July 23, 2014

Market Snapshot:

Growth in Electronics Production by Country -

Thursday, July 10, 2014

The U.S. UAV Market Will Grow to $15 Billion in 2020 -

Thursday, July 3, 2014

Wireless M2M & IoT Market Opportunities Report -

Wednesday, May 28, 2014

MEMS Microphone Market Report -

Wednesday, April 2, 2014

Wireless Sensor Networks (WSN) Market Report -

Monday, March 24, 2014

Smart Sensors Industry Report 2014 -

Thursday, March 20, 2014

The CMOS Image Sensors Market Report -

Monday, January 20, 2014

Thin Layer Deposition Equipment Market Report

Global Thin Layer Deposition Equipment Market is projected to reach US$18.5 billion by 2018, driven by emerging applications in medical imaging devices, specialty packaging and industrial coatings.

Defined as the building block of miniaturization and MEMS processing, thin layer deposition is a critical part of the fabrication process and is key to the production of all electronic devices. With surface treatment applications ranging from electronic components, electronic displays, optical coatings, optical data storage devices to antistatic coatings, thin layer deposition is expected to witness strong growth in the coming years. A significant portion of the growth is expected to stem from the robustly growing electronics industry. Developments in equipment design and performance, innovations in thin film materials and processes will also help spur growth. Typically, demand for Thin Film Deposition (TFD) equipment is largely tied to the demand for semiconductors, electronics, and medical devices, among others. Periods of economic slowdown tend to curtail consumer spending thus impacting business opportunities in this market. The capital intensiveness of the industry also makes investments a cyclical pattern with growth occurring largely during periods of intermittent revolutionary technology developments.

The Atomic Layer Deposition (ALD) Equipment is set to witness considerable demand in the short to medium term period, with ALD process finding large-scale adoption in several end-use application areas. For long, ALD process has been utilized to generate thin films with different compositions such as nitrides, oxides, pure metals, and carbides among others. The hallmark of this technology is its ability to produce monolayers on a molecular or atomic scale thus making it highly suitable for deposition of nanofilms with thickness less than 100 nanometers on various surfaces, including polymers, metals and ceramics. ALD equipment is expected to witness increased adoption as a manipulation and fabrication tool in nanotechnology. Furthermore, the ALD equipment market is projected to witness increasing demand from non-IC and IC applications. A marked trend towards miniaturization of components is also driving the market, given the technology’s proven efficiency in fabrication of smaller size components. Also, with semiconductor fabricators expected to invest in new manufacturing equipment, the market is forecast to witness tremendous opportunity in the coming years. ALD equipment will also find increased adoption in production of other advanced devices such as organic light-emitting diodes (OLEDs).

As stated by the new market research report on Thin Layer Deposition Equipment, Asia-Pacific represents the largest and the fastest growing market with a projected CAGR of 4.9% over the analysis period. PVD equipment represents the largest product market. Over the years, PVD equipment makers have diversified into a variety of high volume, low cost applications such as information storage, optics, medical instruments, industrial coatings, automotive and aerospace components and specialty/flexible packaging.

Major players covered in the report include AIXTRON SE, Applied Materials Inc, ASM International N.V., Canon ANELVA Corporation, CHA Industries Inc., CVD Equipment Corporation, Denton Vacuum LLC, Edwards Limited, Ionbond AG, Jusung Engineering Co., Ltd., KDF Electronic & Vacuum Services Inc., Kokusai Semiconductor Equipment Corporation, Lam Research Corporation, RIBER SA, Seki Diamond Systems, Silicon Genesis Corporation, SPTS Technologies, Ti-Coating Inc., Tokyo Electron Limited, Taiyo Nippon Sanso Corporation, ULVAC Technologies Inc., Vapor Technologies Inc., Veeco Instruments Inc.

The research report titled “Thin Layer Deposition Equipment Business Report”, provides a comprehensive review of market trends, issues, drivers, company profiles, mergers, acquisitions and other strategic industry activities. The report provides market estimates and projections in US$ for all major geographic markets including the United States, Canada, Japan, Europe (France, Germany, Italy, UK, Spain, Russia and Rest of Europe), Asia-Pacific (China, South Korea, Taiwan and Rest of Asia-Pacific), Latin America (Brazil & Rest of Latin-America) and Rest of World. Technology markets analyzed include Physical Vapor Deposition (PVD) and Chemical Vapor Deposition (CVD).

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