There is an unprecedented growing demand to meet the needs for Wafer Level Packaging. If flip-chip wafer bumping and WLSCP platforms are well established today, new technologies are also emerging like TSV for 3D WLP, 2.5D interposers, 3DIC or FO WLP, requiring new capabilities and additional capacities for packaging at the wafer-scale.

Key features of the database

This database presents the exhaustive list of players and the different locations that are involved in Wafer Level Packaging in general. This unique tool provides a global overview of capabilities (TSV, RDL, wafer bumping, etc) and capacities.

•       An exclusive tool for equipment & material suppliers to develop worldwide their business and  for Fabless and Fab-light semiconductor players to identify new sourcing opportunities

•       The tool enables you to analyze WLP technologies distribution by players, technology type, country, business model, investment & growth evaluation

•       Already 20+ graphs are included for a better understanding of the global trends

•       Small R&D and prototype lines are also listed

A database dedicated to your needs

The database references more than 250 fab locations worldwide with technical information related to Wafer Level Packaging technologies (bumping, RDL, passivation, TSV) or “mid-end” capabilities.

The tool provides an exhaustive list of players (IDM, OSAT, packaging house, bumping house, etc).

It will enable you to:

    •      Search by WLP technology capacities and capabilities

    •      Review the profile and repartition of one given technology among the different industry players

    •      Study players manufacturing / outsourcing strategy and supply chain

    •     Identify and source new WLP service suppliers for the wafer -scale packaging of your products

Reason to buy this database?

•          Equipment & Material suppliers

–         Identify key WLP players and locations worldwide with detailed quantitative and qualitative information about their installed capacities for wafer-level-packaging in the Mid-end

–         Screen market penetration status of one particular technology (e.g. TSV, copper pillar bumping, gold bumping, RDL, etc) worldwide and understand who are their key users

•          IDM, fabless and fab-light players

–         Oversee supplier subcontractors capabilities and capacities per WLP technology.

–         Benchmark several different subcontractors

–         Identify new sourcing strategies

•          Small IDM or niche market IDM

–         Identify prototype lines for WLP worldwide

–         Identify small fabs capable of handling very specific wafer-level-packaging schemes (e.g. with exotic materials, 4’’ small wafer diameter, etc)

•          OSAT, foundries, packaging and bumping house

–         Get an exhaustive list of competitors or  potential partners in your field

–         Evaluate global WLP capacities by technologies, regions, business models

–         Information about key customers’ internal installed capacities in the Mid-end
 

TABLE OF CONTENTS

This database lists the following information:

•      General information:

‐          Fab location

‐          Fab function (Front-end, Back-end, etc)

‐          Main customer, JV, partnership

•      Technology platforms available by location:

‐          WLCSP

‐          FO-WLP

‐          Flip-chip wafer bumping (Au, solder, Cu, etc)

‐          3D-WLCSP

‐          3DIC

‐          Interposers

‐          Wafer Level Optic

•      Details about technology:

‐          TSV

‐          RDL and passivation

‐          Bumping technologies (plating, printing, )

‐          Stacking technologies (W2W, C2W)

‐         Capacities information (in 300mm eq wf/year):

‐          Wafer diameter (4"/6"/8"/12"/panel)

‐          Wafer type (Si, GaAs, etc)

‐          Capacities by platforms

‐          Capacities by bumping technologies

‐          Others capabilities: thin wafer handling, wafer bonding,

•      Business model & region:

‐          Breakdown by business models

‐          Breakdown by regions

Companies listed in the database

The database references over 150 companies (IDMs, OSAT, foundries, MEMS, R&D Lab, etc) and their 250 + wafer fab locations worldwide.

    Wafer bumping houses:

    - NEPES

    - ChipBond

    - FCI


    OSAT:

    - ASE

    - SPIL

    - STATSChipPac


    Wafer packaging houses:

    - Xintec

    - China WLCSP

    - Nemotek

    - OptoPac


    R&D Lab & prototype lines:

    - CEA LETI

    - IMEC

    - RTI


    MEMS IDM/foundries:

    - Silex

    - Dalsa

    - APM


    TSV foundries:

    - ALLVia

    - EPWorks


    IC manufacturers (IDM):

    - Texas Instruments

    - STMicroelectronics

    - Samsung


    CMOS foundries:

    - TSMC

    - Globalfoundries

    - UMC