Corp., and Wakefield Thermal Solutions, Inc.  Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.

TABLE OF CONTENTS 

THERMAL MANAGEMENT TECHNOLOGIES (HEAT SINKS)       	MCP-1570
A GLOBAL STRATEGIC BUSINESS REPORT


                                             CONTENTS

  I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

      Study Reliability and Reporting Limitations                       I-1
      Disclaimers                                                       I-2
      Data Interpretation & Reporting Level                             I-3
      Quantitative Techniques & Analytics                               I-3
      Product Definitions and Scope of Study                            I-3
       Metal Extruded Heat Sinks                                        I-4
       Stamped Heat Sinks                                               I-4
       Bonded or Fabricated Fin Heat sinks                              I-4
       Folded fin Heat Sinks                                            I-4
       Computers                                                        I-5
       Telecommunication                                                I-5
       Medical                                                          I-5
       Industrial Electronics                                           I-5
       Aerospace/Military                                               I-5
       Consumer Electronics                                             I-6
       Automotive                                                       I-6


 II. EXECUTIVE SUMMARY

  1. INDUSTRY OVERVIEW                                                  II-1
      Thermal Management - A Critical Function                          II-1
      Global Thermal Management Solutions Market: An Overview           II-1
       Heat Sinks - Market Outlook                                      II-2
        Heat Sinks Market Estimates and Forecasts by Region             II-2
        Heat Sinks Market Estimates and Forecasts by Product Segment    II-2
        Heat Sinks Market Estimates and Forecasts by End-use Segment    II-2

  2. MARKET TRENDS AND ISSUES                                           II-3
      Technological Advancements Drive Growth in Heat sink Market       II-3
      PC Market Stimulates Growth                                       II-3
      Pricing Trends in the Heat sinks Market                           II-3
      Hybrid Technologies Gaining Popularity Over Traditional Heat
       Sinks                                                            II-4
      Polymers: The Future in Heat Sink Technology                      II-4
      Liquid Cooling: The Next Big Thing in Thermal Technology          II-4

  3. INNOVATIONS IN HEAT SINK TECHNOLOGY                                II-6
      New Aluminum Silicon Carbide (AlSiC) Heat Sinks                   II-6
      Heat sink System for Circuit Boards                               II-6
      Heat Sink BGA Package                                             II-6
      New Mounting Assembly for Heat Sink                               II-6
      Dual Material Heat Sinks                                          II-7
      New Heat Sink, Interfacing Multiple Components                    II-7
      Heat Sinks with Fins                                              II-7
      New Fastening Structure Method For Heat Sinks                     II-7
      New Heat Sink Attached to the Module with Adhesive                II-8
      New Method to Set Up Posts on Heat Sinks                          II-8
      New Heat Sink System for Circuit Boards Developed                 II-8
      New Bi-level Heat Sinks                                           II-8
      New Ceramic-based Heat Sink                                       II-9
      Heat Sink Attached to Two Separate PCBs                           II-9
      New Heat Sink Bonds with Dielectric Material                      II-9

  4. PRODUCT OVERVIEW                                                   II-10
      Heat Sinks                                                        II-10
      Composition and Structure of a Heat Sink:                         II-10
       Comparison between Aluminum and Copper by Physical Parameters
        - Thermal Conductivity, Cost, Weight, Production Method and
         Pressure on mounting devise                                    II-11
      Usage Criteria for a Heat sink                                    II-11
      Necessity of a Heat Sink:                                         II-12
      Characteristics of an Ideal Heat Sink                             II-12
      Measuring and Boosting the Thermal Performance of a Heat Sink     II-12
      Classification of Heat Sinks                                      II-13
       Active Heat Sink                                                 II-13
        Characteristics of an active Heat Sink                          II-13
       Passive Heat Sink                                                II-14
        Extruded Heat Sinks                                             II-14
        Stamped Heat sinks                                              II-14
        Bonded or Fabricated Fins                                       II-15
        Folded Fins                                                     II-15
        Castings                                                        II-15
       Comparing Active and Passive Heat Sinks                          II-15

  5. END USE APPLICATIONS OF HEAT SINKS                                 II-16
      Computers                                                         II-16
      Telecommunication                                                 II-17
      Medical                                                           II-17
      Industrial Electronics                                            II-17
      Aerospace/Military                                                II-17
      Consumer Electronics                                              II-18
      Automotive                                                        II-18

