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Did you mean to browse one of the following categories instead? Workforce Training Products > Circuit Board Fabrication , Semiconductor Manufacturing > Wafer Fabrication Plants, Semiconductor Manufacturing > Wafer Fabrication Equipment and Materials, Workforce Training Products

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CAD $66.03 IPC 4204 Flexible Metal Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

IPC-4204 covers the requirements for metal-clad dielectric film materials to be used in the fabrication of flexible printed circuitry and flexible flat cable. IPC-4204 includes the specification sheets for the metal-clad dielectric film materials,...
CAD $55.38 IPC D 422 Design Guide for Press Fit Rigid Printed Board Back Planes

IPC-D-422 contains backplane design information from the fabrication and assembly perspective. Includes sections on design and documentation; fabrication; assembly; repair; and inspection. 17 pages. Revised September 1982.
CAD $66.03 IPC CH 65A Guidelines for Cleaning of Printed Boards and Assemblies

IPC-CH-65A a road map for current and emerging cleaning issues in the electronics industry. This handbook includes description and discussion of various cleaning methods. It explains the relationship between materials, processes and contaminants in...
CAD $55.38 IPC 4110 Specification and Characterization Methods for Non Woven Cellulose Based Paper for Printed Boards

IPC-4110 determines the nomenclature, chemical and physical requirements of paper made from cellulose fibers for PWB fabrication. IPC-4110 also includes specification sheets for selecting and purchasing these materials. 11 pages. Released...
CAD $55.38 IPC D 322 Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes

IPC-D-322 defines guidelines for choosing sizes of printed wiring boards using standard fabrication panel sizes. 4 pages. Reaffirmed September 1991.
CAD $55.38 IPC D 325A Documentation Requirements for Printed Boards

IPC-D-325A establishes the general requirements for documentation necessary to fully describe end product printed boards, regardless of raw material, special fabrication requirements, layer count or end product usage. Includes master drawing...
CAD $93.72 IPC J STD 013 Implementation of Ball Grid Array and Other High Density Technology

This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance-high pin count IC packages. Includes information on design principles, material selection, board...
CAD $99.05 IPC 4104 Specifications for High Density Interconnect (HDI) and Microvia Materials

IPC-4104 covers the various conductive and dielectric materials that can be used for the fabrication of HDI and microvias. The 23 specification sheets included in IPC-JPCA-4104 cover the qualification and conformance requirements for such materials...
CAD $87.33 IPC TR 585 Time, Temperature and Humidity Stress of Final Board Finish Solderability Single User CD ROM

IPC-TR-585 Technical Report details the investigations into identifying stress tests that distinguish between robust and non-robust surface finishes. A robust finish will pass a test for solderability whereas a non-robust finish will fail. The...
CAD $55.38 IPC 7525A Stencil Design Guideline

IPC-7525A document provides guidelines for the design and fabrication of stencils for solder paste and surface-mount adhesive. Stencil design for various surface-mount technology, as well as mixed technology with through-hole or flip chip components...
CAD $303.53 IPC PWBADV CD A PWB Advanced Designer Certification Study Guide on CD ROM

The IPC Advanced PWB Designer Certification Study Guide establishes the criteria and provides all necessary information to prepare designers for the IPC Advanced PWB Designer Certification Exam. This study guide covers all 10 sections of the exam:...
CAD $159.75 IPC PWBADV SGA PWB Advanced Designer Certification Study Guide

The IPC Advanced PWB Designer Certification Study Guide establishes the criteria and provides all necessary information to prepare designers for the IPC Advanced PWB Designer Certification Exam. This study guide covers all 10 sections of the exam:...
CAD $87.33 IPC 4811 Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards

This document describes materials that can be used for the fabrication of embedded passive resistor devices within the finished printed circuit board substrate. It provides information on general designations and associated characteristics of...
CAD $66.03 IPC 4203 Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films

IPC-4203 covers the requirements for adhesive coated dielectric film materials to be used for the cover sheets and flexible adhesive bonding films used in the fabrication of flexible printed circuitry and flexible flat cable. IPC-4203 includes the...
CAD $76.68 IPC 2511A Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer Methodolgy

Revision A of IPC-2511 identifies the generic requirements for implementation of product manufacturing description data and transfer. IPC-2511A helps users transfer design requirements and manufacturing expectations from computer-aided design...
CAD $87.33 IPC 4821 Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

IPC-4821 document describes materials that can be used for the fabrication of embedded passive capacitor devices within the finished printed circuit board substrate. For this document, embedded passive devices and the phrase embedded passives are...

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