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Wafer Fabrication Costs Model and Equipment Requirements

2014 Strategic Cost Model (Equipment Edition)

IC Knowledge, Date of Publication: Jun 9, 2014




The IC Knowledge - Strategic Cost Model takes the top three companies in each of four segments and provides a detailed look at all of their current and past processes on 300mm and forward forecasts out to the next decade.

Specifically the model covers: DRAM - Samsung, Micron and SK Hynix, Foundry - TSMC, Global Foundries, Samsung, IDM Logic - Intel MPU, IBM Internal processor, ST Micro, NAND - Samsung, Toshiba, SK Hynix in each case with 2D and 3D coverage.

In each case we present a detailed introduction date, general process's details, process flows in order, pitch by layer and node, mask layers, multi patterning usage and total masks. Process blocks, pitch and multi patterning can be edited for each case.

For each target company and process every 300mm fab they have is predefined so that if you juts pick a fab the fab details and supported processes are pre defined (although you can override them) and detailed outputs of equipment and materials requirements are provided.

To request a WebEx demo please contact us.

Supported processes

The Model supports DRAM out to 1x nm, Foundry and IDM logic out to 5nm and NAND in 2D out to 1z as well as 3D.

Supported wafer sizes

300mm (current) and 450mm.(next revision)

Supported cost elements

Wafer cost only.

Who should buy this product

The IC Knowledge - Strategic Cost Model - is in use at many large IDMs, Consortia and OEMS forward projecting markets and costs as the industry implements the ITRS and 450mm.

Recent revisions

Revision - Beta 01 - completely new build from the ground up. Company and node based instead of ITRS and half-pitch based. This revision does not include DRAM, NAND or 450mm.

Revision - Beta 02 - added data, process, capacity and wafer size to the 'Equipment Purchases' sheet. Added the process to the 'Equipment Counts' sheet. Fixed a problem with the dropdowns on the 'Equipment Counts' and 'Equipment Purchases' sheets. Fixed a labeling problem on the masks graph on the product company/product sheets. Added a blank sheet to allow users to make notes and store values. Added ALD - CPCobalt and CCTBA, CVD - DEMS and ATRP, ALD -user, CVD - user, Dry Etch - user and PVD - user as materials types. Added DmsnCu/Cu/TaN/Co and DDmsnCu/Cu/TaN/Co, SiO2/SIN, SiCOHp/SiC, SiCOHp/SiOCN, CapCo, CapCoWP and Cap SiN/Co blocks. Added ALD - Co cap, CVD - SiCOHp and ALD - Cu/TaN/Co process steps. Made the step descriptions on the 'Process Blocks' sheet user editable and added two blank user rows to each block. Added Samsung, Micron and SK Hynix DRAM sheets (Please note these sheets are not active yet). Fixed an error where DmsnCu/CuMg/Co/TaN and DDmsnCu/CuMg/Co/TaN blocks weren't being counted. Added ALD - Co/TaN step. Made it so users can edit litho steps on the 'Process Step' sheet. Made the category selection on the 'Materials Summary' sheet user editable. Added a 'Materials Summary' equals 'Bill Of Materials' error check. Added a cost per wafer column to the 'Cost Per Step' sheet. Added and or updated selected material prices. Added the ability to override the wafer yield on the 'Defaults' sheet. Changed the formats on the products pages so if a pitch isn't defined for a mask layer that is used in the process the cell turns red. Changed the formats on the products pages so if the layer type isn't defined for a layer with an NGL pitch the cell turns red. Fixed several errors in the lithography calculations. Added a cost column to the 'NGL Options' sheet. Added comments to the 'Process Blocks' sheet that describe each block.

Revision - Beta 03 - adjusted ArF exposure tool throughputs. Fixed an error in the OEE calculations.

Revision - Beta 04 - revised eSiC H2 usage. Revised COS usage. Updated implant source usages. Added DCS and TCS as materials. Fixed an error on the Intel MPU sheet where I-line was turned on for nodes where Intel doesn't use I-line. Fixed an error on the 'Process Blocks' sheet lithography counts. Fixed an error on the 'Process Steps' sheet that effected the lithography layers for the 1st upgrade. Updated selected CVD materials usages. Fixed a bug with the 'Facility" sheet where the current process wasn't always being correctly determined triggering an error message. Fixed a bug with the Intel Fab 24-1. Fixed a mask layer count error for the Poly/2TiN/2HK block. Made the NGL limits user editable.

System Requirements

The Model runs inside of Microsoft Excel and requires the user to have Excel 2010 installed on their computer. The are are known compatibility issues with Excel 2007 and Open Office and any third party Excel compatible product.

Model Cost and How to Buy

A single user license allows one user on one computer and is $5,000, an enterprise license allowing an unlimited number of users at a company is $12,000.  The model is delivered by email within a few hours of our receiving an order. The model cost includes twelve months of updates plus twelve months of reasonable levels of phone and email support. A Web Ex training session is available on request. Renewal costs at the end of twelve months are discounted 1/3 off the current prices.

Related Products

Discrete and Power Products Cost and Price Model  - easily calculate the cost and price of most high power silicon integrated circuits and discrete devices.

IC Cost and Price Model  - easily calculate the cost and price of most low power silicon integrated circuits.

MEMS Cost Model  - easily calculate the cost of most MEMS products.

Strategic Cost Model - Materials Edition - easily project wafer cost, equipment and materials requirements for the next 15 years based on the ITRS.


Jun 9, 2014
Excel File via E-mail

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