  6. THERMAL MANAGEMENT PRODUCTS -  CLASSIFICATION                      II-19
      Hardware                                                          II-19
       Heat Pipes                                                       II-19
       Micro Channels                                                   II-19
       Spray Cooling                                                    II-19
       Electronic Cooling Fans                                          II-19
       Metal Backplanes                                                 II-20
       BGAs                                                             II-20
        Table 1: Leading Players in the Worldwide Thermal Management
        Hardware Market (2006 & 2007) -  Percentage Share Breakdown
        by Value Sales for Aavid Thermalloy, Thermacore, Lytron, and
        Others (includes corresponding Graph/Chart)                     II-21
      Software                                                          II-21
       Computational Methods of Heat Transfer (CHT) and Fluid
        Dynamics (CFD)                                                  II-21
       Electronic Design Automation (EDA) Software, Electronic
        Computer Aided Design (ECAD) Software, and Technology
         Computer Aided Design (TCAD) Software                          II-21
      Interfaces and Substrates                                         II-22
       Thermal Compounds and Thermal Interface Materials                II-22

  7. RECENT INDUSTRY ACTIVITY                                           II-24
      Thermacore Awarded Research Contract by DARPA (US)                II-24
      Celsia Technologies Inks Strategic Deal with Thermapower(Taiwan)  II-24
      Modine to Shut Down Pemberville and Other Manufacturing Unit
       (USA)                                                            II-24
      Modine Sells Thermacore (USA)                                     II-25
      Furukawa America to Merge with Furukawa Electric (USA)            II-25
      Alexandria Extrusion Takes Over M&M Metals (USA)                  II-25
      Waytronx Takes Over CUI (USA)                                     II-26
      Avnet Electronics Enters into Agreement with Nuventix (America)   II-26
      Graphics Product and Celsia Form Partnership (US)                 II-26
      Modine Sets up Production Unit (India)                            II-27
      Wakefield Acquires Simon Industries (NA)                          II-27
      Celsia Launches Next Generation NanoSpreader (USA)                II-27
      ATS Launched the New Star™ Series Heat Sinks (USA)                II-28
      New Improved Heat Sinks from Hitachi (Japan)                      II-28
      Honeywell to Extend Its Research and Development Center (USA)     II-28
      Vette Corp. Forms Allies with Asia Aluminum (China)               II-29
      OnScreen Inks a Licensing and Royalty Deal with Thermaltake
       Technologies (Taiwan)                                            II-29
      ONSC Inks a Licensing Deal with CUI (US)                          II-29
      Modine to Construct Second Facility (Hungary)                     II-29
      Onscreen Technologies Revamps Business Strategy (US)              II-30
      Digi-Key Inks Global Distribution Agreement with ATS              II-30
      Mouser Signs Distribution Agreement with Comair Rotron (US)       II-31
      Laird Expands Distribution Agreement with Sager (US)              II-31
      Denki Kagaku Plans Capacity Expansion for Ceramic Heat Sinks
       (Japan)                                                          II-31
      Vette Corp Announces Production Expansion (North America)         II-32
      ANSYS, Inc to acquire Aavid Thermal Technologies (US)             II-32
      Celsia Technologies Enters Into a Collaboration Yeh- Chiang
       Technology (Taiwan)                                              II-32
      CPS Enters Into Partnership with Diamond Technologies (US)        II-33
      Vette Takes Over ERM Thermal Technologies (USA)                   II-33
      Celsia Technologies Sign Strategic Contract with Kubo Kinzoku
       (Japan)                                                          II-33
      OnScreen™ Acquires Proprietary Rights for WayCool™ (US)           II-33
      iCurie Re-named as Celsia Technologies (US)                       II-34
      AET Receives Approval on HS-400 Heat Sink Design (US)             II-34
      Thermal Solutions Acquires Woven Electronics (USA)                II-34
      Laird Announces Acquisition of Supercool (Sweden)                 II-34
      Intel Acquires 5% Stake in Neng Tyi (Taiwan)                      II-35
      Modine Acquires Radiadores (Brazil)                               II-35
      Celsia Unveils Web Portal                                         II-35
      AET’s eGRAF® HS-400 Heat Sinks to Feature in LS/X
       Supercomputer (USA)                                              II-35
      Vette Announces New BGA Thermal Solutions for Integrated
       Circuits (US)                                                    II-36
      Vette Acquires EUMAX (China)                                      II-36
      Wakefield Extends Bonded Fin Heat Sink Line (US)                  II-36
      Wakefield Expands DC/DC Converter Heat Sink Line (US)             II-37

