The 2011 iNEMI Roadmap is the most comprehensive roadmap published to date by the International Electronics Manufacturing Initiative (iNEMI). The complete roadmap report is available here. The document, created by individuals representing all aspects of the electronics manufacturing supply chain, features 27 chapters that provide in-depth discussion of six product sectors and 21 different  manufacturing, component/subsystem, business process and design technologies.

The RF Components and Subsystems Roadmap describes current and future technology trends in RF components and subsystems used in cellular handsets to provide connectivity through cellular phone networks, wireless local and personal area networks, location services, and video and audio broadcast reception. High unit volumes, physical size reductions, battery enhancements, feature expansion and time to market pressures drive dynamic handset technology developments. Paradoxically, the extreme volumes of handset devices drive risk-averse behavior for new technologies and capabilities adoption. At the largest handset suppliers, risk-averse behavior can be extreme. Smart phones drive RF subsystem complexity and density, such as more than twenty transceiver signal paths, eight antennas per handset and 1Gbps+ internal interfaces with expansion to Peripheral Component Interconnect Express (PCIe) speeds by 2012.

Next generation cellular standards use new frequency bands so as to co-exist with older, more widely available standards such as GSM and EDGE.  This causes additional RF requirements for RF subsystems to serve additional signal paths due to the need for RF filtering of both output transmissions and received signals for subsequent down-conversion within RF transceivers. Without design and process improvements, costs will increase proportionally with the more than doubling of RF functionality. New approaches to device integration into RF SiPs (System-in-Package) and performance improvements are under development to minimize the cost impacts.

Through its roadmaps, iNEMI charts future opportunities and challenges for the electronics manufacturing industry. These widely utilized roadmaps:

  • Help OEMs, EMS providers and suppliers prioritize investments in R&D
     and technology deployment

  • Influence the focus of university-based research

  • Provide guidance for government investment in emerging technologies