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CAD $97.98 IPC 9850 Surface Mount Placement Equipment Characterization Single User CD ROM (with support files)

IPC-9850 standard has been developed to standardize the parameters, measurement procedures, and the methodologies used for the specification, evaluation, and continuing verification of assembly equipment characterization parameters. It...
CAD $55.38 IPC A 311 Process Controls for Phototool Generation and Use

IPC-A-311 covers the information and data to be collected during the generation and use of phototools to improve artwork quality, thereby improving yields downstream. It also helps establish and maintain ISO 9000 certification and SPC by...
CAD $55.38 IPC TP 1114 The Layman's Guide to Qualifying a Process to J STD 001

Originally developed for J-STD-001B, it is also applicable to current assembly standards. Electronics manufacturers are faced with the difficult task of proving that a candidate manufacturing process can produce acceptable hardware, either to the...
CAD $76.68 IPC 9199 Statistical Process Control (SPC) Quality Rating

IPC-9199 document is a tool for a customer or supplier organization's internal audit group to assess a statistical process control (SPC) system against the requirements of IPC-9191. This document should be used by customers and suppliers of any size...
CAD $76.68 IPC 9191 General Guidelines for Implementation of Statistical Process Control (SPC)

IPC-9191 reflects the principals of statistical process control (SPC) represented by ISO-DIS 11462-1, Guidelines for Implementation of Statistical Process Control (SPC) - Part 1: Elements of SPC. This document outlines the SPC philosophy,...
CAD $109.70 IPC 7095B Design and Assembly Process Implementation for BGAs

Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095B delivers useful and practical information to anyone currently using...
CAD $55.38 IPC TP 1115 Selection and Implementation Strategy for A Low Residue No Clean Process

IPC-TP-1115 provides direction to electronics manufacturers interested in adopting low residue (LR) no-clean assembly technology. It addresses the concerns of transitioning from operations with post solder cleaning and no-clean using standard...
CAD $55.38 IPC 9194 Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline

IPC-9194 guideline standard is intended to aid in interpretation of the requirements in IPC-9191,General Guidelines for Implementation of Statistical process Control, specifically for printed board assembly (PBA) manufacture. This document and...
CAD $66.03 IPC 8413 1 Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

The purpose of this specification is to define standard practices for handling various kinds of optical fiber and to define the specifications and guidelines to be used in the design of carriers for these fibers in component manufacturing. This...
CAD $76.68 IPC DPMO 202 IPC 7912A 9261A End Item and In Process DPMO Set

Both of the industry's standards for computing DPMO are now bundled together at a reduced cost. IPC-7912, Calculation of DPMO and Manufacturing Indices for Printed Board Assemblies, is the standard for benchmarking end-item DPMO and IPC-9261,...
CAD $87.33 IPC HDBK 001 Handbook and Guide to Supplement J STD 001 (Includes J STD 001 B C D Comparisons)

This handbook provides J-STD-001 change history and cross reference support along with the previous Rev B to C content. IPC-HDBK-001 with Amendments 1 and 2 has summary listings of changes from Rev C to D and retains the original Rev B to C content...
CAD $76.68 IPC MS 810 Guidelines for High Volume Microsection

IPC-MS-810 discusses the many variables and problems associated with the process-from sample removal to micro-etch- and the variables common to high volume microsection. The process variables and problems are organized so that the reader can...
CAD $55.38 IPC J STD 075 Classification of Non IC Electronic Components for Assembly Processes

J-STD-075 picks up where J-STD-020 left off by providing test methods to classify worst-case thermal process limitations for electronic components. Classification is referenced to common industry wave and reflow solder profiles including lead-free...
CAD $55.38 IPC 7912A End Item DPMO for Printed Circuit Board Assemblies

ANSI Approved. Finally - an end to the confusion when calculating defect opportunities for benchmarking! For customers and manufacturers, it seems like every company has a unique way of calculating defects and then reporting on quality. In a complex...
CAD $55.38 IPC SA 61A Post Solder Semi Aqueous Cleaning Handbook

IPC-SA-61A handbook covers various aspects of semiaqueous cleaning such as cleaning chemicals, manufacturing residues, cleaning equipment and processes, process control, environmental considerations and safety. Enhancements over previous revision...
CAD $76.68 Guide to Solder Paste Assessment

This handbook is a companion to the solder paste standard J-STD-005 and should be considered to be a guide to help assess the applicability of a solder paste for its use in surface mount technology (SMT) processes. This document also suggests some...

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