  8. HEAT SINKS AND RELATED PRODUCT  LAUNCHES AND DEVELOPMENTS          II-38
      Thermalright Unveils T-RAD2 (US)                                  II-38
      Alpha Launches FS/FSR Series Active Heat Sinks (Japan)            II-38
      Alpha Unveils Heat Sinks with 3.45mm Attachment Holes (Japan)     II-38
      Alpha Releases New Push Pin Tabs Integrated Heat Sinks (Japan)    II-38
      Alpha Launches Low Profile LPD Series Heat Sinks (Japan)          II-39
      Alpha Unveils Heat Sinks with Incorporated Attachment Tabs 
       (Japan)                                                          II-39
      Alpha Releases UB13070 Heat Sink (Japan)                          II-39
      Alpha Expands LPD Series Heat Sinks with LPD90 (Japan)            II-39
      ASUS Expands Triton Family with New Triton 81 CPU Coolers 
       (Taiwan)                                                         II-39
      Vantec Unveils New AeroFlow FX Series CPU Coolers (US)            II-40
      Thermalright Launches HR-09 Type 4 Mosfet Cooler (US)             II-40
      Thermalright Rolls Out TRUE Copper (US)                           II-40
      Spire Announced Plans to Launch New Thermax Cooling Solutions
       (US)                                                             II-40
      ATS Offers Two New Heat Sinks for BGA Packages (US)               II-41
      ATS Launches ATS-552 Heat Sink Cooling Solution for Freescale
       Processors (US)                                                  II-41
      ATS Offers New Heat Sink Cooling Solutions for Linear LED
       Lighting Products (US)                                           II-42
      Ohmite Offers Heat Sinks to Combat Overtorque Issues (US)         II-42
      ASUS Launches Silent Cooling Solutions (Taiwan)                   II-42
      Alpha Replaces SB Series Heat Sinks with LT Series Heat Sinks
       (Japan)                                                          II-42
      Alpha Launches ST Series Heat Sinks (Japan)                       II-43
      Thermalright Launches HR-03 GT VGA Cooler (US)                    II-43
      Thermalright Announces Availability of HR-03 Plus VGA Cooler(US)  II-43
      Thermalright Unveils HR-07 Duo Ram Cooler (US)                    II-43
      Thermalright Launches HR-01 X CPU Cooler (US)                     II-44
      Thermalright Launches HR-11 Backside Cooler (US)                  II-44
      Thermalright Rolls Out IFX-14 CPU Cooler (US)                     II-44
      Thermalright Unveils HR-09 Mosfet Cooler (US)                     II-45
      ATS Rolls out maxiFLOW Heat Sinks (US)                            II-45
      ATS’s maxiGRIP™ Clears Stringent Military Testing (US)            II-45
      ATS Offers Passive and Active Heat Sinks for Freescale’s
       Processors (US)                                                  II-46
      MEC International to Offer Heat sinks From Seifert (UK)           II-46
      New Heatsink from Advanced Thermal for BGA Components (US)        II-46
      Tyco Launches CardBus Connector Technology Integrated Heatsink
       (US)                                                             II-46
      Schaffner Expands Product Line with Seifert Electronics
       Products (Switzerland)                                           II-47
      ATS Unveils New Thermal Management Design Kit (US)                II-47
      Andigilog® Unveils New Thermal Management System Controllers(US)  II-47
      THERMALTAKE Presents Two Turion CPU Coolers (US)                  II-48
      GlacialTech Rolls Out Igloo 7210 M CPU  Coolers (US)              II-48
      ATS Launches HFC-100™ Heat Flux Controller (US)                   II-48
      ATS Offers Online Tutorials for Thermal Management (US)           II-49
      Cooler Master Unveils New Hyper Z600 CPU Cooler (Taiwan)          II-49
      Advanced Thermal Solutions (ATS) Launches New Three Devices (US)  II-49
      Emulation Technology Launches Heat Sinks with Elliptical Fin
       BGA Chipset (US)                                                 II-50
      Advanced Thermal Solutions Launches blackDIAMOND Heat Sink (US)   II-51

