The 2011 iNEMI Roadmap is the most comprehensive roadmap published to date by the International Electronics Manufacturing Initiative (iNEMI). The 1800-page document, created by individuals representing all aspects of the electronics manufacturing supply chain, features 27 chapters that provide in-depth discussion of six product sectors and 21 different manufacturing, component/subsystem, business process and design technologies.
New in this edition is a combined chapter on MEMS (microelectromechanical systems) and sensors. Sensors have been covered in previous roadmaps, and MEMS technology has been discussed in several chapters; however, this is the first time that MEMS technology has been discussed as a standalone topic. Also this cycle, the Packaging chapter was expanded to include discussion of component substrates.
The roadmap identifies major trends in the evolution of technology across numerous disciplines, with an emphasis on identifying potentially disruptive events (business and technology). It provides the information needed to identify critical technology and infrastructure gaps, prioritize R&D needs to meet those gaps, and initiate activities that address industry needs.
Through its roadmaps, iNEMI charts future opportunities and challenges for the electronics manufacturing industry. These widely utilized roadmaps:
• Help OEMs, EMS providers and suppliers prioritize investments in R&D
and technology deployment
• Influence the focus of university-based research
• Provide guidance for government investment in emerging technologies
The 2011 Roadmap forecasts the business and technical needs of six different product sectors, based on input from industry-leading OEMs. The technology chapters forecast the evolution of 21 different technologies, compare those forecasts with the defined needs of the OEMs, and identify any gaps that might exist over a 10-year horizon.
The 2011 Roadmaps were developed by twenty-one Technology Working Groups (TWGs), in response to inputs from representatives of OEMs in six Product Emulator Groups (PEGs). The PEGs and TWGs are defined below. These groups included more than 575 individuals recruited from over 310 private corporations, consortia, government agencies, and universities in 18 countries.
PRODUCT EMULATOR GROUP (PEG) CHAPTERS
TECHNOLOGY WORKING GROUP (TWG) CHAPTERS
Strategic Concerns
There are ongoing challenges regarding R&D funding. The restructuring of the electronics industry from vertically integrated OEMs to a multi-firm, globally distributed supply chain has resulted in a disparity in R&D needs versus available resources. Critical needs for research and development exist in the middle part of the supply chain (IC assembly services, passive components and EMS assembly), and yet these are the companies least capable of providing the resources. At the same time, manufacturing R&D responsibility is transitioning to EMS companies and their supply base in low-cost geographies, creating additional challenges in linking future product needs to research resources. As this issue becomes more critical, industry collaboration is gaining traction in a number of venues (e.g. university R&D centers, industry consortia, ad-hoc cross-company development teams). Government, academia and industry consortia will need to formulate ways to adopt and develop emerging technologies within the global outsourcing environment.
Other strategic concerns include:
- Consumers are increasingly concerned about the impacts that electronics products may exert regarding safety, energy usage and the environment. Conflicting sources of public information can cause confusion and less-than-optimum solutions.
- Harmonization of environmental regulations for electronic products must be driven through international standardization.
- The mechanisms for cooperation between industries, and among researchers working in all advanced technologies, must be strengthened. Cooperation among OEMs, ODMs, EMS firms and component suppliers is needed to focus on the “right” technologies and to find ways to deploy them in a timely manner.
- Disruptive technologies offer opportunities for innovation. In order to ensure success, the supply chain must be willing to invest with a long-term perspective in mind.
Click here to download a backgrounder (PDF) that summarizes some of the key trends and highlights discussed in the 2001 Roadmap.
Purchasing Options
CD
The entire roadmap is available on CD-ROM (PDF file - Sngle user license) for 3,000 USD.
Single chapter(s)
If you are interested in only one or two product sectors or technology areas, you can download an individual chapter plus the complete Executive Summary for $500 per chapter. Simply follow the PEG and PWG chapter links on this page.
Corporate licensing
We also offer a licensing agreement that allows you to share the roadmap internally with all of your organization's employees via your intranet or other file sharing system.
Use our shopping cart to select the required license.
Pricing is based on corporate sales:
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Corp. License A
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Corp. License B
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Corp.
License C:
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Corporate sales
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<$1 billion USD |
>1 billion USD |
Government agencies, universities, research institutes, and non-profit organization |
| Licensing fee |
$9,000 USD |
$12,500 USD |
$2,000 USD
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TABLE OF CONTENTS
Overview
Situation Analysis
Business
Regulatory
Market
Technology
Highlighted Needs
Information Management
Design Technologies
Manufacturing Technologies
Component/Subsystem Technologies
Strategic Concerns
Paradigm Shifts
Key Recommendations
iNEMI Technical Projects
Standards Development
iNEMI Technical Workshops/Steering Committees
Design 7
Manufacturing Technology
Materials Development
Energy and the Environment
2011 iNEMI Roadmapping Process
Technology Roadmap Chapter Highlights
Introduction
Accomplishments
Product Emulator Groups
Consumer / Portable Product Sector
Office Systems / Large Business Systems Product Sector
Netcom (Network, Data, Telecom) Product Sector
Medical Product Sector
Automotive Product Sector
Aerospace / Defense Product Sector
Business Technologies
Information Management
Design Technologies
Modeling, Simulation and Design
Thermal Management
Environmentally Conscious Electronics
Manufacturing Technologies
Board Assembly
Final Assembly
Test, Inspection, and Measurement
Component/Subsystem Technologies
Semiconductor Technology
Photovoltaics
Packaging
Interconnection PCB Organic
Interconnection Substrates Ceramic
Passive Components
RF Components & Subsystems
MEMS / Sensors
Optoelectronics
Mass Data Storage
Electronic Connectors
Large Area, Flexible Electronics
Solid State Illumination
Energy Storage & Conversion Systems
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