To achieve a high quality end product and maintain a competitive position in the marketplace, you need to infuse quality throughout the manufacturing process.
Did you know there is an IPC standard associated with nearly every step of printed circuit board production and assembly? From design and purchasing to assembly and acceptance, Electronics.ca Publications offers IPC Standards to help you assure superior quality, reliability and consistency in the electronic assemblies that go into your product. Download IPC Standards Spec Tree – PDF file.
As with the manufacturing process — which uses a step-by-step approach – IPC standards also build upon one another. To achieve your desired results, it’s important to implement the appropriate IPC standards associated with each step of production.
Why Use IPC Standards in Your Manufacturing Process?
- Gain Control Over End Product Quality and Reliability — Quality and reliability are the cornerstones of competing in the marketplace and critical to your company’s reputation and profitability. By implementing IPC standards throughout the manufacturing process, you help ensure better performance, longer life and compliance with lead-free regulations.
- Improve Communication with Suppliers and Employees — IPC standards are the standards that your competitors, suppliers and EMS providers use. Working from an established IPC standard helps all of you to “speak the same language” — the language of the global electronic industry. In addition, using IPC standards eliminates confusion for employees, because they know they need to perform to an established industry standard.
- Help Contain Costs — Ensuring that your design and the bare boards you purchase comply with IPC standards allows you to produce electronic assemblies that meet stringent quality tests down the line, minimizing costly delays, rework and scrap.
The Most Popular IPC Documents
IPC A-610F – Acceptability of Electronic Assemblies
IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments.
IPC J-STD-001F – Requirements for Soldered Electrical and Electronic Assemblies
J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies has emerged as the preeminent authority for electronics assembly manufacturing. The standard describes materials, methods and verification criteria for producing high quality soldered interconnections. The standard emphasizes process control and sets industry-consensus requirements for a broad range of electronic products. This revision now includes support for lead free manufacturing.
IPC A-620B – Requirements and Acceptance for Cable and Wire Harness Assemblies
Revision B is now available for the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies.
Now updated to Revision D of the latest IPC-A-610E and J-STD-001E – our Training & Reference Guide illustrates critical acceptance criteria for the evaluation of through-hole solder connections.
Useful as a training aid in the classroom or on the shop floor, DRM-SMT-E contains computer generated color illustrations of Chip component, Gull Wing and J-Lead solder joints.
J-STD-033 Provides Surface Mount Device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs.
IPC-J-STD-020D-1 standard identifies the classification levels of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress.
J-STD-075 provides test methods to classify worst-case thermal process limitations for electronic components. Classification is referenced to common industry wave and reflow solder profiles including lead-free processing.
IPC-C-103 – Electronics Assembly Standards Collection
IPC-C-1000 Essential Document Collection for Board Design, Assembly and Manufacture
IPC-C-108 Cleaning Guides and Handbooks Collection