  9. FOCUS ON SELECT GLOBAL PLAYERS                                     II-52
      Aavid Thermalloy, LLC (USA)                                       II-52
      Aerocool Advanced Technologies Corp. (Taiwan)                     II-52
      ADDA Corp. (Taiwan)                                               II-52
      Advanced Thermal Solutions, Inc. (USA)                            II-52
      Ajigo Corp. (USA)                                                 II-53
      Akasa Group (UK)                                                  II-53
      Alpha Company Ltd. (Japan)                                        II-53
      Asia Vital Components Co. Ltd. (Taiwan)                           II-54
      ASUSTeK Computer Inc. (Taiwan)                                    II-54
      Chaun Choung Technology Corp. (Taiwan)                            II-54
      Cooler Master Co. Ltd. (Taiwan)                                   II-55
      Dynatron Corp. (USA)                                              II-55
      Enertron Inc. (USA)                                               II-55
      GlacialTech, Inc. (Taiwan)                                        II-56
      JMC Products, Inc. (USA)                                          II-56
      Melcor Corp. (USA)                                                II-56
      Neng Tyi Co. Ltd (Taiwan)                                         II-57
      Polo Tech Co. Ltd. (Taiwan)                                       II-57
      R-Theta Thermal Solutions, Inc. (Canada)                          II-57
      Radian Heat Sinks (US)                                            II-57
      Sumitomo Electric Industries, Ltd. (Japan)                        II-58
      Swiftech (US)                                                     II-58
      Taisol Electronics Co. Ltd. (China)                               II-58
      TennMax United (USA)                                              II-59
      Thermal Integration Technology, Inc (Taiwan)                      II-59
      Thermacore (USA)                                                  II-59
      Thermalright, Inc. (USA)                                          II-60
      Thermaltake Technology Co., Ltd (Taiwan)                          II-60
      Titan Computer Co. Ltd (Taiwan)                                   II-60
      Verax Ventilatoren GmbH (Germany)                                 II-61
      Vette Corp. (USA)                                                 II-61
      Wakefield Thermal Solutions, Inc. (US)                            II-61

  10. GLOBAL MARKET PERSPECTIVE                                         II-63
      Table 2: World Recent Past, Current & Future Analysis for Heat
      Sinks Market by Geographic Region - US, Canada, Japan, Europe,
      Asia-Pacific and Rest of World Markets Independently Analyzed
      with Annual Sales in US$ Million for Years 2006 through 2015
      (includes corresponding Graph/Chart)                              II-63

      Table 3: World 10-year Perspective for Heat Sinks Market by
      Geographic Region - Percentage Share of Dollar Sales for North
      America, Japan, Europe, Asia-Pacific and Rest of World for
      2006, 2009, and 2015 (includes corresponding Graph/Chart)         II-64
      Analysis by Product Segment                                       II-65
      Table 4: World Recent Past, Current & Future Analysis for
      Metal Extruded Heat Sinks Market by Geographic Region - US,
      Canada, Japan, Europe, Asia-Pacific and Rest of World Markets
      Independently Analyzed with Annual Sales in US$ Million for
      Years 2006 through 2015 (includes corresponding Graph/Chart)      II-65

      Table 5: World 10-year Perspective for Metal Extruded Heat
      Sinks Market by Geographic Region - Percentage Share Breakdown
      of Dollar Sales for North America, Japan, Europe, Asia-Pacific
      and Rest of World for 2006, 2009, and 2015 (includes
      corresponding Graph/Chart)                                        II-66

      Table 6: World Recent Past, Current & Future Analysis for
      Stamped Heat Sinks Market by Geographic Region - US, Canada,
      Japan, Europe, Asia-Pacific and Rest of World Markets
      Independently Analyzed with Annual Sales in US$ Million for
      Years 2006 through 2015 (includes corresponding Graph/Chart)      II-67

      Table 7: World 10-year Perspective for Stamped Heat Sinks
      Market by Geographic Region - Percentage Share  Breakdown of
      Dollar Sales for North America, Japan, Europe, Asia-Pacific
      and Rest of World for 2006, 2009, and 2015 (includes
      corresponding Graph/Chart)                                        II-68

      Table 8: World Recent Past, Current & Future Analysis for
      Bonded Fins Heat Sinks Market by Geographic Region -  US,
      Canada, Japan, Europe, Asia-Pacific and Rest of World Markets
      Independently Analyzed with Annual Sales in US$ Million for
      Years 2006 through 2015 (includes corresponding Graph/Chart)      II-69

      Table 9: World 10-year Perspective for Bonded Fins Heat  Sinks
      Market by Geographic Region - Percentage Share Breakdown of
      Dollar Sales for North America, Japan, Europe, Asia-Pacific
      and Rest of World for 2006, 2009, and 2015 2015 (includes
      corresponding Graph/Chart)                                        II-70

