March 3, 2015

SMT Equipment Market is Projected to Reach US$4.5 Billion by 2020

ELECTRONICS.CA PUBLICATIONS announces the availability of a comprehensive global report on Surface Mount Technology (SMT) Equipment. The global market for Surface Mount Technology Equipment is projected to reach US$4.5 billion by 2020, driven by the strong demand for electronic products and the ensuing increase in production of Printed Circuit Boards (PCBs).

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Some Questions Answered About IPC J-STD-001F and IPC A-610F

Two leading standards for the electronics assembly industry have been revised. IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies is recognized worldwide as the sole industry-consensus standard for soldering processes and materials. IPC-A-610F, Acceptability of Electronic Assemblies, is a post-assembly acceptance standard used to ensure electronics assemblies meet the most current acceptance requirements. Some significant changes to IPC-J-STD-001F and IPC-A-610F standards include: Requirements added for two new SMT terminations P-Style terminations Butt/I terminations — Solder charged terminations Revised Class 2 plated-through hole vertical solder fill requirements Revised void criteria for BGA/CSP components Revised class 2 flux activity criteria Improved language for…

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Electronics Assembly IPC Standards Collection

It takes a lot to be successful in electronics assembly. Get the reference documents you need on all aspects of the job from solder materials, component characteristics, manufacturing and quality requirements, and acceptability of the final assembly. Includes 41 key documents for SMT and through-hole assembly, including the widely used IPC-A-610, J-STD-001 and IPC-A-620.  Get the complete IPC standards collection and save 55% on individual document prices. Users can also purchase and download IPC standards from Electronics.ca Publications by following IPC specs below.

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Identifying Emerging and Disruptive Technologies – 2015 Roadmap

The iNEMI Roadmap has become recognized as an important tool for defining the “state of the art” in the electronics industry as well as identifying emerging and disruptive technologies.  It also includes keys to developing future iNEMI projects and setting industry R&D priorities over the next 10 years. The 2015 Roadmap was developed by five Product Emulator Groups (PEGs) and 19 Technology Working Groups (TWGs). There is one additional chapter on Test, developed in 2013, also included.  The PEGs and TWGs are defined below. The TWGs responded to the inputs and requirements outlined by representatives of OEMs in the five…

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IPC-CH-65B Electronics Assembly & PCB Cleaning Guidelines

It’s well-known that residues on printed board assemblies can lead to serious reliability problems. Over the past several years the migration from the use of lead-bearing materials to lead-free materials has resulted in many changes in electronics manufacturing operations. Some of the residual materials that remain on the circuit card assembly are becoming increasingly more problematic to clean. Component densities and component under-clearances are creating new cleaning challenges. To help the process engineering community deal with these difficulties, IPC has released the B revision of IPC-CH-65, Guidelines for Cleaning of Printed Boards & Assemblies.  With guidance from industry experts, the…

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New Electronics Assembly Standards IPC J-STD-001F and IPC-A-610F Revisions Cover More Advanced Technologies

Electronics Assembly Standards IPC J-STD-001 and IPC-A-610 Updated ‘F’ Revisions Cover More Advanced Technologies  IPC — Association Connecting Electronics Industries® has released the F revisions of two of the industry’s most widely used standards,  IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610 Acceptability of Electronics Assemblies. The documents have been updated to include technical advances in solder on plastic surface mount (SMT) components, new criteria for P-style and solder-charged Butt/I SMT terminations, a change to void criteria for BGAs, and enhancements to the language within the documents to provide ease of use and clarity. New photos facilitate further understanding….

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North American Electronics Sales Growth Flat but Outlook is Positive

As of November 2014, sales growth was flat in the bare printed circuit board (PCB) and electronics manufacturing services (EMS) segments of the electronics industry, in sharp contrast to semiconductor sales that continued to skyrocket. U.S. new orders for electronics products, which tend to lead sales by about one month, continued to sag. IPC’s PCB book-to-bill ratio, which normally leads PCB sales by three to six months, climbed further to 1.06 in November after hovering around 1.00 during most of 2014. Ratios above parity (1.00) indicate greater demand than supply, which may be a precursor of strengthening sales growth in…

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IPC A-610 PDF Download – Acceptability of Electronic Assemblies

IPC-A-610F is the latest revision of the most widely used electronics assembly standard in the world. IPC A-610F  is now available from Electronics.ca Publications.  A must for all quality assurance and assembly departments, IPC-A-610F illustrates industry-accepted workmanship criteria for electronics assemblies through full-color photographs and illustrations. Topics include flex attachment, board in board, part on part, lead free, component orientation and soldering criteria for through-hole, SMT (new termination styles) and discrete wiring assemblies, mechanical assembly, cleaning, marking, coating, and laminate requirements. IPC-A-610F is invaluable for all inspectors, operators and trainers. Revision E has 809 photos and illustrations of acceptability criteria-165…

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New IPC Standards For Printed Circuit Boards

NEW IPC-A-610F Acceptability of Electronic Assemblies IPC-A-610 is the most widely used standard for circuit board production in the world. IPC-A-610F illustrates acceptability requirements for electronic assemblies with over 814 colour images and illustrations. Topics include flex attachment, board in board, part on part, lead free, component orientation and soldering criteria for through-hole, SMT (new termination styles) and discrete wiring assemblies, mechanical assembly, cleaning, marking, coating, and laminate requirements. This revision F includes two new SMT termination styles, and changes in plated-through hole fill and BGA void criteria. Major topics include flex attachment, board-in-board, part-on-part, both lead-free and tin-lead criteria, component…

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IPC/WHMA-A-620B PDF Download – Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC/WHMA-A-620 is a collection of visual Quality Acceptability Requirements for Cable, Wire and Harness Assemblies.  IPC/WHMA-A-620 can be used as a stand-alone document for purchasing products, however it does not specify frequency of in-process inspection or frequency of end product inspection. No limit is placed on the number of process indicators or the number of allowable repair/rework of defects. Such information should be developed with a statistical process control plan (see IPC-9191).

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