Wafer Fabrication Costs Model and Equipment Requirements

2014 Strategic Cost Model (Equipment Edition)

IC Knowledge, Date of Publication: Sep 2, 2014




The 2014 Strategic Cost Model - new version - Beta 07b is now available. DRAM, Foundry, IDM and some 2D and 3D NAND coverage is now fully implemented.

The IC Knowledge - Strategic Cost Model takes the top three companies in each of four segments and provides a detailed look at all of their current and past processes on 300mm and forward forecasts out to the next decade.

Specifically the model covers: DRAM - Samsung, Micron and SK Hynix, Foundry - TSMC, Global Foundries, Samsung, IDM Logic - Intel MPU, IBM Internal processor, ST Micro, NAND - Samsung, Toshiba, SK Hynix in each case with 2D and 3D coverage.,

In each case we present a detailed introduction date, general process's details, process flows in order, pitch by layer and node, mask layers, multi patterning usage and total masks. Process blocks, pitch and multi patterning can be edited for each case.

For each target company and process every 300mm fab they have is predefined so that if you juts pick a fab the fab details and supported processes are pre defined (although you can override them) and detailed outputs of equipment and materials requirements are provided.

Supported processes

The Model supports DRAM out to 1x nm, Foundry and IDM logic out to 5nm and NAND in 2D out to 1z as well as 3D.

Supported wafer sizes

300mm (current) and 450mm.(next revision)

Supported cost elements

Wafer cost only.

Who should buy this product

The IC Knowledge - Strategic Cost Model - is in use at many large IDMs, Consortia and OEMS forward projecting markets and costs as the industry implements the ITRS and 450mm.

Recent revisions

Revision - Beta 07 - added Samsung - NAND - 2D. Adjusted BOM values for CVD precursors and bulk and Litho gases. Adjusted selected OEE values.

Revision - Beta 07a - fixed an error in the high-k inter poly dielectric for Flash block. Added Toshiba - NAND - 2D. Fixed an error where the wafer yield wasn't updating. Corrected default multi patterning errors for Samsung and ST Micro. Fixed bug where the NAND processes weren't showing as options on the 'Main Selection' sheet. Fixed errors where 95nm, 75nm, 66nm, 58nm, 44nm, 43nm and 35nm reticle pricing was undefined. Updated labor and utility rates. Added Turkey and India as country options. Fixed a bug where Ireland labor and utility rates were not defined. Adjusted GeH4 and Ge2H6 usage.

Revision - Beta 07b - added two more blank sheets for user customization. Fixed errors in the dropdowns for substrate and process blocks on the IBM, Samsung Foundry and ST Micro sheets. Adjusted the Samsung 2D NAND process based on new information. Fixed an error in the scatterometry usage calculation. Adjusted TSMC 28nm and 20nm half-pitch. Pushed out Intel adoption of a Ge PMOS fin to 10nm and InGaAs NMOS fin to 7nm. Pushed out Ge PMOS fins to 7nm and InGaAs NMOS fins to 5nm for all other logic producers. Adjusted TSMC's 28nm Gate First High K process. Added Samsung 3D NAND. Updated multipatterning resolution limits. Implemented an improved method for flagging NGL process blocks that don't have complete cost information. Updated resolution limits for ArF and ArFi processes and NGL limits. Updated multi-pattering usages. Changed NAND pitch to uncontacted poly pitch. Added 2D NAND Source Line damascene W contacts. Removed Samsung 20nm foundry process, Samsung is skipping 20nm. Adjusted foundry introduction dates and pitches. Added metrology and inspection to NGL block costs. Adjusted dry etch throughputs. Added a cost per block sheet. Added an equipment cost by node sheet to make the data user visible and editable. Modified the equipment purchase sheet to pull values form the 'Equipment Cost' sheet and removed the ability to override equipment costs (costs can be overridden on the 'Equipment Cost' sheet). Fixed a step description error on the 'Process blocks' sheet (damascene processes do not change from PVD to ALD based on linewidth, they are set based on metallization schemes). Fixed a bug where turning on EUV for an upgrade could over count the number of tools. Adjusted CVD trhoughputs. Adjusted carbon usage for multi pattering. Split tracks and expsoure for lithography. Added Samsung Line 17. Adjusted OEE values. Adjusted Intel 14nm pitches, and multipatterning usage. Adjusted ST Micro 14nm metal pitches. Adjusted IBM 10nm porcess based on recent disclosures. Set Micron Fab 7 to NA after 2013 because it was convrted to NAND.

System Requirements

The Model runs inside of Microsoft Excel and requires the user to have Excel 2010 installed on their computer. The are are known compatibility issues with Excel 2007 and Open Office and any third party Excel compatible product.

Model Cost and How to Buy

A single user license allows one user on one computer and is $5,000, an enterprise license allowing an unlimited number of users at a company is $12,000.  The model is delivered by email within a few hours of our receiving an order. The model cost includes twelve months of updates plus twelve months of reasonable levels of phone and email support. A Web Ex training session is available on request. Renewal costs at the end of twelve months are discounted 1/3 off the current prices.

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Sep 2, 2014
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