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iNEMI Thermal Management Roadmap

Price:
USD $500.00
ISBN/SKU #:
INM2076
Research Group:
iNEMI
Date of Publication:
August 2011



Summary

The 2011 iNEMI Thermal Management Roadmap is the most comprehensive roadmap published to date by the International Electronics Manufacturing Initiative (iNEMI). The complete roadmap report is available here. The document, created by individuals representing all aspects of the electronics manufacturing supply chain.

The roadmap identifies major trends in the evolution of thermal management technology, with an emphasis on identifying potentially disruptive events (business and technology). It provides the information needed to identify critical technology and infrastructure gaps, prioritize R&D needs to meet those gaps, and initiate activities that address industry needs.

Through its roadmaps, iNEMI charts future opportunities and challenges for the electronics manufacturing industry. These widely utilized roadmaps:

  • Help OEMs, EMS providers and suppliers prioritize investments in R&D
     and technology deployment

  • Influence the focus of university-based research

  • Provide guidance for government investment in emerging technologies

Due to cost pressures in high volume applications, personal computers and consumer electronics, aluminum and copper heat sinks with air forced or natural air circulation continue to dominate in terms of unit volume. Higher performance electronics in smaller packages is forcing designers and manufacturers to consider phase change and liquid cooling techniques. Increasingly there is a recognition that reducing system power (power-in, heat out) will not only reduce the demands on thermal management technologies, it will also result in direct and indirect energy savings.  This is leading to design practices with a closer look at the sources of heat in electronic devices.  

In the 2009 Roadmap we recognized that manufacturers were turning to changes in CPU design to lower the thermal impact of higher performance devices; multi-core CPU’s being an example of this strategy. Component packaging is also recognized as a limiting factor in performance. In this Roadmap we recognize the importance of Power Electronics due to the growing needs of electric transportation, renewable energy, and the smart grid. Cost and time-to-market continue to play a critical role in maintaining competitiveness for all product sectors.


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