IPC announces the release of five newly revised standards covering several areas of the supply chain, IPC/WHMA-A-620D, Requirements and Acceptance for Cable and Wire Harness Assemblies; IPC-2223E, Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards; IPC-2591-Version 1.1, Connected Factory Exchange (CFX); … Read More
IPC has announced the December 2019 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.09. Total North American PCB shipments in December 2019 were up 8.7 percent compared to the same month … Read More
Almost 90 percent of U.S. electronics manufacturers are troubled by the higher tariffs imposed by the United States and China on each other’s imports, and some are investing less in the United States and hiring fewer workers as a result. … Read More
ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “5G: What Are the Real Status and the Real Economics?“. 5G refers to a set of international standards for a new (5th) generation of mobile communications service. It is intended … Read More
BANNOCKBURN, Ill., USA, September 30, 2019 — Third-quarter 2019 results from IPC’s Pulse of the Electronics Industry global data service show that the global electronics industry continues to thrive in a positive business environment and still predicts continued growth over … Read More
In order to keep up with industry demand, IPC has released amendments for J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610F, Acceptability of Electronic Assemblies. For each standard, IPC-A-610F Amendment 1 and IPC J-STD-001F Amendment 1 represents a … Read More
BANNOCKBURN, Ill., USA, March 6, 2019 — The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM … Read More
In the next five years, Low Power Wide Area (LPWA) networking technologies such as Sigfox, LoRa®, LTE-M and NB-IoT will connect hundreds of millions of smart city sensing devices to low cost multi-kilometer cloud connected networks, according to Smart Cities … Read More
IPC-A-610G is the latest revision of the most widely used electronics assembly standard in the world. IPC A-610G is now available from Electronics.ca Publications. A must for all quality assurance and assembly departments, IPC-A-610F illustrates industry-accepted workmanship criteria for electronics … Read More
The global market for EMI and RFI Shielding Materials and Technologies is forecast to reach US$9 billion by 2024, driven by the rise in electromagnetic pollution caused by the explosive growth of mobile wireless communications and the resulting need to … Read More