      Table 10: World Recent Past, Current & Future Analysis for
      Folded Fins Heat Sinks Market by Geographic Region - US,
      Canada, Japan, Europe, Asia-Pacific and Rest of World Markets
      Independently Analyzed with Annual Sales in US$ Million for
      Years 2006 through 2015 (includes corresponding Graph/Chart)      II-71

      Table 11: World 10-year Perspective for Folded Fins Heat Sinks
      Market by Geographic Region - Percentage Share Breakdown of
      Dollar Sales for North America, Japan, Europe, Asia-Pacific
      and Rest of World for 2006, 2009, and 2015 2015 (includes
      corresponding Graph/Chart)                                        II-72

      Analysis By End-Use Market                                        II-73

      Table 12: World Recent Past, Current & Future Analysis for
      Heat Sinks in Computers Sector by Geographic Region - US,
      Canada, Japan, Europe, Asia-Pacific and Rest of World Markets
      Independently Analyzed with Annual Sales in US$ Million for
      Years 2006 through 2015 (includes corresponding Graph/Chart)      II-73

      Table 13: World 10-year Perspective for Heat Sinks in
      Computers Sector by Geographic Region - Percentage Share of
      Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific and
      Rest of World Markets for 2006, 2009 & 2015 (includes
      corresponding Graph/Chart)                                        II-74

      Table 14: World Recent Past, Current & Future Analysis for
      Heat Sinks in Telecom Sector by Geographic Region - US,
      Canada, Japan, Europe, Asia-Pacific and  Rest of World Markets
      Independently Analyzed with Annual Sales in US$ Million for
      Years 2006 through 2015 (includes corresponding Graph/Chart)      II-75

      Table 15: World 10-year Perspective for Heat Sinks in Telecom
      Sector by Geographic Region - Percentage Share of Dollar Sales
      for US, Canada, Japan, Europe, Asia- Pacific and Rest of World
      Markets for 2006, 2009 & 2015 (includes corresponding
      Graph/Chart)                                                      II-76

      Table 16: World Recent Past, Current & Future Analysis for
      Heat Sinks in Consumer Electronics Sector by Geographic Region - 
      US, Canada, Japan, Europe, Asia- Pacific and Rest of World
      Markets Independently Analyzed with Annual Sales in US$
      Million for Years 2006 through 2015 (includes corresponding
      Graph/Chart)                                                      II-77

      Table 17: World 10-year Perspective for Heat Sinks in
      Consumer Electronics Sector by Geographic Region -  Percentage
      Share of Dollar Sales for US, Canada, Japan, Europe,
      Asia-Pacific and Rest of World Markets for 2006, 2009 & 2015
      (includes corresponding Graph/Chart)                              II-78

      Table 18: World Recent Past, Current & Future Analysis for
      Heat Sinks in Medical Electronics and Office Equipment Sectors
      by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific
      and Rest of World Markets Independently Analyzed with Annual
      Sales in US$ Million for Years 2006 through 2015 (includes
      corresponding Graph/Chart)                                        II-79

      Table 19: World 10-year Perspective for Heat Sinks in Medical
      and Office Equipment Sectors by Geographic Region - Percentage
      Share of Dollar Sales for US, Canada, Japan, Europe,
      Asia-Pacific and Rest of World Markets for 2006, 2009 & 2015
      (includes corresponding Graph/Chart)                              II-80

      Table 20: World Recent Past, Current & Future Analysis for
      Heat Sinks in Industrial and Military Sector by Geographic
      Region - US, Canada, Japan, Europe, Asia-Pacific and Rest of
      World Markets Independently Analyzed with Annual Sales in US$
      Million for Years 2006 through 2015 (includes corresponding
      Graph/Chart)                                                      II-81

      Table 21: World 10-year Perspective for Heat Sinks in
      Industrial and Military Sector by Geographic Region -
      Percentage Share of Dollar Sales for US, Canada, Japan,
      Europe, Asia-Pacific and Rest of World Markets for 2006, 2009 & 
      2015 (includes corresponding Graph/Chart)                         II-82

      Table 22: World Recent Past, Current & Future Analysis for
      Heat Sinks in Automotive Sector by Geographic Region - US,
      Canada, Japan, Europe, Asia-Pacific and Rest of World Markets
      Independently Analyzed with Annual Sales in US$ Million for
      Years 2006 through 2015 (includes corresponding Graph/Chart)      II-83

      Table 23: World 10-year Perspective for Heat Sinks in
      Automotive Sector by Geographic Region - Percentage Share of
      Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific and
      Rest of World Markets for 2006, 2009 & 2015 (includes
      corresponding Graph/Chart)                                        II-84


