The 2011 iNEMI Roadmap is the most comprehensive roadmap published to date by the International Electronics Manufacturing Initiative (iNEMI). The complete roadmap report is available here. The document, created by individuals representing all aspects of the electronics manufacturing supply chain, features 27 chapters that provide in-depth discussion of six product sectors and 21 different  manufacturing, component/subsystem, business process and design technologies.

The iNEMI Board Assembly Roadmap identifies major trends in the evolution of technology in PCB assembly, with an emphasis on identifying potentially disruptive events (business and technology). It provides the information needed to identify critical technology and infrastructure gaps, prioritize R&D needs to meet those gaps, and initiate activities that address industry needs.

Through its roadmaps, iNEMI charts future opportunities and challenges for the electronics manufacturing industry. These widely utilized roadmaps:

  • Help OEMs, EMS providers and suppliers prioritize investments in R&D
     and technology deployment

  • Influence the focus of university-based research

  • Provide guidance for government investment in emerging technologies

Board assembly is a critical part of the overall electronic products’ supply chain.  It accounts for most of the direct material cost, and is closely associated with: Component Packaging, Interconnect, Inspection, Thermal Management, Final Assembly, and Environmental Technologies.

There are four main drivers for development in Board Assembly processes:

• Conversion Cost Reduction
• Reduction in New Product Introduction (NPI) Time
• Increased Component I/O Density
• Transition to Environmental and Regulatory Requirements

These drivers are affecting business environments, manufacturing technology, and research needs.  One of the profound business environment impacts of the product sector drivers is the higher level of service demands, or opportunities, placed on the contract manufacturers by the Original Equipment Manufacturers (OEM).  Today’s Electronic Manufacturing Service (EMS) companies are expanding their offerings to include services in a wider range of a product’s life cycle, such as product design, HW and SW verification, product support, installation support, and field service support to work as Joint Design Manufacturing (JDM) or Own Design Manufacturing ODM).