This IDC update provides the top vendor rankings for the worldwide mobile phone chipset, applications processor, and connectivity semiconductor market for the third calendar quarter of 2011. This is a quarterly deliverable that tracks the top mobile phone semiconductor vendors in several key device categories. The accompanying Excel spreadsheet includes the results of this data deliverable and is broken out by:

• The top 10 worldwide mobile phone semiconductor vendors for 3Q11. Select components include chipsets, discrete applications processors, media coprocessors, and connectivity technologies.
• The top 10 worldwide mobile phone chipset vendors for 3Q11. Chipsets are defined as air interface–specific components only and include integrated and discrete baseband processors, transceiver and RF components, and power amplifiers.
• The top 10 worldwide mobile phone connectivity semiconductor vendors for 3Q11.Connectivity chips include WiFi, Bluetooth, broadcast radio, GPS, WiMAX, mobile TV, and NFC.
• The top 6worldwide smart phone applications processor vendors for 3Q11. Applications processors are broken out as discrete devices and integrated solutions that include baseband processing circuitry also.

Companies Covered:
Apple Inc., Atheros Powerline, LLC, Avago Technologies Imaging Hungary Vagyonkezelo Kft., Axiom Telecom L.L.C., Broadcom Europe Limited, China Mobile Limited, csr, HTC Corporation, Icera Inc., Infineon Technologies AG, Intel Corporation, Marvell Semiconductor, Inc., Maxim Integrated Products Netherlands B.V., MediaTek Inc., Motorola, Inc., MStar Semiconductor, Inc., Nokia Corporation, NVIDIA Corporation, Qualcomm Incorporated, Ralink Technology Corp., RF Micro Devices, Inc., Samsung C&T, Skyworks International Investments, Inc., Spreadtrum Communications, Inc., ST-Ericsson AB, Telefonaktiebolaget L M Ericsson, Texas Instruments Incorporated, TriQuint S.R.L.