III. MARKET

  1. THE UNITED STATES                                                  III-1
      A.Market Analysis                                                 III-1
        Market Overview                                                 III-1
        Product Innovations                                             III-2
        Product Launches/Developments                                   III-4
        Strategic Corporate Developments                                III-14
        Select Players                                                  III-24
         Aavid Thermalloy, LLC (USA)                                    III-24
         Advanced Thermal Solutions, Inc. (USA)                         III-24
         Ajigo Corp. (USA)                                              III-24
         CTS Corp. (USA)                                                III-25
         Cool Innovations, Inc. (USA)                                   III-25
         Dynatron Corp. (USA)                                           III-25
         Enertron, Inc. (USA)                                           III-26
         JMC Products, Inc. (USA)                                       III-26
         Melcor Corp. (USA)                                             III-26
         Radian Heat sinks (US)                                         III-26
         Swiftech (US)                                                  III-27
         Tennmax United (USA)                                           III-27
         Thermacore (USA)                                               III-27
         Thermalright, Inc. (USA)                                       III-28
         United Thermal Engineering Corp. (USA)                         III-28
         Vantec Thermal Technologies, Inc. (US)                         III-29
         Vette Corp. (USA)                                              III-29
         Wakefield Thermal Solutions, Inc. (US)                         III-29
      B.Market Analytics                                                III-30
        Table 24: US Recent Past, Current & Future Analysis for Heat
        Sinks Market by Product Segment - Metal Extruded, Stamped,
        Bonded Fin, and Folded Fin Heat Sinks Markets Independently
        Analyzed with Annual Sales in US$ Million for Years 2006
        through 2015 (includes corresponding Graph/Chart)               III-30

        Table 25: US 10-year Perspective for Heat Sinks Market by
        Product Segment - Percentage Share Breakdown of Dollar Sales
        for Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat
        Sinks for 2006, 2009, and 2015 (includes corresponding
        Graph/Chart)                                                    III-31

        Table 26: US Recent Past, Current & Future Analysis for Heat
        Sinks by End-Use Sector - Computers, Telecom, Consumer
        Electronics, Medical and Office Equipment, Industrial and
        Military, and Automotive Markets Independently Analyzed with
        Annual Sales Figures in US$ Million for Years 2006 through
        2015 (includes corresponding Graph/Chart)                       III-32

        Table 27: US 10-Year Perspective for Heat Sinks by End-Use
        Sector: Percentage Share Breakdown of Dollar Sales for
        Computers, Telecom, Consumer Electronics, Medical and Office
        Equipment, Industrial and Military and Automotive Markets
        for 2006, 2009 & 2015 (includes corresponding Graph/Chart)      III-33

  2. CANADA                                                             III-34
      A.Market Analysis                                                 III-34
        Current and Future Analysis                                     III-34
        Select Player                                                   III-34
      B.Market Analytics                                                III-35
        Table 28: Canadian Recent Past, Current & Future Analysis
        for Heat Sinks Market by Product Segment - Metal Extruded,
        Stamped, Bonded Fin, and Folded Fin Heat Sinks Markets
        Independently Analyzed with Annual Sales in US$ Million for
        Years 2006 through 2015 (includes corresponding Graph/Chart)    III-35

        Table 29: Canadian 10-year Perspective for Thermal
        Management Heat Sinks Market by Product Segment - Percentage
        Share Breakdown of Dollar Sales for Metal Extruded, Stamped,
        Bonded Fin, and Folded Fin Heat Sinks for 2006, 2009, and
        2015 (includes corresponding Graph/Chart)                       III-36

        Table 30: Canadian Recent Past, Current & Future Analysis
        for Heat Sinks by End-Use Sector - Computers, Telecom,
        Consumer Electronics, Medical/Office Equipment, Industrial
        and Military, and Automotive Markets Independently Analyzed
        with Annual Sales Figures in US$ Million for Years 2006
        through 2015 (includes corresponding Graph/Chart)               III-37

        Table 31: Canadian 10-Year Perspective for Heat Sinks by
        End-Use Sector: Percentage Share Breakdown of Dollar Sales
        for Computers, Telecom, Consumer Electronics, Medical and
        Office Equipment, Industrial/ Military, and Automotive
        Markets for 2006, 2009 & 2015 (includes corresponding
        Graph/Chart)                                                    III-38

