The 2011 iNEMI Roadmap is the most comprehensive roadmap published to date by the International Electronics Manufacturing Initiative (iNEMI). The complete roadmap report is available here. The document, created by individuals representing all aspects of the electronics manufacturing supply chain, features 27 chapters that provide in-depth discussion of six product sectors and 21 different  manufacturing, component/subsystem, business process and design technologies.

The roadmap identifies major trends in the evolution of Large Area Flexible Electronics, with an emphasis on identifying potentially disruptive events (business and technology). It provides the information needed to identify critical technology and infrastructure gaps, prioritize R&D needs to meet those gaps, and initiate activities that address industry needs.

Through its roadmaps, iNEMI charts future opportunities and challenges for the electronics manufacturing industry. These widely utilized roadmaps:

  • Help OEMs, EMS providers and suppliers prioritize investments in R&D
     and technology deployment

  • Influence the focus of university-based research

  • Provide guidance for government investment in emerging technologies

Since the 2009 Large Area, Flexible Electronics Roadmap was published, the industry has observed many changes brought upon by advancements in the enabling technologies and new product opportunities.  The 2011 Roadmap attempts to capture these changes by building upon the 2009 edition with a comprehensive update of the various sections.

This roadmap attempts to be agnostic to material (organic, inorganic, hybrid) and process (printing, vacuum, lithography).  The 2011 chapter provides an overview of the most critical technologies necessary for commercial launch and market diffusion.  In addition, a snapshot of the present industry, recent innovations, and technology trends is given. 

Current Situation

• Hybrid flexible electronics systems – comprised of printed electronics based components integrated with traditional electronics – are receiving greater attention for near-term commercialization opportunities.
• Plastic Logic continues to execute on its business strategy and has decided to focus on a 2nd generation product due to the recent increase in competition and lack of differentiation for its 1st generation mobile electronic reading product (e-reader device).
•  Although, Motorola, ORFID, and Weyerhauser / Organic ID discontinued operations for printed organic RFID in 2009, other leaders in the field continue to make impressive gains (e.g. Holst Research Centre, FlexTech Allience).  
• The National Institute of Standards and Technology (NIST) Technology Innovation Program (TIP) announced several awards to teams developing platform technologies that will enable large area electronics.  
• The Defense Advanced Research Projects Agency (DARPA) continues to solicit research proposals to develop innovative systems based on organic and organic/inorganic hybrid electronics materials.
• The Organic Electronics Association (OE-A) has published its 3rd Roadmap identifying the critical elements necessary for the successful commercialization of organic based electronics.
• The European Union (EU) 7th Framework is funding several consortia to develop enabling large area electronics technology platforms.  
• Increased discussion is occurring among stakeholders to initiate standards development activity for OPV and OLED products.
• Adoption of IEEE 1620-2008™ and IEEE 1620.1-2006™ international standards continues.
• A greater number of prototypes and engineering samples of large area flexible electronics based products such as flexible displays and signage, authentication, gaming, and active packaging are being shown with specifics for product commercialization.