Semiconductor Manufacturing :: Test Assembly and Packaging -

Test Assembly and Packaging

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Title	Product code	Price
Global and China Advanced Packaging Industry Report 2012-2013	ISBN / SKU #: RIC1284	US$2,500.00	Select options
The Worldwide IC Packaging Market	ISBN / SKU #: NVR1740	US$3,495.00	Select options
Metrology, Inspection, and Process Control in VLSI Manufacturing	ISBN / SKU #: TIN8900	US$2,495.00	Add to Cart
High-Density Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends	ISBN / SKU #: TIN9000	US$2,495.00	Add to Cart
3-D TSV: Insight On Critical Issues And Market Analyses	ISBN / SKU #: TIN9700	US$2,495.00	Add to Cart
Thin-Film Integrated Passive Devices (IPDs)	ISBN / SKU #: YD2485	US$5,390.00	Select options
Equipment and Materials for 3D IC and Wafer-Level-Packaging	ISBN / SKU #: YD4822	US$5,390.00	Select options
Advanced IC Packaging, Technologies, Materials and Markets	ISBN / SKU #: NVR6085	US$3,495.00	Select options
2013 LED Packaging	ISBN / SKU #: YD8741	US$7,990.00	Add to Cart
FOWLP & Embedded Die Packages	ISBN / SKU #: YD2485	US$5,390.00	Select options
Wafer Packaging Fab Database	ISBN / SKU #: YD3791	US$5,390.00	Select options
3D Glass & Silicon Interposers	ISBN / SKU #: YD5980	US$5,390.00	Select options

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