  3. JAPAN                                                              III-39
      A.Market Analysis                                                 III-39
        Current and Future Analysis                                     III-39
        Product Innovations                                             III-39
        Strategic Corporate Developments                                III-41
        Select Players                                                  III-42
         Alpha Company Ltd. (Japan)                                     III-42
         Sumitomo Electric Industries, Ltd. (Japan)                     III-43
      B.Market Analytics                                                III-43
        Table 32: Japanese Recent Past, Current & Future Analysis
        for Thermal Management Heat sinks Market by Product Segment - 
        Metal Extruded, Stamped, Bonded Fin, and Folded Fin Heat
        Sinks Markets Independently Analyzed with Annual Sales in
        US$ Million for Years 2006 through 2015 (includes
        corresponding Graph/Chart)                                      III-43

        Table 33: Japanese 10-year Perspective for Heat Sinks Market
        by Product Segment - Percentage Share  Breakdown of Dollar
        Sales for Metal Extruded,  Stamped, Bonded Fin, and Folded
        Fin Heat Sinks  for 2006, 2009, and 2015 (includes
        corresponding Graph/Chart)                                      III-44

        Table 34: Japanese Recent Past, Current & Future Analysis
        for Heat Sinks by End-Use Sector - Computers, Telecom,
        Consumer Electronics, Medical/Office Equipment, Industrial
        and Military, and Automotive Markets Independently Analyzed
        with Annual Sales Figures in US$ Million for Years 2006
        through 2015 (includes corresponding Graph/Chart)               III-45

        Table 35: Japanese 10-Year Perspective for Heat Sinks  by
        End-Use Segment - Percentage Share Breakdown  of Dollar
        Sales for Computers, Telecom, Consumer Electronics, Medical
        and Office Equipment,  Industrial and Military, and
        Automotive Markets  for 2006, 2009 & 2015 (includes
        corresponding Graph/Chart)                                      III-46

  4. EUROPE                                                             III-47
      A.Market Analysis                                                 III-47
        Current and Future Analysis                                     III-47
        Product Launches/Developments                                   III-47
        Strategic Corporate Developments                                III-48
        Select Players                                                  III-48
         Akasa Group (UK)                                               III-48
         Verax Ventilatoren GmbH (Germany)                              III-49
      B.Market Analytics                                                III-50
        Table 36: European Recent Past, Current & Future Analysis
        for Heat Sinks Market by Product Segment - Metal Extruded,
        Stamped, Bonded Fin, and Folded Fin Heat Sinks Markets
        Independently Analyzed with Annual Sales in US$ Million for
        Years 2006 through 2015 (includes corresponding Graph/Chart)    III-50

        Table 37: European 10-year Perspective for Heat Sinks Market
        by Product Segment - Percentage Share Breakdown of Dollar
        Sales for Metal Extruded, Stamped, Bonded Fin, and Folded
        Fin Heat Sinks for 2006, 2009, and 2015 (includes
        corresponding Graph/Chart)                                      III-51

        Table 38: European Recent Past, Current & Future Analysis
        for Heat Sinks by End-Use Sector - Computers, Telecom,
        Consumer Electronics, Medical/Office Equipment, Industrial
        and Military, and Automotive Markets Independently Analyzed
        with Annual Sales Figures in US$ Million for Years 2006
        through 2015 (includes corresponding Graph/Chart)               III-52

        Table 39: European 10-Year Perspective for Heat Sinks by
        End-Use Sector: Percentage Share Breakdown of Dollar Sales
        for Computers,  Telecom, Consumer Electronics, Medical and
        Office Equipment, Industrial/ Military, and Automotive
        Markets for 2006, 2009 & 2015 (includes corresponding
        Graph/Chart)                                                    III-53

