The 2011 iNEMI Roadmap is the most comprehensive roadmap published to date by the International Electronics Manufacturing Initiative (iNEMI). The complete roadmap report is available here. The document, created by individuals representing all aspects of the electronics manufacturing supply chain, features 27 chapters that provide in-depth discussion of six product sectors and 21 different  manufacturing, component/subsystem, business process and design technologies.

The roadmap identifies major trends in the evolution of Ceramic Interconnect Substrates, with an emphasis on identifying potentially disruptive events (business and technology). It provides the information needed to identify critical technology and infrastructure gaps, prioritize R&D needs to meet those gaps, and initiate activities that address industry needs.

Through its roadmaps, iNEMI charts future opportunities and challenges for the electronics manufacturing industry. These widely utilized roadmaps:

  • Help OEMs, EMS providers and suppliers prioritize investments in R&D
     and technology deployment

  • Influence the focus of university-based research

  • Provide guidance for government investment in emerging technologies

As the electronics industry undergoes dramatic changes in this century, innovative ceramic interconnection substrate technology has afforded us a bright future complete with a tool set that will enable adopters to realize a competitive advantage through increased functionality, reduced footprint, and portability demanded by today’s electronic systems packaging requirements. The ability to trim resistors and capacitors to <1% tolerances, 25 microns below the surface, develop blind vias and form cavities are mature technologies. Mechanical strength has been increased for the cell phone drop test.  High-level electrical performance is achieved with stable dielectrics and matched TCE for reliability.

Critical Infrastructure Issues and Paradigm Shifts

High and Low Temperature Co-fired Ceramic Technology

The end-user is always interested in higher performance--more functions in an equal or smaller space at a lower system cost. To meet these continuing needs; improved overall circuit density, finer lines, smaller vias on a finer pitch and integrated passive elements are in demand.  For high-speed digital interconnects, lower dielectric constants will be required.

For emerging wireless and RF applications, a variety of low-loss materials of varying dielectric constants will be required. These wireless and RF applications will also require controlled impedance structures. To enable applications of the buried passives with controlled impedance structures, the infrastructure of CAD tools available for designers will have to be improved.  The common method of visual inspection cannot achieve the precision necessary to assure registration of dense multi-layer circuitry.

Thin Films and Thin Film Multi-layers

The challenge for the thick and thin film industry as a whole is to improve the infrastructure of material suppliers. Globally, there are a very limited number of high-volume sources of ceramic substrates.

For thin film multi-layers, the big issues are the development of large area processing equipment and substrate materials for use in that equipment.