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CAD $132.06 IPC MI 660 Incoming Inspection of Raw Materials Manual

IPC-MI-660 contains background information, applicable specification references and industry-approved test methods for inspection and evaluation of incoming raw materials. Material categories include laminates, multilayer board materials, various...
CAD $521.85 IPC C 107 Printed Board Materials Standards Collection

With global materials restrictions adding to all the different recipes used in manufacturing board laminate, board specifiers and manufacturers need all the tools available. This collection of 19 documents contains the requirements for the various...
CAD $99.05 IPC 4104 Specifications for High Density Interconnect (HDI) and Microvia Materials

IPC-4104 covers the various conductive and dielectric materials that can be used for the fabrication of HDI and microvias. The 23 specification sheets included in IPC-JPCA-4104 cover the qualification and conformance requirements for such materials...
CAD $55.38 IPC DD 135 Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules

IPC-DD-135 standard includes qualification and requirements for deposited organic interlayer dielectric materials for MCM-D applications. This standard enables a vendor to evaluate dielectric materials and express properties in a uniform format...
CAD $60.71 IPC CF 152B Composite Metallic Materials Specification for Printed Wiring Boards

IPC CF 152B covers the requirements for copper-invar-copper (CIC), copper-molybdenum- copper (CMC) and three-layer composites for use in electronic applications. IPC-CF-152B includes specification sheets, which outline engineering and performance...
CAD $87.33 IPC 4821 Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

IPC-4821 document describes materials that can be used for the fabrication of embedded passive capacitor devices within the finished printed circuit board substrate. For this document, embedded passive devices and the phrase embedded passives are...
CAD $87.33 IPC 4811 Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards

This document describes materials that can be used for the fabrication of embedded passive resistor devices within the finished printed circuit board substrate. It provides information on general designations and associated characteristics of...
CAD $99.05 IPC 4101B Specification for Base Materials for Rigid and Multilayer Printed Boards Includes Amendments 1 and 2

This specification covers the requirements for base materials (laminate and prepreg) for rigid or multilayer printed boards for electrical and electronic circuits. This document contains more than 50 specification sheets and now uses search terms to...
CAD $55.38 IPC 4130 Specification and Characterization Methods for Nonwoven "E" Glass Mat

IPC-4130 determines the nomenclature, definitions and requirements for materials made from nonwoven "E" glass fibers. IPC-4130 also includes specification sheets for selecting and purchasing these materials. 14 pages. Released September 1998...
CAD $55.38 IPC TP 1115 Selection and Implementation Strategy for A Low Residue No Clean Process

IPC-TP-1115 provides direction to electronics manufacturers interested in adopting low residue (LR) no-clean assembly technology. It addresses the concerns of transitioning from operations with post solder cleaning and no-clean using standard...
CAD $55.38 IPC DR 572A Drilling Guidelines for Printed Boards

This document provides guidelines for generating good quality holes in printed circuit boards (PCBs) made from a wide variety of materials. It addresses the following topics: Drill Bits, Tooling, Drilling Stacked Materials, Drilling Machines,...
CAD $101.18 Requirements for Soldered Electrical and Electronic Assemblies

J-STD-001E is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for lead free manufacturing, in addition to easier to understand criteria for materials, methods...
CAD $66.03 IPC 4204 Flexible Metal Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

IPC-4204 covers the requirements for metal-clad dielectric film materials to be used in the fabrication of flexible printed circuitry and flexible flat cable. IPC-4204 includes the specification sheets for the metal-clad dielectric film materials,...
CAD $55.38 IPC J STD 609 Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Pb Free and Other Attributes

IPC-J-STD-609 standard provides a marking and labeling system that aids in assembly, rework, repair and recycling and provides for the identification of those assemblies that are assembled with lead-containing or lead free solder, components that...
CAD $87.33 Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages

IPC-J-STD-030 document provides users of underfill material with guidance in selecting and evaluating underfill material. Underfill material is used to increase reliability of electronic devices by two methods: alleviate CTE mismatch (between...
CAD $66.03 IPC 4203 Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films

IPC-4203 covers the requirements for adhesive coated dielectric film materials to be used for the cover sheets and flexible adhesive bonding films used in the fabrication of flexible printed circuitry and flexible flat cable. IPC-4203 includes the...

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