The 2011 iNEMI Roadmap is the most comprehensive roadmap published to date by the International Electronics Manufacturing Initiative (iNEMI). The complete roadmap report is available here. The document, created by individuals representing all aspects of the electronics manufacturing supply chain, features 27 chapters that provide in-depth discussion of six product sectors and 21 different  manufacturing, component/subsystem, business process and design technologies.

The roadmap identifies major trends in the evolution of Optoelectronics, with an emphasis on identifying potentially disruptive events (business and technology). It provides the information needed to identify critical technology and infrastructure gaps, prioritize R&D needs to meet those gaps, and initiate activities that address industry needs.

Through its roadmaps, iNEMI charts future opportunities and challenges for the electronics manufacturing industry. These widely utilized roadmaps:

  • Help OEMs, EMS providers and suppliers prioritize investments in R&D
     and technology deployment

  • Influence the focus of university-based research

  • Provide guidance for government investment in emerging technologies

This Optoelectronics (OE) Roadmap covers data transmission utilizing optical technology over Telecommunication distances of 100’s of kilometers down to on-chip distances of a few millimeters.  As data rates rise, optical technology continues to displace copper for data transmission over shorter distances.  The higher the data rate required - the shorter the distance over which optical methods become superior.  A key driver of the demand for data transmission capacity is the internet because traffic is increasing ~50% per year. The increased demand results from increasing video traffic.

The report divides optical data transmission into 10 applications:

• Telecommunications
• CATV and FTTX
• Local Area Networks
• Plastic Optical Fiber (POF) (Automotive)
• Active Optical Cables
• Backplanes
• On-Card
• In-to and Out-of Package
• On-Chip

Critical Needs

A major need to implement Backplane, On-Card, In-to and Out-of package, and On-Chip optical data transmission is a source of photons that can be modulated at the 10’s of Gb/s rates required.  CMOS and silicon generally do not make good optical sources.  Thus, another photon source is required.  To date, a suitable, economically viable solution has not been found.

Optical product manufacturing requires a variety of unique processes which are often done manually.  While automated equipment is technically viable, the volume to-date is insufficient to justify the equipment development cost.  As optical applications expand, product lifetimes lengthen and standards emerge, manual methods will gradually give way to automated methods.  The one exception is POF manufacturing where the volume and technology are such that much automation is viable and in use.

In the long run, photonic integrated circuits (active devices) (PIC) and planar lightwave circuits (passive devices) (PLC) will be needed to minimize physical size. This is an entirely new technology that is being developed to support optical data transmission.

Optical products, like many other electronic products, are impacted by the “Green” revolution and restrictive legislation.