Archive | New Releases in Technology & Market Research

Online resource for market research reports, hot new releases in technology books, market studies and best research suppliers in the electronics and semiconductor industry

IPC-4101D-WAM1 Brings Significant Changes and Clarifications

If you need the most current specifications for PCB materials used in rigid or multilayered printed boards, then it is time to upgrade to IPC-4101D-WAM1. This newly revised standard brings critical updates to the already valuable IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards. (more…)

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ZigBee Standards Will Be Used in Over 80% of 802.15.4 Chipset Shipments in 2020

ELECTRONICS.CA PUBLICATIONS, the electronics industry market research and knowledge network, announces the availability of a new report entitled “ZigBee Lights Up the Internet of Things: A Market Dynamics Report“.  New research finds that annual shipments of IEEE 802.15.4 chipsets nearly doubled last year and will increase by 550% over the next five years. In 2020, ZigBee […]

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Military Communications Market: A $40 Billion Opportunity

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “The Military Communications Market: 2015 – 2030 – Opportunities, Challenges, Strategies & Forecasts”. According to this study, the military communications market will account for over $40 Billion in revenue by 2020. Armed forces throughout the globe rely on communication systems to enable information sharing and securely stay […]

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Electronics Assembly IPC Standards Collection

It takes a lot to be successful in electronics assembly. Get the reference documents you need on all aspects of the job from solder materials, component characteristics, manufacturing and quality requirements, and acceptability of the final assembly. Includes 41 key documents for SMT and through-hole assembly, including the widely used IPC-A-610, J-STD-001 and IPC-A-620.  Get […]

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IPC-CH-65B Electronics Assembly & PCB Cleaning Guidelines

It’s well-known that residues on printed board assemblies can lead to serious reliability problems. Over the past several years the migration from the use of lead-bearing materials to lead-free materials has resulted in many changes in electronics manufacturing operations. Some of the residual materials that remain on the circuit card assembly are becoming increasingly more […]

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IPC Working Group Focuses on Nuances of Conformal Coating

As products get smaller and denser, factors that used to be fairly easy to deal with can become areas of concern. Conformal coatings are getting increased interest now as usage grows and the quality of coatings comes under more scrutiny. These coatings have typically been applied and examined using a range of related standards. For […]

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IPC-8701 – First Manufacturing Acceptability Standard for Photovoltaic (Solar) Module Assemblies Debuts

IPC-8701 Acceptability specs will help provide infrastructure for solar panel assembly Solar panels have been in volume production for quite some time, but there are still just a limited number of standards to help original equipment manufacturers (OEMs) and electronics manufacturing service (EMS) companies determine whether completed modules meet design and assembly requirements. IPC recently published […]

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