  5. ASIA PACIFIC                                                       III-54
      A.Market Analysis                                                 III-54
        Current and Future Analysis                                     III-54
        Mainland China Heat Sinks Market                                III-54
        Taiwan Market Scenario                                          III-54
        Product Innovations                                             III-55
        Product Launches/Developments                                   III-56
        Strategic Corporate Developments                                III-57
        Select Players                                                  III-59
         Act-Rx Technology Corp. (Taiwan)                               III-59
         Aerocool Advanced Technologies Corp. (Taiwan)                  III-60
         ADDA Corp. (Taiwan)                                            III-60
         Arkua Technology Co., Ltd (Taiwan)                             III-60
         Asia Vital Components Co. Ltd. (Taiwan)                        III-60
         ASUSTeK Computer, Inc. (Taiwan)                                III-61
         Chaun Choung Technology Corp. (Taiwan)                         III-61
         Cooler Master Co. Ltd. (Taiwan)                                III-62
         EVERCOOL Thermal Co., Ltd. (Taiwan)                            III-62
         GlacialTech, Inc. (Taiwan)                                     III-62
         Kuang Thousand Technology Co., Ltd. (Taiwan)                   III-62
         Neng Tyi Co. Ltd (Taiwan)                                      III-63
         Polo Tech Co. Ltd (Taiwan)                                     III-63
         Taisol Electronics Co. Ltd. (China)                            III-63
         Thermal Integration Technology, Inc (Taiwan)                   III-64
         Thermaltake Technology Co., Ltd (Taiwan)                       III-64
         Titan Computer Co. Ltd. (Taiwan)                               III-64
      B.Market Analytics                                                III-65
        Table 40: Asia Pacific Recent Past, Current & Future
        Analysis for Heat Sinks Market by Product Segment - Metal
        Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks
        Markets Independently Analyzed with Annual Sales in US$
        Million for Years 2006 through 2015 (includes corresponding
        Graph/Chart)                                                    III-65

        Table 41: Asia Pacific 10-year Perspective for Heat Sinks
        Market by Product Segment - Percentage Share Breakdown of
        Dollar Sales for Metal Extruded, Stamped, Bonded Fin, and
        Folded Fin Heat Sinks for 2006, 2009, and 2015 (includes
        corresponding Graph/Chart)                                      III-66

        Table 42: Asia Pacific Recent Past, Current & Future
        Analysis for Heat Sinks by End-Use Sector - Computers,
        Telecom, Consumer Electronics, Medical/Office Equipment,
        Industrial and Military, and Automotive Markets
        Independently Analyzed with Annual Sales Figures in US$
        Million for Years 2006 through 2015 (includes corresponding
        Graph/Chart)                                                    III-67

        Table 43: Asia Pacific 10-Year Perspective for Heat Sinks by
        End-Use Sector: Percentage Share Breakdown of Dollar Sales
        for Computers,  Telecom, Consumer Electronics, Medical and
        Office Equipment, Industrial/ Military, and Automotive
        Markets for 2006, 2009 & 2015 (includes corresponding
        Graph/Chart)                                                    III-68

  6. REST OF WORLD                                                      III-69
      A.Market Analysis                                                 III-69
        Current and Future Analysis                                     III-69
        Strategic Corporate Developments                                III-69
      B.Market Analytics                                                III-70
        Table 44: Rest of World Recent Past, Current & Future
        Analysis for Heat Sinks Market by Product Segment - Metal
        Extruded, Stamped, Bonded Fin, and Folded Fin Heat Sinks
        Markets Independently Analyzed with Annual Sales in US$
        Million for Years 2006 through 2015 (includes corresponding
        Graph/Chart)                                                    III-70

        Table 45: Rest of World 10-year Perspective for Heat Sinks
        Market by Product Segment - Percentage Share Breakdown of
        Dollar Sales for Metal  Extruded, Stamped, Bonded Fin, and
        Folded Fin Heat Sinks for 2006, 2009, and 2015 (includes
        corresponding  Graph/Chart)                                     III-71

        Table 46: Rest of World Recent Past, Current & Future
        Analysis for Heat Sinks by End-Use Sector - Computers,
        Telecom, Consumer Electronics, Medical/ Office Equipment,
        Industrial and Military, and Automotive Markets
        Independently Analyzed with Annual Sales Figures in US$
        Million for Years 2006 through 2015 (includes corresponding
        Graph/Chart)                                                    III-72

        Table 47: Rest of World 10-Year Perspective for Heat Sinks
        by End-Use Sector: Percentage Share Breakdown of Dollar
        Sales for Computers, Telecom, Consumer Electronics, Medical
        and Office Equipment, Industrial/ Military, and Automotive
        Markets for 2006, 2009 & 2015 (includes corresponding
        Graph/Chart)                                                    III-73


 IV. COMPETITIVE LANDSCAPE

  Total Companies Profiled: 180 (including Divisions/Subsidiaries - 207)

  -----------------------------------------
  Region/Country                    Players
  -----------------------------------------
  The United States                    91
  Canada                                2
  Japan                                 5
  Europe                               40
     France                             4
     Germany                            6
     The United Kingdom                17
     Italy		                6
     Spain		                1
     Rest of Europe                     6
  Asia-Pacific (Excluding Japan)       69
  -----------------------------------------