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DoD Adopted! IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610F illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable and defect conditions, supported by full-color photographs and illustrations. This lates revision, IPC A-610F includes two new SMT termination styles, as well as changes in plated-through hole fill and BGA void criteria. Additionally, wherever possible statements were modified to make readability easier and to enhance understanding — all without eliminating any requirements.
Major topics include flex attachment, board-in-board, part-on-part, both lead-free and tin-lead criteria, component orientation and soldering criteria for through hole, SMT, cleaning, marking, coating and laminate requirements.
IPC-A-610 is invaluable for all inspectors, operators and trainers. Revision F has 814 photos and illustrations of acceptability criteria — 86 of them new or updated. The document synchronizes to the requirements expressed in other industry consensus documents and is most often used with the material and process standard IPC J-STD-001.
For a more complete understanding of this document’s recommendations and requirements, one may use this document in conjunction with IPC-HDBK-001, IPC-AJ-820, and IPC J-STD-001.
IPC-A-610 is also included in the IPC-C-103 & the IPC-C-1000 Collections.
PLEASE NOTE: Revision "F" is availbale in English language only at this time. IPC 610F in Spanish, French, Russian, German, and Chinese will be available in 2015. We will notify you as soon this publication becomes available in your language if you submit your request. Thank you.